Yasuo MORIYA

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 9,391,031
- Issue date Jul 12, 2016
- Fujitsu Limited
- Tetsuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a carriage assembly
- Patent number 7,581,309
- Issue date Sep 1, 2009
- Fujitsu Limited
- Takayoshi Matsumura
- G11 - INFORMATION STORAGE
Information Patent Grant
Lead-free solder alloy and a manufacturing process of electric and...
- Patent number 6,984,254
- Issue date Jan 10, 2006
- Fujitsu Limited
- Masakazu Takesue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy and a manufacturing process of electric and...
- Patent number 6,521,176
- Issue date Feb 18, 2003
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder composition with Bi, In and Sn
- Patent number 6,184,475
- Issue date Feb 6, 2001
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Drying device for worked metal parts
- Patent number 5,572,803
- Issue date Nov 12, 1996
- Fujitsu Limited
- Yasuo Moriya
- F26 - DRYING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL DEVICE AND METHOD OF PRODUCING THE SAME
- Publication number 20160224061
- Publication date Aug 4, 2016
- Fujitsu Limited
- Yutaka Noda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140084491
- Publication date Mar 27, 2014
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20130255878
- Publication date Oct 3, 2013
- Fujitsu Limited
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, CIRCUIT BOARD MODULE, AND METHOD FOR MANUFACTURING INTE...
- Publication number 20130087376
- Publication date Apr 11, 2013
- Fujitsu Limited
- Yasuo MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling a carriage assembly and assembling apparatus
- Publication number 20070119045
- Publication date May 31, 2007
- FUJITSU LIMITED
- Takayoshi Matsumura
- G11 - INFORMATION STORAGE
Information Patent Application
Lead-free solder alloy and a manufacturing process of electric and...
- Publication number 20040052678
- Publication date Mar 18, 2004
- FUJITSU LIMITED
- Masakazu Takesue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder alloy and a manufacturing process of electric and...
- Publication number 20030095888
- Publication date May 22, 2003
- FUJITSU LIMITED
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder alloy and a manufacturing process of electric and...
- Publication number 20010001990
- Publication date May 31, 2001
- FUJITSU LIMITED
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yasuo MORIYA

Person

Patents Grantslast 30 patents

Method for manufacturing electronic device and electronic device

Method of assembling a carriage assembly

Lead-free solder alloy and a manufacturing process of electric and...

Lead-free solder alloy and a manufacturing process of electric and...

Lead-free solder composition with Bi, In and Sn

Drying device for worked metal parts

Patents Applicationslast 30 patents

ELECTRICAL DEVICE AND METHOD OF PRODUCING THE SAME

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

INTERPOSER, CIRCUIT BOARD MODULE, AND METHOD FOR MANUFACTURING INTE...

Method of assembling a carriage assembly and assembling apparatus

Lead-free solder alloy and a manufacturing process of electric and...

Lead-free solder alloy and a manufacturing process of electric and...

Lead-free solder alloy and a manufacturing process of electric and...