Xuesong RAO

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Via structures of passive semiconductor devices
- Patent number 11,610,837
- Issue date Mar 21, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated thin film resistor and metal-insulator-metal capacitor
- Patent number 11,545,486
- Issue date Jan 3, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Chengang Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film conductive material with conductive etch stop layer
- Patent number 11,315,876
- Issue date Apr 26, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads of semiconductor devices
- Patent number 11,244,915
- Issue date Feb 8, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having copper bonding structures with silicon c...
- Patent number 9,859,236
- Issue date Jan 2, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Meng Meng Chong
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
CMP wafer edge control of dielectric
- Patent number 9,627,219
- Issue date Apr 18, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP head structure with retaining ring
- Patent number 9,511,470
- Issue date Dec 6, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Isolation for embedded devices
- Patent number 9,349,654
- Issue date May 24, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable passivation layers for semiconductor devices
- Patent number 9,293,388
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP head structure
- Patent number 9,242,338
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Method for forming through silicon via with wafer backside protection
- Patent number 9,230,886
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through silicon via with wafer backside protection
- Patent number 8,940,637
- Issue date Jan 27, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer profile engineering using films with continuously increased...
- Patent number 8,828,858
- Issue date Sep 9, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Step-like spacer profile
- Patent number 8,492,236
- Issue date Jul 23, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...
- Publication number 20240413162
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THIN FILM RESISTOR AND METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220108980
- Publication date Apr 7, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Chengang FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES OF PASSIVE SEMICONDUCTOR DEVICES
- Publication number 20220093508
- Publication date Mar 24, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XUESONG RAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CONDUCTIVE MATERIAL WITH CONDUCTIVE ETCH STOP LAYER
- Publication number 20210257300
- Publication date Aug 19, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XUESONG RAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS OF SEMICONDUCTOR DEVICES
- Publication number 20210134742
- Publication date May 6, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING COPPER BONDING STRUCTURES WITH SILICON C...
- Publication number 20170040272
- Publication date Feb 9, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Meng Meng Chong
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
RELIABLE PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES
- Publication number 20160181197
- Publication date Jun 23, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xuesong RAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20160136774
- Publication date May 19, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
CMP WAFER EDGE CONTROL OF DIELECTRIC
- Publication number 20150303068
- Publication date Oct 22, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION FOR EMBEDDED DEVICES
- Publication number 20150279743
- Publication date Oct 1, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
- Publication number 20150137359
- Publication date May 21, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES
- Publication number 20150108654
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xuesong RAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20150111469
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
COPPER HILLOCK PREVENTION WITH HYDROGEN PLASMA TREATMENT IN A DEDIC...
- Publication number 20140117545
- Publication date May 1, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Huang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
- Publication number 20140008810
- Publication date Jan 9, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER PROFILE ENGINEERING USING FILMS WITH CONTINUOUSLY INCREASED...
- Publication number 20130187202
- Publication date Jul 25, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEP-LIKE SPACER PROFILE
- Publication number 20130181259
- Publication date Jul 18, 2013
- Global Foundries Singapore PTE. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM EMPLOYING A MODIFIED ISOLATION STRUCTURE
- Publication number 20090325359
- Publication date Dec 31, 2009
- Chartered Semiconductor Manufacturing LTD.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS

Xuesong RAO

Person

Patents Grantslast 30 patents

Via structures of passive semiconductor devices

Integrated thin film resistor and metal-insulator-metal capacitor

Thin film conductive material with conductive etch stop layer

Bond pads of semiconductor devices

Integrated circuits having copper bonding structures with silicon c...

CMP wafer edge control of dielectric

CMP head structure with retaining ring

Isolation for embedded devices

Reliable passivation layers for semiconductor devices

CMP head structure

Method for forming through silicon via with wafer backside protection

Method for forming through silicon via with wafer backside protection

Spacer profile engineering using films with continuously increased...

Step-like spacer profile

Patents Applicationslast 30 patents

CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...

INTEGRATED THIN FILM RESISTOR AND METAL-INSULATOR-METAL CAPACITOR

VIA STRUCTURES OF PASSIVE SEMICONDUCTOR DEVICES

THIN FILM CONDUCTIVE MATERIAL WITH CONDUCTIVE ETCH STOP LAYER

BOND PADS OF SEMICONDUCTOR DEVICES

INTEGRATED CIRCUITS HAVING COPPER BONDING STRUCTURES WITH SILICON C...

RELIABLE PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES

CMP HEAD STRUCTURE

CMP WAFER EDGE CONTROL OF DIELECTRIC

ISOLATION FOR EMBEDDED DEVICES

METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION

RELIABLE PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES

CMP HEAD STRUCTURE

COPPER HILLOCK PREVENTION WITH HYDROGEN PLASMA TREATMENT IN A DEDIC...

METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION

SPACER PROFILE ENGINEERING USING FILMS WITH CONTINUOUSLY INCREASED...

STEP-LIKE SPACER PROFILE

INTEGRATED CIRCUIT SYSTEM EMPLOYING A MODIFIED ISOLATION STRUCTURE