Xuesong Xu

Person

Tianjin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package and method to manufacture the integrated...
- Patent number 11,784,112
- Issue date Oct 10, 2023
- NXP USA, INC.
- Jian Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with bendable leads
- Patent number 10,515,880
- Issue date Dec 24, 2019
- NXP USA, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor sensor device with lid
- Patent number 9,416,002
- Issue date Aug 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Nan Xu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor and method of packaging same
- Patent number 8,802,474
- Issue date Aug 12, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor and method of packaging same
- Patent number 8,716,846
- Issue date May 6, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Grant
Power device and method of packaging same
- Patent number 8,709,875
- Issue date Apr 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor package
- Patent number 8,692,387
- Issue date Apr 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Shunan Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with staggered leads
- Patent number 8,643,153
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Shunan Qiu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame for semiconductor device
- Patent number 8,525,311
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM device and method of assembling same
- Patent number 8,466,539
- Issue date Jun 18, 2013
- Freescale Semiconductor Inc.
- Jun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with solder flow control
- Patent number 8,050,048
- Issue date Nov 1, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Xuesong Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor integrated circuit package and method of packaging se...
- Patent number 7,727,817
- Issue date Jun 1, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Xuesong Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD TO MANUFACTURE THE INTEGRATED...
- Publication number 20220399257
- Publication date Dec 15, 2022
- Jian Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH BENDABLE LEADS
- Publication number 20190287883
- Publication date Sep 19, 2019
- NXP USA, Inc.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR SENSOR DEVICE WITH LID
- Publication number 20160023894
- Publication date Jan 28, 2016
- Nan Xu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20140206124
- Publication date Jul 24, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Application
POWER DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20140191383
- Publication date Jul 10, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20130264714
- Publication date Oct 10, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Guo Liang Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20130049183
- Publication date Feb 28, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE DIE BONDING
- Publication number 20130037966
- Publication date Feb 14, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Shunan QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SEMICONDUCTOR PACKAGE
- Publication number 20130020690
- Publication date Jan 24, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Shunan QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STAGGERED LEADS
- Publication number 20120286406
- Publication date Nov 15, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Shunan QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20120211846
- Publication date Aug 23, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20120193737
- Publication date Aug 2, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Xingshou Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20120168884
- Publication date Jul 5, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR DEVICE
- Publication number 20120056311
- Publication date Mar 8, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF PACKAGING SE...
- Publication number 20090236713
- Publication date Sep 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Xuesong XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH SOLDER FLOW CONTROL
- Publication number 20080266828
- Publication date Oct 30, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Xuesong XU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit package and method to manufacture the integrated...

Lead frame with bendable leads

Packaged semiconductor sensor device with lid

Pressure sensor and method of packaging same

Pressure sensor and method of packaging same

Power device and method of packaging same

Stacked die semiconductor package

Semiconductor device with staggered leads

Lead frame for semiconductor device

MRAM device and method of assembling same

Lead frame with solder flow control

Semiconductor integrated circuit package and method of packaging se...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD TO MANUFACTURE THE INTEGRATED...

LEAD FRAME WITH BENDABLE LEADS

PACKAGED SEMICONDUCTOR SENSOR DEVICE WITH LID

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

POWER DEVICE AND METHOD OF PACKAGING SAME

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

POWER DEVICE AND METHOD OF PACKAGING SAME

SEMICONDUCTOR DEVICE DIE BONDING

STACKED DIE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH STAGGERED LEADS

MRAM DEVICE AND METHOD OF ASSEMBLING SAME

MRAM DEVICE AND METHOD OF ASSEMBLING SAME

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

LEADFRAME FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF PACKAGING SE...

LEAD FRAME WITH SOLDER FLOW CONTROL