Yan Xun Xue

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having mold locking feature
- Patent number 12,142,548
- Issue date Nov 12, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale semiconductor package
- Patent number 11,721,665
- Issue date Aug 8, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DMOS FET chip scale package and method of making the same
- Patent number 11,699,627
- Issue date Jul 11, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a lead frame including die paddles and...
- Patent number 11,688,671
- Issue date Jun 27, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL, LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flank and method of maki...
- Patent number 11,581,195
- Issue date Feb 14, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for semi-wafer level packaging
- Patent number 11,430,762
- Issue date Aug 30, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having enlarged gate pad and method of making...
- Patent number 11,222,858
- Issue date Jan 11, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including low side field-effect transistors a...
- Patent number 11,094,617
- Issue date Aug 17, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of making the same
- Patent number 11,069,604
- Issue date Jul 20, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD. GRAND
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common source land grid array package
- Patent number 10,991,680
- Issue date Apr 27, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for wafer level packaging with large contact area
- Patent number 10,141,264
- Issue date Nov 27, 2018
- Alpha and Omega Semiconductor (Cayman) LTD
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid packaged lead frame based multi-chip semiconductor device wi...
- Patent number 10,043,736
- Issue date Aug 7, 2018
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device having single in-line lead module and me...
- Patent number 9,966,328
- Issue date May 8, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for wafer level packaging with large contact area
- Patent number 9,960,119
- Issue date May 1, 2018
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package of a flipped MOSFET chip and a multi-based di...
- Patent number 9,929,076
- Issue date Mar 27, 2018
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method of a thin power device
- Patent number 9,854,686
- Issue date Dec 26, 2017
- Alpha and Omega Semiconductor (Cayman) LTD
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package device having locking mechanism, and pr...
- Patent number 9,786,583
- Issue date Oct 10, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery protection package and process of making the same
- Patent number 9,768,146
- Issue date Sep 19, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor power device having single in-line lead module and me...
- Patent number 9,754,864
- Issue date Sep 5, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined packaged power semiconductor device
- Patent number 9,735,094
- Issue date Aug 15, 2017
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,679,833
- Issue date Jun 13, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thick bottom metal and preparation method...
- Patent number 9,653,383
- Issue date May 16, 2017
- Alpha & Omega Semiconductor (Cayman), Ltd.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery protection package and process of making the same
- Patent number 9,564,406
- Issue date Feb 7, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,520,380
- Issue date Dec 13, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for wafer level packaging with large contact area
- Patent number 9,502,268
- Issue date Nov 22, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,472,491
- Issue date Oct 18, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined packaged power semiconductor device
- Patent number 9,437,530
- Issue date Sep 6, 2016
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side exposed semiconductor package with ultra-thin die and man...
- Patent number 9,437,528
- Issue date Sep 6, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device and preparation method thereof
- Patent number 9,431,328
- Issue date Aug 30, 2016
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFE...
- Publication number 20250118638
- Publication date Apr 10, 2025
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SLANTED SECTIONS
- Publication number 20250112132
- Publication date Apr 3, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20250096081
- Publication date Mar 20, 2025
- Alpha and Omega Semiconductor International LP
- Madhur Bobde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...
- Publication number 20250069973
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...
- Publication number 20240429140
- Publication date Dec 26, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE
- Publication number 20240096768
- Publication date Mar 21, 2024
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20230420340
- Publication date Dec 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MOLD LOCKING FEATURE
- Publication number 20230215783
- Publication date Jul 6, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
- Publication number 20220278076
- Publication date Sep 1, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20220278009
- Publication date Sep 1, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEMI-WAFER LEVEL PACKAGING
- Publication number 20220208724
- Publication date Jun 30, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANK AND METHOD OF MAKI...
- Publication number 20220199425
- Publication date Jun 23, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ENLARGED GATE PAD AND METHOD OF MAKING...
- Publication number 20210398926
- Publication date Dec 23, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20210343630
- Publication date Nov 4, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON SOURCE LAND GRID ARRAY PACKAGE
- Publication number 20210083088
- Publication date Mar 18, 2021
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200411422
- Publication date Dec 31, 2020
- Alpha and Omega Semiconductor (Cayman), Ltd
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200194395
- Publication date Jun 18, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200194347
- Publication date Jun 18, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER LEVEL PACKAGING WITH LARGE CONTACT AREA
- Publication number 20180211916
- Publication date Jul 26, 2018
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE HAVING SINGLE IN-LINE LEAD MODULE AND ME...
- Publication number 20170372987
- Publication date Dec 28, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME
- Publication number 20170098626
- Publication date Apr 6, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME
- Publication number 20170033060
- Publication date Feb 2, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER LEVEL PACKAGING WITH LARGE CONTACT AREA
- Publication number 20170025356
- Publication date Jan 26, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD
- Publication number 20160379918
- Publication date Dec 29, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE DEVICE HAVING LOCKING MECHANISM, AND PR...
- Publication number 20160379917
- Publication date Dec 29, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...
- Publication number 20160315039
- Publication date Oct 27, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED PACKAGED POWER SEMICONDUCTOR DEVICE
- Publication number 20160307830
- Publication date Oct 20, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE
- Publication number 20160155688
- Publication date Jun 2, 2016
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET
- Publication number 20160104661
- Publication date Apr 14, 2016
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD
- Publication number 20160093560
- Publication date Mar 31, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS

Yan Xun Xue

Person

Patents Grantslast 30 patents

Semiconductor package having wettable lead flanks and tie bars and...

Semiconductor package having mold locking feature

Wafer level chip scale semiconductor package

DMOS FET chip scale package and method of making the same

Semiconductor package having a lead frame including die paddles and...

Semiconductor package having wettable lead flank and method of maki...

Method for semi-wafer level packaging

Semiconductor package having enlarged gate pad and method of making...

Semiconductor package including low side field-effect transistors a...

Semiconductor package and method of making the same

Common source land grid array package

Method and structure for wafer level packaging with large contact area

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Semiconductor power device having single in-line lead module and me...

Method and structure for wafer level packaging with large contact area

Semiconductor package of a flipped MOSFET chip and a multi-based di...

Preparation method of a thin power device

Power semiconductor package device having locking mechanism, and pr...

Battery protection package and process of making the same

Semiconductor power device having single in-line lead module and me...

Combined packaged power semiconductor device

Semiconductor package with small gate clip and assembly method

Semiconductor device with thick bottom metal and preparation method...

Battery protection package and process of making the same

Wafer process for molded chip scale package (MCSP) with thick backs...

Method and structure for wafer level packaging with large contact area

Semiconductor package with small gate clip and assembly method

Combined packaged power semiconductor device

Dual-side exposed semiconductor package with ultra-thin die and man...

Power device and preparation method thereof

Patents Applicationslast 30 patents

APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFE...

SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SLANTED SECTIONS

SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME

CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...

SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...

SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

SEMICONDUCTOR PACKAGE HAVING MOLD LOCKING FEATURE

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE

DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME

METHOD FOR SEMI-WAFER LEVEL PACKAGING

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANK AND METHOD OF MAKI...

SEMICONDUCTOR PACKAGE HAVING ENLARGED GATE PAD AND METHOD OF MAKING...

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

COMMON SOURCE LAND GRID ARRAY PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

METHOD AND STRUCTURE FOR WAFER LEVEL PACKAGING WITH LARGE CONTACT AREA

SEMICONDUCTOR POWER DEVICE HAVING SINGLE IN-LINE LEAD MODULE AND ME...

BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME

BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME

METHOD AND STRUCTURE FOR WAFER LEVEL PACKAGING WITH LARGE CONTACT AREA

SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD

POWER SEMICONDUCTOR PACKAGE DEVICE HAVING LOCKING MECHANISM, AND PR...

Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...

COMBINED PACKAGED POWER SEMICONDUCTOR DEVICE

METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE

A SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET

POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD