Yifeng Zhou

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective silicon deposition
- Patent number 12,106,972
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed etch process
- Patent number 12,009,218
- Issue date Jun 11, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing an upper surface of a semiconductor substrate...
- Patent number 9,589,853
- Issue date Mar 7, 2017
- Lam Research Corporation
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing vias
- Patent number 8,999,184
- Issue date Apr 7, 2015
- Lam Research Corporation
- Ming-Shu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing a photoresist from a low-k dielectric film
- Patent number 8,980,754
- Issue date Mar 17, 2015
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of multiple patterning of a low-K dielectric film
- Patent number 8,940,642
- Issue date Jan 27, 2015
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post etch treatment (PET) of a low-K dielectric film
- Patent number 8,871,650
- Issue date Oct 28, 2014
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-K dielectric film
- Patent number 8,741,775
- Issue date Jun 3, 2014
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-K dielectric film
- Patent number 8,647,990
- Issue date Feb 11, 2014
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 8,314,033
- Issue date Nov 20, 2012
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma for resist removal and facet control of underlying features
- Patent number 7,758,763
- Issue date Jul 20, 2010
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch and photoresist strip process with intervening chamber...
- Patent number 7,244,313
- Issue date Jul 17, 2007
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTOLITHOGRAPHY ENHANCEMENT TECHNIQUES
- Publication number 20240242970
- Publication date Jul 18, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON MOLD FOR DRAM CAPACITOR
- Publication number 20240038833
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Fredrick Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED ETCH PROCESS
- Publication number 20230360920
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SILICON DEPOSITION
- Publication number 20230110474
- Publication date Apr 13, 2023
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...
- Publication number 20150249016
- Publication date Sep 3, 2015
- LAM RESEARCH CORPORATION
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU METAL RESIDUE CLEAN
- Publication number 20140179106
- Publication date Jun 26, 2014
- LAM RESEARCH CORPORATION
- Qinghua ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH WITH MIXED MODE PULSING
- Publication number 20140051256
- Publication date Feb 20, 2014
- LAM RESEARCH CORPORATION
- Qinghua ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING VIAS
- Publication number 20140038419
- Publication date Feb 6, 2014
- LAM RESEARCH CORPORATION
- Ming-Shu KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST ETCH TREATMENT (PET) OF A LOW-K DIELECTRIC FILM
- Publication number 20130109187
- Publication date May 2, 2013
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20130040464
- Publication date Feb 14, 2013
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MULTIPLE PATTERNING OF A LOW-K DIELECTRIC FILM
- Publication number 20130023122
- Publication date Jan 24, 2013
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20130023124
- Publication date Jan 24, 2013
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING A PHOTORESIST FROM A LOW-K DIELECTRIC FILM
- Publication number 20130023123
- Publication date Jan 24, 2013
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20120077344
- Publication date Mar 29, 2012
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING SILICON-BASED ANTIREFLECTIVE LAYERS
- Publication number 20110253670
- Publication date Oct 20, 2011
- Applied Materials, Inc.
- YIFENG ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE
- Publication number 20110079918
- Publication date Apr 7, 2011
- Applied Materials, Inc.
- Yifeng ZHOU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PLASMA ETCHING POROUS LOW-K DIELECTRIC LAYERS
- Publication number 20100022091
- Publication date Jan 28, 2010
- SIYI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA FOR RESIST REMOVAL AND FACET CONTROL OF UNDERLYING FEATURES
- Publication number 20080102645
- Publication date May 1, 2008
- APPLIED MATERIALS, INC.
- Yifeng Zhou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Yifeng Zhou

Person

Patents Grantslast 30 patents

Selective silicon deposition

Pulsed etch process

Method of planarizing an upper surface of a semiconductor substrate...

Method for providing vias

Method of removing a photoresist from a low-k dielectric film

Method of multiple patterning of a low-K dielectric film

Post etch treatment (PET) of a low-K dielectric film

Method of patterning a low-K dielectric film

Method of patterning a low-K dielectric film

Method of patterning a low-k dielectric film

Plasma for resist removal and facet control of underlying features

Plasma etch and photoresist strip process with intervening chamber...

Patents Applicationslast 30 patents

PHOTOLITHOGRAPHY ENHANCEMENT TECHNIQUES

CARBON MOLD FOR DRAM CAPACITOR

PULSED ETCH PROCESS

SELECTIVE SILICON DEPOSITION

METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...

IN-SITU METAL RESIDUE CLEAN

ETCH WITH MIXED MODE PULSING

METHOD FOR PROVIDING VIAS

POST ETCH TREATMENT (PET) OF A LOW-K DIELECTRIC FILM

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHOD OF MULTIPLE PATTERNING OF A LOW-K DIELECTRIC FILM

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHOD OF REMOVING A PHOTORESIST FROM A LOW-K DIELECTRIC FILM

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHODS FOR ETCHING SILICON-BASED ANTIREFLECTIVE LAYERS

PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE

METHOD FOR PLASMA ETCHING POROUS LOW-K DIELECTRIC LAYERS

PLASMA FOR RESIST REMOVAL AND FACET CONTROL OF UNDERLYING FEATURES