Yinuo Jin

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for cleaning semiconductor wafers
- Patent number 11,967,497
- Issue date Apr 23, 2024
- ACM Research (Shanghai) Inc.
- Jun Wang
- B08 - CLEANING
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,911,808
- Issue date Feb 27, 2024
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,848,217
- Issue date Dec 19, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,781,235
- Issue date Oct 10, 2023
- ACM RESEARCH (SHANGHAI), INC.
- Yinuo Jin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for cleaning semiconductor wafers
- Patent number 11,752,529
- Issue date Sep 12, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,638,937
- Issue date May 2, 2023
- ACM Research, Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,633,765
- Issue date Apr 25, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
Methods and system for cleaning semiconductor wafers
- Patent number 11,581,205
- Issue date Feb 14, 2023
- ACM Research, Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
Methods and apparatus for cleaning semiconductor wafers
- Patent number 11,257,667
- Issue date Feb 22, 2022
- ACM Research (Shanghai) Inc.
- Jun Wang
- B08 - CLEANING
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,141,762
- Issue date Oct 12, 2021
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,103,898
- Issue date Aug 31, 2021
- ACM Research, Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,037,804
- Issue date Jun 15, 2021
- ACM Research, Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and system for cleaning semiconductor wafers
- Patent number 10,910,244
- Issue date Feb 2, 2021
- ACM Research, Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
Apparatus and method for plating and/or polishing wafer
- Patent number 10,227,705
- Issue date Mar 12, 2019
- ACM Research (Shanghai) Inc.
- Jian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for pulse electrochemical polishing
- Patent number 9,865,476
- Issue date Jan 9, 2018
- ACM Research (Shanghai) Inc.
- Jian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nozzle for stress-free polishing metal layers on semiconductor wafers
- Patent number 9,724,803
- Issue date Aug 8, 2017
- ACM Research (Shanghai) Inc.
- Jian Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Vacuum chuck
- Patent number 9,558,985
- Issue date Jan 31, 2017
- ACM Research (Shanghai) Inc.
- Jian Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
- Publication number 20240279838
- Publication date Aug 22, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING...
- Publication number 20240035189
- Publication date Feb 1, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240018681
- Publication date Jan 18, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Yinuo Jin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20230256480
- Publication date Aug 17, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Application
METHOD OF REMOVING BARRIER LAYER
- Publication number 20230223301
- Publication date Jul 13, 2023
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20220139697
- Publication date May 5, 2022
- ACM Research (Shanghai) Inc.
- Jun Wang
- B08 - CLEANING
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20220081796
- Publication date Mar 17, 2022
- ACM Research (Shanghai) Inc.
- Yinuo Jin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20220032344
- Publication date Feb 3, 2022
- Hui WANG
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20220037172
- Publication date Feb 3, 2022
- ACM Research (Shanghai) Inc.
- Hui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20210402444
- Publication date Dec 30, 2021
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20210125848
- Publication date Apr 29, 2021
- ACM Research (Shanghai) Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20200335325
- Publication date Oct 22, 2020
- ACM Research (Shanghai) Inc.
- Jun Wang
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20190283090
- Publication date Sep 19, 2019
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20190287824
- Publication date Sep 19, 2019
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20180151398
- Publication date May 31, 2018
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20180071794
- Publication date Mar 15, 2018
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
METHOD FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20180071795
- Publication date Mar 15, 2018
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
APPARATUS AND METHOD FOR PLATING AND/OR POLISHING WAFER
- Publication number 20160115613
- Publication date Apr 28, 2016
- ACM Research (Shanghai) Inc.
- Jian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR PULSE ELECTROCHEMICAL POLISHING
- Publication number 20150155183
- Publication date Jun 4, 2015
- ACM Research (Shanghai) Inc.
- Jian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NOZZLE FOR STRESS-FREE POLISHING METAL LAYERS ON SEMICONDUCTOR WAFERS
- Publication number 20150072599
- Publication date Mar 12, 2015
- ACM Research (Shanghai) Inc.
- Jian Wang
- B24 - GRINDING POLISHING
Information Patent Application
VACUUM CHUCK
- Publication number 20150069723
- Publication date Mar 12, 2015
- ACM Research (Shanghai) Inc,.
- Jian Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Methods and apparatus for cleaning semiconductor wafers

System for cleaning semiconductor wafers

Methods and apparatus for cleaning substrates

Plating apparatus and plating method

Method for cleaning semiconductor wafers

Methods and apparatus for cleaning substrates

System for cleaning semiconductor wafers

Methods and system for cleaning semiconductor wafers

Methods and apparatus for cleaning semiconductor wafers

System for cleaning semiconductor wafers

Methods and apparatus for cleaning substrates

Methods and apparatus for cleaning substrates

Methods and system for cleaning semiconductor wafers

Apparatus and method for plating and/or polishing wafer

Method and apparatus for pulse electrochemical polishing

Nozzle for stress-free polishing metal layers on semiconductor wafers

Vacuum chuck

Patents Applicationslast 30 patents

ELECTROPLATING DEVICE AND ELECTROPLATING METHOD

CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING...

PLATING APPARATUS AND PLATING METHOD

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHOD OF REMOVING BARRIER LAYER

METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

PLATING APPARATUS AND PLATING METHOD

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHODS AND SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHOD FOR CLEANING SEMICONDUCTOR WAFERS

APPARATUS AND METHOD FOR PLATING AND/OR POLISHING WAFER

METHOD AND APPARATUS FOR PULSE ELECTROCHEMICAL POLISHING

NOZZLE FOR STRESS-FREE POLISHING METAL LAYERS ON SEMICONDUCTOR WAFERS

VACUUM CHUCK