Yonggang Jin

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon photonic package and method of fabricating the same
- Patent number 12,092,874
- Issue date Sep 17, 2024
- OIP TECHNOLOGY PTE LTD.
- Yonggang Jin
- G02 - OPTICS
Information Patent Grant
Compact microelectronic integrated gas sensor
- Patent number 11,231,386
- Issue date Jan 25, 2022
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level packaging, optical detection sensor and method of formi...
- Patent number 10,381,504
- Issue date Aug 13, 2019
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor packages with pillar and bump structures
- Patent number 10,128,207
- Issue date Nov 13, 2018
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor optical package and method
- Patent number 10,115,842
- Issue date Oct 30, 2018
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging, optical detection sensor and method of formi...
- Patent number 9,991,409
- Issue date Jun 5, 2018
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Compact microelectronic integrated gas sensor
- Patent number 9,851,328
- Issue date Dec 26, 2017
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor optical package and method
- Patent number 9,831,357
- Issue date Nov 28, 2017
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an optical proximity sensor by attaching an optic...
- Patent number 9,780,080
- Issue date Oct 3, 2017
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit package and method of forming the same
- Patent number 9,455,241
- Issue date Sep 27, 2016
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor device with frame passageways and related methods
- Patent number 9,448,216
- Issue date Sep 20, 2016
- STMicroelectronics Pte Ltd
- Yonggang Jin
- G01 - MEASURING TESTING
Information Patent Grant
System-in-packages and methods for forming same
- Patent number 9,252,030
- Issue date Feb 2, 2016
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device with IR filter and related methods
- Patent number 9,059,058
- Issue date Jun 16, 2015
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronics assembly and method of making optoelectronics assembly
- Patent number 9,018,645
- Issue date Apr 28, 2015
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing warpage for fan-out wafer level packaging
- Patent number 9,012,269
- Issue date Apr 21, 2015
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved pillar bump process and structure
- Patent number 9,013,037
- Issue date Apr 21, 2015
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making image sensors using wafer-level processing and as...
- Patent number 9,013,017
- Issue date Apr 21, 2015
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for placing solder balls
- Patent number 8,937,008
- Issue date Jan 20, 2015
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wafer level package for 3D and package-on-package applicat...
- Patent number 8,916,481
- Issue date Dec 23, 2014
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma treatment on semiconductor wafers
- Patent number 8,912,653
- Issue date Dec 16, 2014
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrically conductive vias having dif...
- Patent number 8,860,228
- Issue date Oct 14, 2014
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating land grid array semiconductor package
- Patent number 8,860,207
- Issue date Oct 14, 2014
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a contact recess and related methods
- Patent number 8,836,117
- Issue date Sep 16, 2014
- STMicroelectronics Asia Pacific PTE Ltd.
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wafer level ball grid array bar systems and methods
- Patent number 8,796,139
- Issue date Aug 5, 2014
- STMicroelectronics Pte Ltd
- Anandan Ramasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wafer level package for 3D and package-on-package applicat...
- Patent number 8,779,601
- Issue date Jul 15, 2014
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through hole via filling using electroless plating
- Patent number 8,766,422
- Issue date Jul 1, 2014
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer warpage adjustment
- Patent number 8,728,831
- Issue date May 20, 2014
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating land grid array semiconductor package
- Patent number 8,664,044
- Issue date Mar 4, 2014
- STMicroelectronics Pte Ltd
- Yonggang Jin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Through hole via filling using electroless plating
- Patent number 8,617,987
- Issue date Dec 31, 2013
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing vias in fan-out wafers using dry film and cond...
- Patent number 8,535,980
- Issue date Sep 17, 2013
- STMicroelectronics Pte Ltd
- Puay Gek Chua
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE FOR ADVANCED PACKAGING AND METHOD FOR THE SAME
- Publication number 20240304573
- Publication date Sep 12, 2024
- OIP Technology Pte Ltd
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240304464
- Publication date Sep 12, 2024
- OIP Technology Pte Ltd
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240036262
- Publication date Feb 1, 2024
- OIP Technology Pte Ltd
- Yonggang JIN
- G02 - OPTICS
Information Patent Application
WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMI...
- Publication number 20180248068
- Publication date Aug 30, 2018
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
- Publication number 20180229334
- Publication date Aug 16, 2018
- STMicroelectronics Pte Ltd
- Yonggang JIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT MICROELECTRONIC INTEGRATED GAS SENSOR
- Publication number 20180067074
- Publication date Mar 8, 2018
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR OPTICAL PACKAGE AND METHOD
- Publication number 20180053861
- Publication date Feb 22, 2018
- STMicroelectronics Pte Ltd
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PILLAR AND BUMP STRUCTURES
- Publication number 20160293559
- Publication date Oct 6, 2016
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
- Publication number 20160184938
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Yonggang JIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS SENSOR DEVICE WITH FRAME PASSAGEWAYS AND RELATED METHODS
- Publication number 20160103109
- Publication date Apr 14, 2016
- STMicroelectronics Pte Ltd
- Yonggang JIN
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MAKING AN OPTICAL PROXIMITY SENSOR
- Publication number 20160104698
- Publication date Apr 14, 2016
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMI...
- Publication number 20160099373
- Publication date Apr 7, 2016
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT MICROELECTRONIC INTEGRATED GAS SENSOR
- Publication number 20160047774
- Publication date Feb 18, 2016
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM-IN-PACKAGES AND METHODS FOR FORMING SAME
- Publication number 20160035590
- Publication date Feb 4, 2016
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20150303168
- Publication date Oct 22, 2015
- STMicroelectronics Pte Ltd
- YONGGANG JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONICS ASSEMBLY AND METHOD OF MAKING OPTOELECTRONICS ASSEMBLY
- Publication number 20150060891
- Publication date Mar 5, 2015
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE WITH INFRARED FILTER ADHESIVELY SECURED TO IMAG...
- Publication number 20150028187
- Publication date Jan 29, 2015
- STMicroelectronics Pte Ltd
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR OPTICAL PACKAGE AND METHOD
- Publication number 20140353788
- Publication date Dec 4, 2014
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING LAND GRID ARRAY SEMICONDUCTOR PACKAGE
- Publication number 20140191387
- Publication date Jul 10, 2014
- STMicroelectronics Grenoble 2 SAS
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRICALLY CONDUCTIVE VIAS HAVING DIF...
- Publication number 20140175649
- Publication date Jun 26, 2014
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE WITH IR FILTER AND RELATED METHODS
- Publication number 20140110565
- Publication date Apr 24, 2014
- STMicroelectronics Asia Pacific PTE LTD (Singapore)
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING IMAGE SENSORS USING WAFER-LEVEL PROCESSING AND AS...
- Publication number 20140103476
- Publication date Apr 17, 2014
- STMicroelectronics Asia Pacific Pte. Ltd.
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A CONTACT RECESS AND RELATED METHODS
- Publication number 20140103521
- Publication date Apr 17, 2014
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A DOUBLE-SIDED FANOUT SEMICONDUCTOR PACKAGE WITH...
- Publication number 20140057394
- Publication date Feb 27, 2014
- STMicroelectronics Pte Ltd
- Anandan Ramasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED WAFER LEVEL BALL GRID ARRAY BAR SYSTEMS AND METHODS
- Publication number 20130168858
- Publication date Jul 4, 2013
- STMicroelectronics Pte Ltd
- Anandan Ramasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PLACING SOLDER BALLS
- Publication number 20130171816
- Publication date Jul 4, 2013
- STMicroelectronics Pte Ltd
- Yonggang Jin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMI...
- Publication number 20130119282
- Publication date May 16, 2013
- STMicroelectronics Pte Ltd
- Yonggang Jin
- G01 - MEASURING TESTING
Information Patent Application
LAND GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20130105982
- Publication date May 2, 2013
- STMICROELECTRONICS GRENOBLE2 SAS
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED WAFER LEVEL PACKAGE FOR 3D AND PACKAGE-ON-PACKAGE APPLICAT...
- Publication number 20130105991
- Publication date May 2, 2013
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED WAFER LEVEL PACKAGE FOR 3D AND PACKAGE-ON-PACKAGE APPLICAT...
- Publication number 20130105973
- Publication date May 2, 2013
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS

Yonggang Jin

Person

Patents Grantslast 30 patents

Silicon photonic package and method of fabricating the same

Compact microelectronic integrated gas sensor

Wafer level packaging, optical detection sensor and method of formi...

Semiconductor packages with pillar and bump structures

Semiconductor optical package and method

Wafer level packaging, optical detection sensor and method of formi...

Compact microelectronic integrated gas sensor

Semiconductor optical package and method

Method for making an optical proximity sensor by attaching an optic...

Integrated circuit package and method of forming the same

Gas sensor device with frame passageways and related methods

System-in-packages and methods for forming same

Image sensor device with IR filter and related methods

Optoelectronics assembly and method of making optoelectronics assembly

Reducing warpage for fan-out wafer level packaging

Semiconductor package with improved pillar bump process and structure

Method for making image sensors using wafer-level processing and as...

Apparatus and method for placing solder balls

Embedded wafer level package for 3D and package-on-package applicat...

Plasma treatment on semiconductor wafers

Electronic device including electrically conductive vias having dif...

Method of fabricating land grid array semiconductor package

Electronic device having a contact recess and related methods

Embedded wafer level ball grid array bar systems and methods

Embedded wafer level package for 3D and package-on-package applicat...

Through hole via filling using electroless plating

Reconstituted wafer warpage adjustment

Method of fabricating land grid array semiconductor package

Through hole via filling using electroless plating

Method for producing vias in fan-out wafers using dry film and cond...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE FOR ADVANCED PACKAGING AND METHOD FOR THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SILICON PHOTONIC PACKAGE AND METHOD OF FABRICATING THE SAME

WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMI...

CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL

COMPACT MICROELECTRONIC INTEGRATED GAS SENSOR

SEMICONDUCTOR OPTICAL PACKAGE AND METHOD

SEMICONDUCTOR PACKAGES WITH PILLAR AND BUMP STRUCTURES

CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL

GAS SENSOR DEVICE WITH FRAME PASSAGEWAYS AND RELATED METHODS

METHOD FOR MAKING AN OPTICAL PROXIMITY SENSOR

WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMI...

COMPACT MICROELECTRONIC INTEGRATED GAS SENSOR

SYSTEM-IN-PACKAGES AND METHODS FOR FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME

OPTOELECTRONICS ASSEMBLY AND METHOD OF MAKING OPTOELECTRONICS ASSEMBLY

IMAGE SENSOR DEVICE WITH INFRARED FILTER ADHESIVELY SECURED TO IMAG...

SEMICONDUCTOR OPTICAL PACKAGE AND METHOD

METHOD OF FABRICATING LAND GRID ARRAY SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE INCLUDING ELECTRICALLY CONDUCTIVE VIAS HAVING DIF...

IMAGE SENSOR DEVICE WITH IR FILTER AND RELATED METHODS

METHOD FOR MAKING IMAGE SENSORS USING WAFER-LEVEL PROCESSING AND AS...

ELECTRONIC DEVICE HAVING A CONTACT RECESS AND RELATED METHODS

METHOD FOR MAKING A DOUBLE-SIDED FANOUT SEMICONDUCTOR PACKAGE WITH...

EMBEDDED WAFER LEVEL BALL GRID ARRAY BAR SYSTEMS AND METHODS

APPARATUS AND METHOD FOR PLACING SOLDER BALLS

WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMI...

LAND GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

EMBEDDED WAFER LEVEL PACKAGE FOR 3D AND PACKAGE-ON-PACKAGE APPLICAT...

EMBEDDED WAFER LEVEL PACKAGE FOR 3D AND PACKAGE-ON-PACKAGE APPLICAT...