Yin Yen Bong

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Maleka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Die pillar structures and a method of their formation
- Patent number 7,462,942
- Issue date Dec 9, 2008
- Advanpack Solutions PTE LTD
- Kim Hwee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking lead tips and die attach pad for a leadless package apparat...
- Patent number 6,686,652
- Issue date Feb 3, 2004
- National Semiconductor
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance leadless package
- Patent number 6,452,255
- Issue date Sep 17, 2002
- National Semiconductor, Corp.
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical isolation in panels of leadless IC packages
- Patent number 6,399,415
- Issue date Jun 4, 2002
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure for high quality factor inductor operation
- Publication number 20060097346
- Publication date May 11, 2006
- Advanpack Solutions Pte Ltd
- Yin Yen Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded passive component
- Publication number 20060060937
- Publication date Mar 23, 2006
- Advanpack Solutions Pte Ltd
- Eng Han Matthew Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure package
- Publication number 20050167797
- Publication date Aug 4, 2005
- Advanpack Solutions Pte Ltd
- Yin Yen Bong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Pillar structures
- Publication number 20050077624
- Publication date Apr 14, 2005
- Advanpack Solutions Pte. Ltd.
- Kim Hwee Tan
- H01 - BASIC ELECTRIC ELEMENTS