Yejie HONG

Person

Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Connector for implementing multi-faceted interconnection
- Patent number 12,040,272
- Issue date Jul 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing embedded package structure having air reso...
- Patent number 12,040,526
- Issue date Jul 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate manufacturing method for realizing three-dimensional pack...
- Patent number 11,961,743
- Issue date Apr 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate
- Patent number 11,769,733
- Issue date Sep 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for implementing multi-faceted interconnection
- Patent number 11,682,621
- Issue date Jun 20, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method thereof
- Patent number 11,515,258
- Issue date Nov 29, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive device packaging structure embedded in glass medium and met...
- Patent number 11,503,712
- Issue date Nov 15, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure of integrated passive device and manufacturing me...
- Patent number 11,342,273
- Issue date May 24, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED MAGNETIC DEVICE INTEGRATED STRUCTURE AND MANUFACTURING MET...
- Publication number 20240332224
- Publication date Oct 3, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240321594
- Publication date Sep 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRU...
- Publication number 20240312796
- Publication date Sep 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING EMBEDDED DEVICE PACKAGING SUBSTRATE, PACKA...
- Publication number 20240222245
- Publication date Jul 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DEVICE PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240194578
- Publication date Jun 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MANUFACTURING METHOD, EMBEDDED SUBSTRATE AND SEMICONDUCTOR
- Publication number 20240153819
- Publication date May 9, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...
- Publication number 20240096836
- Publication date Mar 21, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
- Publication number 20240063055
- Publication date Feb 22, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING MET...
- Publication number 20240030146
- Publication date Jan 25, 2024
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR REALIZING CHIP INTERCONNECTION AND MANUFACT...
- Publication number 20240021525
- Publication date Jan 18, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR FOR IMPLEMENTING MULTI-FACETED INTERCONNECTION
- Publication number 20230275023
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND INDUCTOR EMBEDDED STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20230197739
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230199957
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANU...
- Publication number 20230154857
- Publication date May 18, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL-HEAT SEPARATED TMV PACKAGING STRUCTURE AND MANUFACTURING MET...
- Publication number 20230127494
- Publication date Apr 27, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230125220
- Publication date Apr 27, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE BASED ON MOLDING PROCESS AND MANUFACTURING METHOD...
- Publication number 20230092164
- Publication date Mar 23, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230052065
- Publication date Feb 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230051730
- Publication date Feb 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC COOLING EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHO...
- Publication number 20230010115
- Publication date Jan 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...
- Publication number 20220367373
- Publication date Nov 17, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...
- Publication number 20220287184
- Publication date Sep 8, 2022
- Nantong ACCESS Semiconductor CO.,LTD.
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MANUFACTURING METHOD FOR REALIZING THREE-DIMENSIONAL PACK...
- Publication number 20220189789
- Publication date Jun 16, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR FOR IMPLEMENTING MULTI-FACETED INTERCONNECTION AND MANUFA...
- Publication number 20220068825
- Publication date Mar 3, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE PACKAGING STRUCTURE EMBEDDED IN GLASS MEDIUM AND MET...
- Publication number 20220053644
- Publication date Feb 17, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013462
- Publication date Jan 13, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF INTEGRATED PASSIVE DEVICE AND MANUFACTURING ME...
- Publication number 20210407922
- Publication date Dec 30, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING EMBEDDED PACKAGE STRUCTURE HAVING AIR RESO...
- Publication number 20210399400
- Publication date Dec 23, 2021
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Connector for implementing multi-faceted interconnection

Method for manufacturing embedded package structure having air reso...

Substrate manufacturing method for realizing three-dimensional pack...

Structure for embedding and packaging multiple devices by layer and...

Package substrate

Connector for implementing multi-faceted interconnection

Package substrate and manufacturing method thereof

Passive device packaging structure embedded in glass medium and met...

Package structure of integrated passive device and manufacturing me...

Patents Applicationslast 30 patents

EMBEDDED MAGNETIC DEVICE INTEGRATED STRUCTURE AND MANUFACTURING MET...

EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD

ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRU...

METHOD FOR MANUFACTURING EMBEDDED DEVICE PACKAGING SUBSTRATE, PACKA...

EMBEDDED DEVICE PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR

SUBSTRATE MANUFACTURING METHOD, EMBEDDED SUBSTRATE AND SEMICONDUCTOR

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...

MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE

MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING MET...

PACKAGING STRUCTURE FOR REALIZING CHIP INTERCONNECTION AND MANUFACT...

CONNECTOR FOR IMPLEMENTING MULTI-FACETED INTERCONNECTION

CAPACITOR AND INDUCTOR EMBEDDED STRUCTURE AND MANUFACTURING METHOD...

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANU...

SIGNAL-HEAT SEPARATED TMV PACKAGING STRUCTURE AND MANUFACTURING MET...

EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE BASED ON MOLDING PROCESS AND MANUFACTURING METHOD...

HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

CYCLIC COOLING EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHO...

MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...

TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUF...

SUBSTRATE MANUFACTURING METHOD FOR REALIZING THREE-DIMENSIONAL PACK...

CONNECTOR FOR IMPLEMENTING MULTI-FACETED INTERCONNECTION AND MANUFA...

PASSIVE DEVICE PACKAGING STRUCTURE EMBEDDED IN GLASS MEDIUM AND MET...

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE OF INTEGRATED PASSIVE DEVICE AND MANUFACTURING ME...

METHOD FOR MANUFACTURING EMBEDDED PACKAGE STRUCTURE HAVING AIR RESO...