Xiaoqi Zhu

Person

Vista, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,774,493
- Issue date Aug 10, 2004
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,566,234
- Issue date May 20, 2003
- Aguila Technologies, Inc.
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,518,677
- Issue date Feb 11, 2003
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,399,426
- Issue date Jun 4, 2002
- Miguel Albert Capote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,335,571
- Issue date Jan 1, 2002
- Miguel Albert Capote
- Miguel Albert Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip assembly with pre-applied encapsulating layers
- Patent number 6,297,560
- Issue date Oct 2, 2001
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,121,689
- Issue date Sep 19, 2000
- Miguel Albert Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20050218517
- Publication date Oct 6, 2005
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20030218261
- Publication date Nov 27, 2003
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20020031868
- Publication date Mar 14, 2002
- Miguel Albert Capote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20020014703
- Publication date Feb 7, 2002
- Miguel A. Capote
- B32 - LAYERED PRODUCTS

Person

Patents Grantslast 30 patents

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip assembly with pre-applied encapsulating layers

Semiconductor flip-chip package and method for the fabrication thereof

Patents Applicationslast 30 patents

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof