Yasushi INAGAKI

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board
- Patent number 10,134,693
- Issue date Nov 20, 2018
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 9,854,669
- Issue date Dec 26, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,793,241
- Issue date Oct 17, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing package substrate
- Patent number 9,763,319
- Issue date Sep 12, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing package substrate
- Patent number 9,716,059
- Issue date Jul 25, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,704,795
- Issue date Jul 11, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with built-in electronic component
- Patent number 9,699,909
- Issue date Jul 4, 2017
- Ibiden Co., Ltd.
- Naohito Ishiguro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,655,242
- Issue date May 16, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens driving apparatus
- Patent number 9,638,885
- Issue date May 2, 2017
- Alps Electric Co., Ltd.
- Yasushi Inagaki
- G02 - OPTICS
Information Patent Grant
Printed wiring board and semiconductor package
- Patent number 9,564,392
- Issue date Feb 7, 2017
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,538,651
- Issue date Jan 3, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,510,447
- Issue date Nov 29, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,510,450
- Issue date Nov 29, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and method for manufacturing package substrate
- Patent number 9,443,800
- Issue date Sep 13, 2016
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 9,287,250
- Issue date Mar 15, 2016
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 9,263,784
- Issue date Feb 16, 2016
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board having multilayer core substrate
- Patent number 9,226,397
- Issue date Dec 29, 2015
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 9,101,054
- Issue date Aug 4, 2015
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,060,446
- Issue date Jun 16, 2015
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 8,842,440
- Issue date Sep 23, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 8,830,691
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,780,573
- Issue date Jul 15, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 8,763,241
- Issue date Jul 1, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,754,334
- Issue date Jun 17, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,729,400
- Issue date May 20, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,717,772
- Issue date May 6, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,592,688
- Issue date Nov 26, 2013
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,569,880
- Issue date Oct 29, 2013
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,331,102
- Issue date Dec 11, 2012
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,119,920
- Issue date Feb 21, 2012
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20170213799
- Publication date Jul 27, 2017
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20170154871
- Publication date Jun 1, 2017
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20160336261
- Publication date Nov 17, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20160255717
- Publication date Sep 1, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160174372
- Publication date Jun 16, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20160164159
- Publication date Jun 9, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20160086885
- Publication date Mar 24, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160081190
- Publication date Mar 17, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20160064318
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...
- Publication number 20160044783
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20160043024
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160043027
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160044780
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160021759
- Publication date Jan 21, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160021758
- Publication date Jan 21, 2016
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20150357316
- Publication date Dec 10, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20150327363
- Publication date Nov 12, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20150318596
- Publication date Nov 5, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20150279772
- Publication date Oct 1, 2015
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20150250056
- Publication date Sep 3, 2015
- IIBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS DRIVING APPARATUS
- Publication number 20150212288
- Publication date Jul 30, 2015
- Alps Electric Co., Ltd.
- Yasushi INAGAKI
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN ELECTRONIC COMP...
- Publication number 20150040389
- Publication date Feb 12, 2015
- IBIDEN CO., LTD.
- Naohito ISHIGURO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20150043183
- Publication date Feb 12, 2015
- IBIDEN CO., LTD.
- Naohito ISHIGURO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20140374150
- Publication date Dec 25, 2014
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140247572
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130299218
- Publication date Nov 14, 2013
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20130286615
- Publication date Oct 31, 2013
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Printed Wiring Board
- Publication number 20130248234
- Publication date Sep 26, 2013
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130206466
- Publication date Aug 15, 2013
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20130107482
- Publication date May 2, 2013
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS

Yasushi INAGAKI

Person

Patents Grantslast 30 patents

Printed wiring board

Package substrate

Printed wiring board

Package substrate and method for manufacturing package substrate

Package substrate and method for manufacturing package substrate

Printed wiring board and method for manufacturing the same

Wiring board with built-in electronic component

Printed wiring board

Lens driving apparatus

Printed wiring board and semiconductor package

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Package substrate and method for manufacturing package substrate

Package substrate

Package substrate

Multilayer printed wiring board having multilayer core substrate

Multilayer printed wiring board

Printed circuit board

Printed circuit board and method of manufacturing printed circuit b...

Printed circuit board and method of manufacturing printed circuit b...

Printed circuit board

Method of manufacturing printed wiring board

Multilayer printed wiring board

Multilayer printed wiring board

Printed circuit board

Multilayer printed wiring board

Multilayer printed wiring board

Printed circuit board

Multilayer printed wiring board

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

MULTILAYER WIRING BOARD

PRINTED WIRING BOARD

PACKAGE SUBSTRATE

PACKAGE SUBSTRATE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

PACKAGE SUBSTRATE

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

PRINTED CIRCUIT BOARD

LENS DRIVING APPARATUS

METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN ELECTRONIC COMP...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

PRINTED CIRCUIT BOARD

MULTILAYER PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

Multilayer Printed Wiring Board

MULTILAYER PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD