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Miao-li, TW
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Patents Grants
last 30 patents
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Patent Grant
Digital camera module using stacked chip package
Patent number
8,072,489
Issue date
Dec 6, 2011
Altus Technology Inc.
Ying-Cheng Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Clamping device for digital camera module
Patent number
7,374,431
Issue date
May 20, 2008
Altus Technology Inc.
Ying-Tang Su
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
Digital camera module using stacked chip package
Publication number
20070165136
Publication date
Jul 19, 2007
ALTUS TECHNOLOGY INC.
Ying-Cheng Wu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Stacked chip packaging structure
Publication number
20070152345
Publication date
Jul 5, 2007
ALTUS TECHNOLOGY INC.
Ying-Cheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Clamping device for digital camera module
Publication number
20070128910
Publication date
Jun 7, 2007
ALTUS TECHNOLOGY INC.
Ying-Tang Su
H04 - ELECTRIC COMMUNICATION TECHNIQUE