Yongjun Jeff Hu

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices including conductive structures
- Patent number 12,171,101
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and memory devices including conductive lev...
- Patent number 12,170,250
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Plasma doping of gap fill materials
- Patent number 12,040,182
- Issue date Jul 16, 2024
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and memory device including conductive lines and contacts...
- Patent number 11,990,367
- Issue date May 21, 2024
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with low density thermal barrier
- Patent number 11,984,382
- Issue date May 14, 2024
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,844,220
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry comprising a memory array comprising strings o...
- Patent number 11,792,983
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising threshold switching materials
- Patent number 11,672,191
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Tsz W. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses having strings of memory cells including a...
- Patent number 11,665,893
- Issue date May 30, 2023
- Micron Technology, Inc.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electrode material chemistry
- Patent number 11,659,778
- Issue date May 23, 2023
- Micron Technology, Inc.
- Pengyuan Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming tungsten structures
- Patent number 11,646,206
- Issue date May 9, 2023
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming NAND cell units
- Patent number 11,646,363
- Issue date May 9, 2023
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
WSiGe electrode structures for memory devices, and associated devic...
- Patent number 11,631,811
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,621,273
- Issue date Apr 4, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive levels having varying...
- Patent number 11,594,495
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,569,120
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry comprising a memory array comprising strings o...
- Patent number 11,552,090
- Issue date Jan 10, 2023
- Micron Technology, Inc.
- Daniel Billingsley
- G11 - INFORMATION STORAGE
Information Patent Grant
Fabrication of electrodes for memory cells
- Patent number 11,545,623
- Issue date Jan 3, 2023
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including an etch stop...
- Patent number 11,527,548
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Haoyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive structures, and relate...
- Patent number 11,527,546
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma doping of gap fill materials
- Patent number 11,508,573
- Issue date Nov 22, 2022
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 11,476,274
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with low density thermal barrier
- Patent number 11,158,561
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate diffusion barriers and related devices and methods
- Patent number 11,133,461
- Issue date Sep 28, 2021
- Intel Corporation
- Christopher Petz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, methods of forming a device, and memory devices
- Patent number 11,127,745
- Issue date Sep 21, 2021
- Micron Technology, Inc.
- Kentaro Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 11,107,823
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus comprising structures including contact vias and conducti...
- Patent number 11,101,171
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,011,408
- Issue date May 18, 2021
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atom implantation for reduction of compressive stress
- Patent number 11,011,378
- Issue date May 18, 2021
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contacts for semiconductor structures
- Patent number 10,998,481
- Issue date May 4, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250015245
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER
- Publication number 20240347418
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND MEMORY DEVICES INCLUDING CONDUCTIVE LINES AND INTER...
- Publication number 20240266214
- Publication date Aug 8, 2024
- Lodestar Licensing Group LLC
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS
- Publication number 20240130128
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Yongjun Hu
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240071498
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yongjun Jeff Hu
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240071931
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Tom George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240064982
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STACKS FOR CMOS SCALING
- Publication number 20240040790
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20230422503
- Publication date Dec 28, 2023
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20230397423
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Pengyuan Zheng
Information Patent Application
Semiconductor Constructions, Methods Of Forming Transistor Gates, A...
- Publication number 20230223461
- Publication date Jul 13, 2023
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...
- Publication number 20230154856
- Publication date May 18, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230104297
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20230099418
- Publication date Mar 30, 2023
- Micron Technology, Inc.
- Daniel Billingsley
- G11 - INFORMATION STORAGE
Information Patent Application
PLASMA DOPING OF GAP FILL MATERIALS
- Publication number 20230044518
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor And Memory Circuitry Comprising Strings Of Memory Cells
- Publication number 20230016742
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES
- Publication number 20220415917
- Publication date Dec 29, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE STRUCTURES FOR MEMORY DEVICES, AND ASSOCIATED DEVICES AND...
- Publication number 20220359822
- Publication date Nov 10, 2022
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...
- Publication number 20220310522
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20220068945
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20220068959
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES, AND RELATE...
- Publication number 20220037350
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20220020763
- Publication date Jan 20, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER
- Publication number 20220020662
- Publication date Jan 20, 2022
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING CONDUCTIVE LINES AND CONTACTS, AND RELATED METH...
- Publication number 20210375670
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210358940
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20210257526
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRODE MATERIAL CHEMISTRY
- Publication number 20210249598
- Publication date Aug 12, 2021
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210233801
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming NAND Cell Units
- Publication number 20210210623
- Publication date Jul 8, 2021
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS

Yongjun Jeff Hu

Person

Patents Grantslast 30 patents

Microelectronic devices including conductive structures

Microelectronic devices and memory devices including conductive lev...

Plasma doping of gap fill materials

Apparatus and memory device including conductive lines and contacts...

Memory device with low density thermal barrier

Integrated assemblies and methods of forming integrated assemblies

Integrated circuitry comprising a memory array comprising strings o...

Semiconductor devices comprising threshold switching materials

Methods and apparatuses having strings of memory cells including a...

Composite electrode material chemistry

Methods of forming tungsten structures

Methods of forming NAND cell units

WSiGe electrode structures for memory devices, and associated devic...

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices including conductive levels having varying...

Memory arrays and methods used in forming a memory array comprising...

Integrated circuitry comprising a memory array comprising strings o...

Fabrication of electrodes for memory cells

Semiconductor devices and electronic systems including an etch stop...

Microelectronic devices including conductive structures, and relate...

Plasma doping of gap fill materials

Memory arrays comprising strings of memory cells and methods used i...

Memory device with low density thermal barrier

Laminate diffusion barriers and related devices and methods

Devices, methods of forming a device, and memory devices

Integrated structures and methods of forming integrated structures

Apparatus comprising structures including contact vias and conducti...

Memory arrays and methods used in forming a memory array comprising...

Atom implantation for reduction of compressive stress

Ohmic contacts for semiconductor structures

Patents Applicationslast 30 patents

OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES

MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER

APPARATUSES AND MEMORY DEVICES INCLUDING CONDUCTIVE LINES AND INTER...

SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Assemblies and Methods of Forming Integrated Assemblies

METAL GATE STACKS FOR CMOS SCALING

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

Semiconductor Constructions, Methods Of Forming Transistor Gates, A...

MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

PLASMA DOPING OF GAP FILL MATERIALS

Transistor And Memory Circuitry Comprising Strings Of Memory Cells

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES

ELECTRODE STRUCTURES FOR MEMORY DEVICES, AND ASSOCIATED DEVICES AND...

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES, AND RELATE...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

MEMORY DEVICE WITH LOW DENSITY THERMAL BARRIER

APPARATUS INCLUDING CONDUCTIVE LINES AND CONTACTS, AND RELATED METH...

Integrated Assemblies and Methods of Forming Integrated Assemblies

OHMIC CONTACTS FOR SEMICONDUCTOR STRUCTURES

COMPOSITE ELECTRODE MATERIAL CHEMISTRY

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Methods Of Forming NAND Cell Units