Ying-Nan WEN

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method for forming the same
- Patent number 10,157,875
- Issue date Dec 18, 2018
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging sensing device and method for forming the same
- Patent number 10,140,498
- Issue date Nov 27, 2018
- Xintec Inc.
- Tsang-Yu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package having chip connected to sensing device with redistrib...
- Patent number 10,056,419
- Issue date Aug 21, 2018
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 9,966,358
- Issue date May 8, 2018
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package having chip connected to sensing de...
- Patent number 9,935,148
- Issue date Apr 3, 2018
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 9,831,185
- Issue date Nov 28, 2017
- Xintec Inc.
- Shih-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module and method for forming the same
- Patent number 9,812,413
- Issue date Nov 7, 2017
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating chip package with laser
- Patent number 9,780,050
- Issue date Oct 3, 2017
- Xintec Inc.
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,768,067
- Issue date Sep 19, 2017
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,721,911
- Issue date Aug 1, 2017
- Xintec Inc.
- Ho-Yin Yiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package having a laser stop structure
- Patent number 9,640,405
- Issue date May 2, 2017
- Xintec Inc.
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having a dual through hole redistribution layer structure
- Patent number 9,543,233
- Issue date Jan 10, 2017
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having extended depression for electrical connection a...
- Patent number 9,406,578
- Issue date Aug 2, 2016
- Xintec Inc.
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,379,072
- Issue date Jun 28, 2016
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure and manufacturing method thereof
- Patent number 9,281,243
- Issue date Mar 8, 2016
- Xintec Inc.
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 9,236,320
- Issue date Jan 12, 2016
- Xintec Inc.
- Yi-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,177,919
- Issue date Nov 3, 2015
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,153,707
- Issue date Oct 6, 2015
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,093,450
- Issue date Jul 28, 2015
- Xintec Inc.
- Baw-Ching Perng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 8,981,497
- Issue date Mar 17, 2015
- Xintec Inc.
- Ho-Yin Yiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device package and method for fabricating the same
- Patent number 8,823,179
- Issue date Sep 2, 2014
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupler packaging structure
- Patent number 8,791,768
- Issue date Jul 29, 2014
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 8,778,798
- Issue date Jul 15, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET package
- Patent number 8,766,431
- Issue date Jul 1, 2014
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 8,710,680
- Issue date Apr 29, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and manufacturing method thereof
- Patent number 8,692,284
- Issue date Apr 8, 2014
- Ying-Nan Wen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,643,070
- Issue date Feb 4, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,614,488
- Issue date Dec 24, 2013
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 8,610,271
- Issue date Dec 17, 2013
- Baw-Ching Perng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,564,133
- Issue date Oct 22, 2013
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE HAVING CHIP CONNECTED TO SENSING DEVICE WITH REDISTRIB...
- Publication number 20180175092
- Publication date Jun 21, 2018
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20170116458
- Publication date Apr 27, 2017
- XINTEC INC.
- Tsang-Yu LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170076981
- Publication date Mar 16, 2017
- XINTEC INC.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
- Publication number 20170047455
- Publication date Feb 16, 2017
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20170047300
- Publication date Feb 16, 2017
- XINTEC INC.
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170018590
- Publication date Jan 19, 2017
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160372445
- Publication date Dec 22, 2016
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160322305
- Publication date Nov 3, 2016
- XINTEC INC.
- Shih-Yi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160229687
- Publication date Aug 11, 2016
- XINTEC INC.
- Ying-Nan WEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160233260
- Publication date Aug 11, 2016
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20160211233
- Publication date Jul 21, 2016
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160204061
- Publication date Jul 14, 2016
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160190063
- Publication date Jun 30, 2016
- XINTEC INC.
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160133544
- Publication date May 12, 2016
- XINTEC INC.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160133588
- Publication date May 12, 2016
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160005787
- Publication date Jan 7, 2016
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150325557
- Publication date Nov 12, 2015
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150325551
- Publication date Nov 12, 2015
- XINTEC INC.
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150303178
- Publication date Oct 22, 2015
- XINTEC INC.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150255358
- Publication date Sep 10, 2015
- XINTEC INC.
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150145094
- Publication date May 28, 2015
- Xintec Inc.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150137341
- Publication date May 21, 2015
- Xintec Inc.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20150001710
- Publication date Jan 1, 2015
- XINTEC INC.
- Yi-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140225237
- Publication date Aug 14, 2014
- XINTEC INC.
- Chien-Hung LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140193950
- Publication date Jul 10, 2014
- Xintec Inc.
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140073089
- Publication date Mar 13, 2014
- Xintec Inc.
- Baw-Ching PERNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20130328147
- Publication date Dec 12, 2013
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MOSFET PACKAGE
- Publication number 20130193520
- Publication date Aug 1, 2013
- Xintec Inc.
- Baw-Ching PERNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130127001
- Publication date May 23, 2013
- Xintec Inc.
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20130020693
- Publication date Jan 24, 2013
- Xintec Inc.
- Ho-Yin Yiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Ying-Nan WEN

Person

Patents Grantslast 30 patents

Chip package and method for forming the same

Wafer-level packaging sensing device and method for forming the same

Chip package having chip connected to sensing device with redistrib...

Chip package

Method for forming chip package having chip connected to sensing de...

Chip package and fabrication method thereof

Chip module and method for forming the same

Method of fabricating chip package with laser

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package having a laser stop structure

Chip package having a dual through hole redistribution layer structure

Chip package having extended depression for electrical connection a...

Chip package and method for forming the same

Chip scale package structure and manufacturing method thereof

Chip package

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and manufacturing method thereof

Chip package structure and method for forming the same

Electronic device package and method for fabricating the same

Capacitive coupler packaging structure

Electronic device package and fabrication method thereof

Power MOSFET package

Electronic device package and fabrication method thereof

Interposer and manufacturing method thereof

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and manufacturing method thereof

Chip package and method for forming the same

Patents Applicationslast 30 patents

CHIP PACKAGE HAVING CHIP CONNECTED TO SENSING DEVICE WITH REDISTRIB...

SENSING DEVICE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP MODULE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE

CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

POWER MOSFET PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME