Yeong-Her Wang

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with a warped spring connector
- Patent number 7,696,443
- Issue date Apr 13, 2010
- Chipmos Technologies (Bermuda) Ltd.
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating a plurality of elastic probes in a row
- Patent number 7,477,065
- Issue date Jan 13, 2009
- ChipMOS Technologies Inc.
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Grant
Modular probe card
- Patent number 7,372,286
- Issue date May 13, 2008
- Chipmos Technologies (Bermuda) Ltd.
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating a plurality of elastic probes in a row
- Patent number 7,316,065
- Issue date Jan 8, 2008
- ChipMOS Technologies (Bermuda)
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating anisotropic conductive substrate
- Patent number 7,140,101
- Issue date Nov 28, 2006
- Chipmos Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card assembly
- Patent number 7,129,730
- Issue date Oct 31, 2006
- Chipmos Technologies (Bermuda) Ltd.
- An-Hong Liu
- G01 - MEASURING TESTING
Information Patent Grant
Modularized probe card for high frequency probing
- Patent number 7,088,118
- Issue date Aug 8, 2006
- Chipmos Technologies (Bermuda) Ltd.
- An-Hong Liu
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing probes of a probe card
- Patent number 7,005,054
- Issue date Feb 28, 2006
- Chipmos Technologies (Bermuda) Ltd.
- S. J. Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Modularized probe head
- Patent number 6,946,860
- Issue date Sep 20, 2005
- Chipmos Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly
- Patent number 6,853,205
- Issue date Feb 8, 2005
- Chipmos Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Modularized probe card with coaxial transmitters
- Patent number 6,812,720
- Issue date Nov 2, 2004
- Chipmos Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Modularized probe card with compressible electrical connection device
- Patent number 6,781,392
- Issue date Aug 24, 2004
- Chipmos Technologies Ltd.
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Method of surface treatment on the improvement of electrical proper...
- Patent number 6,689,645
- Issue date Feb 10, 2004
- National Science Council
- Mau-Phon Houng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip type semiconductor device for reducing signal skew
- Patent number 6,686,615
- Issue date Feb 3, 2004
- Chipmos Technologies (Bermuda) Ltd.
- S. J. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular probe card assembly
- Patent number 6,621,710
- Issue date Sep 16, 2003
- ChipMOS Technologies (Bermuda) Ltd.
- Shih-Jye Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating metal oxide semiconductor field effect trans...
- Patent number 6,326,317
- Issue date Dec 4, 2001
- National Science Council
- Hwei-Heng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid phase deposition method for forming silicon dioxide film on...
- Patent number 6,004,886
- Issue date Dec 21, 1999
- National Science Council
- Mau-Phon Houng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid phase deposition method for growing silicon dioxide film on...
- Patent number 5,998,304
- Issue date Dec 7, 1999
- National Science Council
- Mau-Phon Houng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming oxide film on III-V substrate
- Patent number 5,958,519
- Issue date Sep 28, 1999
- National Science Council
- Hwei-Heng Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
L-SHAPED FIELD EFFECT TRANSISTOR AND CORRESPONDING FABRICATION METH...
- Publication number 20240387543
- Publication date Nov 21, 2024
- National Cheng Kung University
- YEONG-HER WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-PASS WIDEBAND PHASE SHIFTER AND OPERATING METHOD THEREOF
- Publication number 20170201225
- Publication date Jul 13, 2017
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- YEONG-HER WANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Modular probe card
- Publication number 20070152689
- Publication date Jul 5, 2007
- ChipMOS Technologies (Bermuda) Ltd.
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Application
Replaceable modular probe head
- Publication number 20070085554
- Publication date Apr 19, 2007
- ChipMOS Technologies (Bermuda) Ltd.
- Hsiang-Ming Huang
- G01 - MEASURING TESTING
Information Patent Application
Method for fabricating a plurality of elastic probes in a row
- Publication number 20070069750
- Publication date Mar 29, 2007
- ChipMOS Technologies (Bermuda) Ltd.
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Application
Method for fabricating a plurality of elastic probes in a row
- Publication number 20070069749
- Publication date Mar 29, 2007
- ChipMOS Technologies (Bermuda) Ltd.
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Application
Method for fabricating a plurality of elastic probes in a row
- Publication number 20060267607
- Publication date Nov 30, 2006
- ChipMOS Technologies (Bermuda) Ltd.
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Application
MODULARIZED PROBE CARD FOR HIGH FREQUENCY PROBING
- Publication number 20060125498
- Publication date Jun 15, 2006
- ChipMOS Technologies (Bermuda) Ltd.
- An-Hong Liu
- G01 - MEASURING TESTING
Information Patent Application
Modularized probe head
- Publication number 20060125501
- Publication date Jun 15, 2006
- ChipMOS Technologies (Bermuda) Ltd.
- An-Hong Liu
- G01 - MEASURING TESTING
Information Patent Application
Probe card interposer
- Publication number 20060091510
- Publication date May 4, 2006
- ChipMOS Technologies (Bermuda) Ltd.
- An-Hong Liu
- G01 - MEASURING TESTING
Information Patent Application
Electronic device with a warped spring connector
- Publication number 20060042834
- Publication date Mar 2, 2006
- ChipMOS Technologies (Bermuda) Ltd.
- Yi-Chang Lee
- G01 - MEASURING TESTING
Information Patent Application
Modularized probe head
- Publication number 20050088190
- Publication date Apr 28, 2005
- S.J. Cheng
- G01 - MEASURING TESTING
Information Patent Application
Method for fabricating wafer-level chip scale packages
- Publication number 20050070049
- Publication date Mar 31, 2005
- S. J. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating anisotropic conductive substrate
- Publication number 20050066521
- Publication date Mar 31, 2005
- S. J. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD ASSEMBLY
- Publication number 20050012513
- Publication date Jan 20, 2005
- Shih-Jye Cheng
- G01 - MEASURING TESTING
Information Patent Application
MODULARIZED PROBE CARD WITH COAXIAL TRANSMITTERS
- Publication number 20040207420
- Publication date Oct 21, 2004
- S. J. Cheng
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing probes of a probe card
- Publication number 20040035706
- Publication date Feb 26, 2004
- ChipMOS Technologies (Bermuda) Ltd. and ChipMOS TECHNOLOGIES INC.
- S. J. Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Probe card with full wafer contact configuration
- Publication number 20040012405
- Publication date Jan 22, 2004
- ChipMOS Technologies (Bermuda) Ltd.
- S. J. Cheng
- G01 - MEASURING TESTING
Information Patent Application
Method of surface treatment on the improvement of electrical proper...
- Publication number 20020102775
- Publication date Aug 1, 2002
- Mau-Phon Houng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a metal oxide semiconductor field effect trans...
- Publication number 20020094699
- Publication date Jul 18, 2002
- Mau-Phon Houng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving electrical characteristics of oxide film grown...
- Publication number 20020064962
- Publication date May 30, 2002
- Yeong-Her Wang
- H01 - BASIC ELECTRIC ELEMENTS

Yeong-Her Wang

Person

Patents Grantslast 30 patents

Electronic device with a warped spring connector

Method for fabricating a plurality of elastic probes in a row

Modular probe card

Method for fabricating a plurality of elastic probes in a row

Method for fabricating anisotropic conductive substrate

Probe card assembly

Modularized probe card for high frequency probing

Method for manufacturing probes of a probe card

Modularized probe head

Probe card assembly

Modularized probe card with coaxial transmitters

Modularized probe card with compressible electrical connection device

Method of surface treatment on the improvement of electrical proper...

Flip-chip type semiconductor device for reducing signal skew

Modular probe card assembly

Method for fabricating metal oxide semiconductor field effect trans...

Liquid phase deposition method for forming silicon dioxide film on...

Liquid phase deposition method for growing silicon dioxide film on...

Method for forming oxide film on III-V substrate

Patents Applicationslast 30 patents

L-SHAPED FIELD EFFECT TRANSISTOR AND CORRESPONDING FABRICATION METH...

ALL-PASS WIDEBAND PHASE SHIFTER AND OPERATING METHOD THEREOF

Modular probe card

Replaceable modular probe head

Method for fabricating a plurality of elastic probes in a row

Method for fabricating a plurality of elastic probes in a row

Method for fabricating a plurality of elastic probes in a row

MODULARIZED PROBE CARD FOR HIGH FREQUENCY PROBING

Modularized probe head

Probe card interposer

Electronic device with a warped spring connector

Modularized probe head

Method for fabricating wafer-level chip scale packages

Method for fabricating anisotropic conductive substrate

PROBE CARD ASSEMBLY

MODULARIZED PROBE CARD WITH COAXIAL TRANSMITTERS

Method for manufacturing probes of a probe card

Probe card with full wafer contact configuration

Method of surface treatment on the improvement of electrical proper...

Method for producing a metal oxide semiconductor field effect trans...

Method for improving electrical characteristics of oxide film grown...