Yi Chuan DING

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,261,350
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,956,897
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,721,884
- Issue date Aug 8, 2023
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,399,429
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,362,049
- Issue date Jun 14, 2022
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,296,001
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and semiconductor package structure including t...
- Patent number 11,107,777
- Issue date Aug 31, 2021
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,971,798
- Issue date Apr 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,847,470
- Issue date Nov 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,687,419
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate and semiconductor package structure having...
- Patent number 9,978,705
- Issue date May 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive via and manufacturing proces...
- Patent number 9,960,121
- Issue date May 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Yung-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and semiconductor package structure having...
- Patent number 9,437,565
- Issue date Sep 6, 2016
- ADVANCED SEMINCONDUCTOR ENGINEERING, INC.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive via and manufacturing process
- Patent number 9,406,552
- Issue date Aug 2, 2016
- Advanced Semiconductor Engineering, Inc.
- Yung-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package and manufacturing method thereof
- Patent number 9,349,611
- Issue date May 24, 2016
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having pillar group and semiconductor package having pill...
- Patent number 9,219,048
- Issue date Dec 22, 2015
- Advanced Semiconductor Engineering, Inc.
- Yun-Hsiang Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method for making the same
- Patent number 9,117,697
- Issue date Aug 25, 2015
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with fan-out and with connecting elem...
- Patent number 8,624,374
- Issue date Jan 7, 2014
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a stacking element
- Patent number 8,405,213
- Issue date Mar 26, 2013
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including connecting elements
- Patent number 8,278,746
- Issue date Oct 2, 2012
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered wirebonding configuration
- Patent number 7,411,287
- Issue date Aug 12, 2008
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and producing method thereof
- Patent number 7,388,272
- Issue date Jun 17, 2008
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate
- Patent number 7,291,788
- Issue date Nov 6, 2007
- Advanced Semiconductor Engineering Inc.
- Jia-Cheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package substrate for flip-chip and wire bonding
- Patent number 7,125,745
- Issue date Oct 24, 2006
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for prevention leakage of substrate strip
- Patent number 7,091,583
- Issue date Aug 15, 2006
- Advanced Semiconductor Engineering, Inc.
- Ying-Chih Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a substrate with embedded capacitor
- Patent number 6,967,138
- Issue date Nov 22, 2005
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mask and structure of a substrate
- Patent number 6,960,822
- Issue date Nov 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavity down ball grid array package structure and carrier thereof
- Patent number 6,828,687
- Issue date Dec 7, 2004
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor build-up package
- Patent number 6,750,397
- Issue date Jun 15, 2004
- Advanced Semiconductor Engineering, Inc.
- In-De Ou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package and manufacturing method
- Patent number 6,737,300
- Issue date May 18, 2004
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240260181
- Publication date Aug 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230402738
- Publication date Dec 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220361326
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210226317
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20210202410
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200296827
- Publication date Sep 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200127366
- Publication date Apr 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200126881
- Publication date Apr 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING T...
- Publication number 20190363056
- Publication date Nov 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190244907
- Publication date Aug 8, 2019
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180359853
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...
- Publication number 20160336287
- Publication date Nov 17, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIA AND MANUFACTURING PROCES...
- Publication number 20160315052
- Publication date Oct 27, 2016
- Advanced Semiconductor Engineering, Inc.
- Yung-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...
- Publication number 20160190079
- Publication date Jun 30, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME
- Publication number 20140367837
- Publication date Dec 18, 2014
- Chun-Che LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING PILLAR GROUP AND SEMICONDUCTOR PACKAGE HAVING PILL...
- Publication number 20140367852
- Publication date Dec 18, 2014
- Yun-Hsiang TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIA AND MANUACTURING PROCESS
- Publication number 20140175663
- Publication date Jun 26, 2014
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Yung-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20130171774
- Publication date Jul 4, 2013
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Semiconductor Device Packages with Stacking Functionality
- Publication number 20110241192
- Publication date Oct 6, 2011
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages with Fan-Out and with Connecting Elem...
- Publication number 20110241193
- Publication date Oct 6, 2011
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20110227220
- Publication date Sep 22, 2011
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20090114436
- Publication date May 7, 2009
- Advanced Semiconductor Engineering, Inc.
- Chia Ching CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System-in-package device
- Publication number 20070284715
- Publication date Dec 13, 2007
- Advanced Semiconductor Engineering, Inc.
- Wen Feng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package and producing method thereof
- Publication number 20060180906
- Publication date Aug 17, 2006
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package and producing method thereof
- Publication number 20060163704
- Publication date Jul 27, 2006
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Staggered wirebonding configuration
- Publication number 20060097387
- Publication date May 11, 2006
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20060054348
- Publication date Mar 16, 2006
- Jia-Cheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming ball pads of BGA substrate
- Publication number 20050054187
- Publication date Mar 10, 2005
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for prevention leakage of substrate strip
- Publication number 20050051881
- Publication date Mar 10, 2005
- Advanced Semiconductor Engineering, Inc.
- Ying-Chih Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball grid array package substrate and method for manufacturing the...
- Publication number 20050017375
- Publication date Jan 27, 2005
- Advanced Semiconductor Engineering, Inc.
- Shun-Fu Ko
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Yi Chuan DING

Person

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package device

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Substrate structure and semiconductor package structure including t...

Semiconductor device package and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor substrate and semiconductor package structure having...

Semiconductor device having conductive via and manufacturing proces...

Semiconductor substrate and semiconductor package structure having...

Semiconductor device having conductive via and manufacturing process

Stackable semiconductor package and manufacturing method thereof

Substrate having pillar group and semiconductor package having pill...

Semiconductor substrate and method for making the same

Semiconductor device packages with fan-out and with connecting elem...

Semiconductor package including a stacking element

Semiconductor device packages including connecting elements

Staggered wirebonding configuration

Chip package and producing method thereof

Circuit substrate

Multi-chip package substrate for flip-chip and wire bonding

Method and structure for prevention leakage of substrate strip

Process for manufacturing a substrate with embedded capacitor

Solder mask and structure of a substrate

Cavity down ball grid array package structure and carrier thereof

Thermally enhanced semiconductor build-up package

Chip scale package and manufacturing method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING T...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIA AND MANUFACTURING PROCES...

SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME

SUBSTRATE HAVING PILLAR GROUP AND SEMICONDUCTOR PACKAGE HAVING PILL...

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIA AND MANUACTURING PROCESS

STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Wafer-Level Semiconductor Device Packages with Stacking Functionality

Semiconductor Device Packages with Fan-Out and with Connecting Elem...

STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE

System-in-package device

Chip package and producing method thereof

Chip package and producing method thereof

Staggered wirebonding configuration

CIRCUIT SUBSTRATE

Method for forming ball pads of BGA substrate

Method and structure for prevention leakage of substrate strip

Ball grid array package substrate and method for manufacturing the...