Xiaomeng Chen

Person

Chung-Li city, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Simultaneous multi-bandwidth optical inspection of semiconductor de...
- Patent number 12,068,207
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure inspection using a high atomic number material
- Patent number 11,984,365
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hot spot defect detecting method and hot spot defect detecting system
- Patent number 11,900,586
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual facing BSI image sensors with wafer level stacking
- Patent number 11,894,408
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,854,795
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor arrangement with capacitor
- Patent number 11,856,750
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated photo-sensitive device with gradated buffer layer
- Patent number 11,611,005
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,282,697
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer bonding method and apparatus with curved surfaces
- Patent number 11,276,587
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for semiconductor wafer inspection and system thereof
- Patent number 11,231,376
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor arrangement with capacitor and method of fabricating...
- Patent number 11,222,896
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual facing BSI image sensors with wafer level stacking
- Patent number 11,037,978
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement having capacitor separated from active re...
- Patent number 11,037,932
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement with capacitor
- Patent number 11,011,524
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perpendicular magnetic random-access memory (MRAM) formation by dir...
- Patent number 10,998,494
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Ming Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Hot spot defect detecting method and hot spot defect detecting system
- Patent number 10,872,406
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Defect inspection method and defect inspection system
- Patent number 10,809,635
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D integrated circuit and methods of forming the same
- Patent number 10,790,189
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated photo-sensitive device with gradated buffer layer
- Patent number 10,756,222
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 10,665,449
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor arrangement with capacitor and method of fabricating...
- Patent number 10,504,904
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method and apparatus
- Patent number 10,504,756
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company
- Chih-Hui Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Perpendicular magnetic random-access memory (MRAM) formation by dir...
- Patent number 10,497,860
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Ming Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual facing BSI image sensors with wafer level stacking
- Patent number 10,453,889
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple metal layer semiconductor device and low temperature stack...
- Patent number 10,283,448
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with non-linear surface
- Patent number 10,269,575
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Xiaomeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement having capacitor separated from active re...
- Patent number 10,269,807
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated photo-sensitive device with gradated buffer layer
- Patent number 10,109,756
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit and methods of forming the same
- Patent number 10,090,196
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment systems and wafer bonding systems and methods
- Patent number 10,037,968
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD...
- Publication number 20250028253
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-FONG CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS MULTI-BANDWIDTH OPTICAL INSPECTION OF SEMICONDUCTOR DE...
- Publication number 20240363451
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL
- Publication number 20240266232
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING
- Publication number 20240178263
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOT SPOT DEFECT DETECTING METHOD AND HOT SPOT DEFECT DETECTING SYSTEM
- Publication number 20240144467
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM
- Publication number 20240087879
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS MULTI-BANDWIDTH OPTICAL INSPECTION OF SEMICONDUCTOR DE...
- Publication number 20230411223
- Publication date Dec 21, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DETECTING DEFECTS ON A WAFER AND RELATED NON-...
- Publication number 20230411224
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-CHANG WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL
- Publication number 20220301944
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Pei-Hsuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20220216052
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220208607
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Facing BSI Image Sensors With Wafer Level Stacking
- Publication number 20210305292
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR
- Publication number 20210272964
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20210151353
- Publication date May 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOT SPOT DEFECT DETECTING METHOD AND HOT SPOT DEFECT DETECTING SYSTEM
- Publication number 20210118125
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR SEMICONDUCTOR WAFER INSPECTION AND SYSTEM THEREOF
- Publication number 20210063319
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIEN-HUEI CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20210013098
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Illuminated Photo-Sensitive Device with Gradated Buffer Layer
- Publication number 20200373445
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Processing Method and Apparatus
- Publication number 20200105548
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR AND METHOD OF FABRICATING...
- Publication number 20200075600
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Facing BSI Image Sensors with Wafer Level Stacking
- Publication number 20200052014
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERPENDICULAR MAGNETIC RANDOM-ACCESS MEMORY (MRAM) FORMATION BY DIR...
- Publication number 20200028070
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Ming Chen
- G11 - INFORMATION STORAGE
Information Patent Application
Integrate Rinse Module in Hybrid Bonding Platform
- Publication number 20200006052
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOT SPOT DEFECT DETECTING METHOD AND HOT SPOT DEFECT DETECTING SYSTEM
- Publication number 20190318471
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR ARRANGEMENT HAVING CAPACITOR SEPARATED FROM ACTIVE RE...
- Publication number 20190252389
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECT INSPECTION METHOD AND DEFECT INSPECTION SYSTEM
- Publication number 20190155164
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Backside Illuminated Photo-Sensitive Device with Gradated Buffer Layer
- Publication number 20190058070
- Publication date Feb 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20190035681
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR
- Publication number 20180315760
- Publication date Nov 1, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Xiaomeng Chen

Person

Patents Grantslast 30 patents

Simultaneous multi-bandwidth optical inspection of semiconductor de...

Semiconductor structure inspection using a high atomic number material

Hot spot defect detecting method and hot spot defect detecting system

Dual facing BSI image sensors with wafer level stacking

Integrate rinse module in hybrid bonding platform

Semiconductor arrangement with capacitor

Backside illuminated photo-sensitive device with gradated buffer layer

Integrate rinse module in hybrid bonding platform

Wafer bonding method and apparatus with curved surfaces

Method for semiconductor wafer inspection and system thereof

Semiconductor arrangement with capacitor and method of fabricating...

Dual facing BSI image sensors with wafer level stacking

Semiconductor arrangement having capacitor separated from active re...

Semiconductor arrangement with capacitor

Perpendicular magnetic random-access memory (MRAM) formation by dir...

Hot spot defect detecting method and hot spot defect detecting system

Defect inspection method and defect inspection system

3D integrated circuit and methods of forming the same

Backside illuminated photo-sensitive device with gradated buffer layer

Integrate rinse module in hybrid bonding platform

Semiconductor arrangement with capacitor and method of fabricating...

Wafer processing method and apparatus

Perpendicular magnetic random-access memory (MRAM) formation by dir...

Dual facing BSI image sensors with wafer level stacking

Multiple metal layer semiconductor device and low temperature stack...

Semiconductor device with non-linear surface

Semiconductor arrangement having capacitor separated from active re...

Backside illuminated photo-sensitive device with gradated buffer layer

3D integrated circuit and methods of forming the same

Alignment systems and wafer bonding systems and methods

Patents Applicationslast 30 patents

METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD...

SIMULTANEOUS MULTI-BANDWIDTH OPTICAL INSPECTION OF SEMICONDUCTOR DE...

SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL

DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING

HOT SPOT DEFECT DETECTING METHOD AND HOT SPOT DEFECT DETECTING SYSTEM

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

SIMULTANEOUS MULTI-BANDWIDTH OPTICAL INSPECTION OF SEMICONDUCTOR DE...

SYSTEM AND METHOD FOR DETECTING DEFECTS ON A WAFER AND RELATED NON-...

3D Integrated Circuit and Methods of Forming the Same

SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL

Integrate Rinse Module in Hybrid Bonding Platform

3D Integrated Circuit and Methods of Forming the Same

Dual Facing BSI Image Sensors With Wafer Level Stacking

SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR

3D Integrated Circuit and Methods of Forming the Same

HOT SPOT DEFECT DETECTING METHOD AND HOT SPOT DEFECT DETECTING SYSTEM

METHOD FOR SEMICONDUCTOR WAFER INSPECTION AND SYSTEM THEREOF

3D Integrated Circuit and Methods of Forming the Same

Backside Illuminated Photo-Sensitive Device with Gradated Buffer Layer

Wafer Processing Method and Apparatus

SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR AND METHOD OF FABRICATING...

Dual Facing BSI Image Sensors with Wafer Level Stacking

PERPENDICULAR MAGNETIC RANDOM-ACCESS MEMORY (MRAM) FORMATION BY DIR...

Integrate Rinse Module in Hybrid Bonding Platform

HOT SPOT DEFECT DETECTING METHOD AND HOT SPOT DEFECT DETECTING SYSTEM

SEMICONDUCTOR ARRANGEMENT HAVING CAPACITOR SEPARATED FROM ACTIVE RE...

DEFECT INSPECTION METHOD AND DEFECT INSPECTION SYSTEM

Backside Illuminated Photo-Sensitive Device with Gradated Buffer Layer

3D Integrated Circuit and Methods of Forming the Same

SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR