Yong Loo Neo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,698,295
- Issue date Apr 15, 2014
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 8,564,106
- Issue date Oct 22, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,304,894
- Issue date Nov 6, 2012
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,884,007
- Issue date Feb 8, 2011
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 7,820,484
- Issue date Oct 26, 2010
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers and methods for manufacturing such microele...
- Patent number 7,659,134
- Issue date Feb 9, 2010
- Aptina Imaging Corporation
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,579,681
- Issue date Aug 25, 2009
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,553,697
- Issue date Jun 30, 2009
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multichip wafer level packages and computing syste...
- Patent number 7,485,562
- Issue date Feb 3, 2009
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a conductive via through a wafer
- Patent number 7,375,009
- Issue date May 20, 2008
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,368,374
- Issue date May 6, 2008
- Micron Technology Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,304,375
- Issue date Dec 4, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless packaging for image sensor devices
- Patent number 7,274,094
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,271,027
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,193,312
- Issue date Mar 20, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,173,330
- Issue date Feb 6, 2007
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless packaging for image sensor devices and methods of assembly
- Patent number 7,112,471
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 7,087,992
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package and method of fabricating same
- Patent number 6,987,031
- Issue date Jan 17, 2006
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip wafer level system packages and methods of forming same
- Patent number 6,964,881
- Issue date Nov 15, 2005
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 6,958,537
- Issue date Oct 25, 2005
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 6,825,553
- Issue date Nov 30, 2004
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20120119263
- Publication date May 17, 2012
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20080211113
- Publication date Sep 4, 2008
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super High Density Module with Integrated Wafer Level Packages
- Publication number 20070264751
- Publication date Nov 15, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070152327
- Publication date Jul 5, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070145558
- Publication date Jun 28, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20070059862
- Publication date Mar 15, 2007
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001143
- Publication date Jan 5, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20050236709
- Publication date Oct 27, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making multichip wafer level packages and computing syste...
- Publication number 20050116337
- Publication date Jun 2, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20050073029
- Publication date Apr 7, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20050048695
- Publication date Mar 3, 2005
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20050006748
- Publication date Jan 13, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level system packages and methods of forming same
- Publication number 20040229400
- Publication date Nov 18, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless packaging for image sensor devices and methods of assembly
- Publication number 20040084741
- Publication date May 6, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20040046250
- Publication date Mar 11, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20040042190
- Publication date Mar 4, 2004
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless packaging for image sensor devices and methods of assembly
- Publication number 20040041221
- Publication date Mar 4, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip wafer level system packages and methods of forming same
- Publication number 20040043533
- Publication date Mar 4, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level packaging
- Publication number 20030232488
- Publication date Dec 18, 2003
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20030227079
- Publication date Dec 11, 2003
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS

Yong Loo Neo

Person

Patents Grantslast 30 patents

Super high-density module with integrated wafer level packages

Wafer level packaging

Super high-density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Wafer level packaging

Microelectronic imagers and methods for manufacturing such microele...

Super high density module with integrated wafer level packages

Multiple chip semiconductor package

Method of making multichip wafer level packages and computing syste...

Method of forming a conductive via through a wafer

Super high density module with integrated wafer level packages

Castellation wafer level packaging of integrated circuit chips

Leadless packaging for image sensor devices

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Multi-chip wafer level system packages and methods of forming same

Multiple chip semiconductor package

Multichip wafer level packages and computing systems incorporating...

Patents Applicationslast 30 patents

WAFER LEVEL PACKAGING

WAFER LEVEL PACKAGING

Super High Density Module with Integrated Wafer Level Packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Multiple chip semiconductor package

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package and method of fabricating same

Method of making multichip wafer level packages and computing syste...

Multichip wafer level packages and computing systems incorporating...

Super high density module with integrated wafer level packages

Multiple chip semiconductor package

Multichip wafer level system packages and methods of forming same

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Leadless packaging for image sensor devices and methods of assembly

Multi-chip wafer level system packages and methods of forming same

Wafer level packaging

Super high density module with integrated wafer level packages