Xiaolan Ba

Person

  • San Jose, CA, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-LAYER FEATURE FILL

    • Publication number 20240282580
    • Publication date Aug 22, 2024
    • LAM RESEARCH CORPORATION
    • Xiaolan BA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES

    • Publication number 20240266177
    • Publication date Aug 8, 2024
    • LAM RESEARCH CORPORATION
    • Ruopeng Deng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW RESISTANCE PULSED CVD TUNGSTEN

    • Publication number 20240006180
    • Publication date Jan 4, 2024
    • LAM RESEARCH CORPORATION
    • Yu PAN
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    EXCLUSION RING FOR SUBSTRATE PROCESSING

    • Publication number 20230260814
    • Publication date Aug 17, 2023
    • LAM RESEARCH CORPORATION
    • Vinayakaraddy Gulabal
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    TUNGSTEN DEPOSITION

    • Publication number 20220364232
    • Publication date Nov 17, 2022
    • LAM RESEARCH CORPORATION
    • Pragna NANNAPANENI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    NUCLEATION-FREE TUNGSTEN DEPOSITION

    • Publication number 20220254685
    • Publication date Aug 11, 2022
    • LAM RESEARCH CORPORATION
    • Sema ERMEZ
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    RAPID FLUSH PURGING DURING ATOMIC LAYER DEPOSITION

    • Publication number 20220186370
    • Publication date Jun 16, 2022
    • LAM RESEARCH CORPORATION
    • Pragna Nannapaneni
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES

    • Publication number 20210335617
    • Publication date Oct 28, 2021
    • LAM RESEARCH CORPORATION
    • Ruopeng Deng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-LAYER FEATURE FILL

    • Publication number 20210313183
    • Publication date Oct 7, 2021
    • LAM RESEARCH CORPORATION
    • Xiaolan Ba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FORMING LOW RESISTIVITY FLUORINE FREE TUNGSTEN FILM WITHOUT NUCLEATION

    • Publication number 20180240675
    • Publication date Aug 23, 2018
    • LAM RESEARCH CORPORATION
    • Hanna Bamnolker
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD OF FORMING LOW RESISTIVITY FLUORINE FREE TUNGSTEN FILM WITHO...

    • Publication number 20170117155
    • Publication date Apr 27, 2017
    • LAM RESEARCH CORPORATION
    • Hanna Bamnolker
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    TUNGSTEN FILMS HAVING LOW FLUORINE CONTENT

    • Publication number 20160351444
    • Publication date Dec 1, 2016
    • LAM RESEARCH CORPORATION
    • Lawrence Schloss
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEPOSITION OF LOW FLUORINE TUNGSTEN BY SEQUENTIAL CVD PROCESS

    • Publication number 20160351401
    • Publication date Dec 1, 2016
    • LAM RESEARCH CORPORATION
    • Xiaolan Ba
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ENHANCING ELECTRICAL PROPERTY AND UV COMPATIBILITY OF ULTRATHIN BLO...

    • Publication number 20160071724
    • Publication date Mar 10, 2016
    • Applied Materials, Inc.
    • Xiaolan BA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ENHANCING UV COMPATIBILITY OF LOW K BARRIER FILM

    • Publication number 20160013049
    • Publication date Jan 14, 2016
    • Applied Materials, Inc.
    • Weifeng YE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CU/BARRIER INTERFACE ENHANCEMENT

    • Publication number 20140273438
    • Publication date Sep 18, 2014
    • Weifeng YE
    • H01 - BASIC ELECTRIC ELEMENTS