Yongqi HU

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Window in thin polishing pad
- Patent number 11,826,875
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with secondary window seal
- Patent number 11,618,124
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Grant
Window in thin polishing pad
- Patent number 11,161,218
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with secondary window seal
- Patent number 10,744,618
- Issue date Aug 18, 2020
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring for lower wafer defects
- Patent number 10,399,202
- Issue date Sep 3, 2019
- Applied Materials, Inc.
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Method of placing window in thin polishing pad
- Patent number 10,213,894
- Issue date Feb 26, 2019
- Applied Materials, Inc.
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Grant
External clamp ring for a chemical mechanical polishing carrier head
- Patent number 10,029,346
- Issue date Jul 24, 2018
- Applied Materials, Inc.
- Patrick Ala
- B24 - GRINDING POLISHING
Information Patent Grant
Corrosion resistant retaining rings
- Patent number 9,744,640
- Issue date Aug 29, 2017
- Applied Materials, Inc.
- Gangadhar Sheelavant
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with secondary window seal
- Patent number 9,731,397
- Issue date Aug 15, 2017
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with secondary window seal
- Patent number 8,961,266
- Issue date Feb 24, 2015
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for evaluating polishing pad conditioning
- Patent number 7,699,972
- Issue date Apr 20, 2010
- Applied Materials, Inc.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electrochemical mechanical processing
- Patent number 7,678,245
- Issue date Mar 16, 2010
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and composition for conductive material removal by electroc...
- Patent number 7,582,564
- Issue date Sep 1, 2009
- Applied Materials, Inc.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrochemically mechanically polishing a conductive ma...
- Patent number 7,576,007
- Issue date Aug 18, 2009
- Applied Materials, Inc.
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacts for electrochemical processing
- Patent number 7,569,134
- Issue date Aug 4, 2009
- Applied Materials, Inc.
- Paul Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Full sequence metal and barrier layer electrochemical mechanical pr...
- Patent number 7,446,041
- Issue date Nov 4, 2008
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,374,644
- Issue date May 20, 2008
- Applied Materials, Inc.
- Paul D. Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad assembly for electrochemical mechanical processing
- Patent number 7,344,431
- Issue date Mar 18, 2008
- Applied Materials, Inc.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,323,416
- Issue date Jan 29, 2008
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacts for electrochemical processing
- Patent number 7,303,662
- Issue date Dec 4, 2007
- Applied Materials, Inc.
- Rashid Mavliev
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,232,514
- Issue date Jun 19, 2007
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hydrogen bubble reduction on the cathode using double-cell designs
- Patent number 7,229,535
- Issue date Jun 12, 2007
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for reduced wear polishing pad conditioning
- Patent number 7,210,988
- Issue date May 1, 2007
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 7,207,878
- Issue date Apr 24, 2007
- Applied Materials, Inc.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,160,432
- Issue date Jan 9, 2007
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and composition for polishing a substrate
- Patent number 7,128,825
- Issue date Oct 31, 2006
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacts for electrochemical processing
- Patent number 7,125,477
- Issue date Oct 24, 2006
- Applied Materials, Inc.
- Paul Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Full sequence metal and barrier layer electrochemical mechanical pr...
- Patent number 7,084,064
- Issue date Aug 1, 2006
- Applied Materials, Inc.
- Feng Q. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad assembly for electrochemical mechanical processing
- Patent number 7,077,721
- Issue date Jul 18, 2006
- Applied Materials, Inc.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polishing article for electrochemical mechanical polishing
- Patent number 6,991,528
- Issue date Jan 31, 2006
- Applied Materials, Inc.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Polishing Pad with Secondary Window Seal
- Publication number 20230278158
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Application
WINDOW IN THIN POLISHING PAD
- Publication number 20220023990
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad with Secondary Window Seal
- Publication number 20200361054
- Publication date Nov 19, 2020
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Application
Window in Thin Polishing Pad
- Publication number 20190152017
- Publication date May 23, 2019
- Applied Materials, Inc.
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad with Secondary Window Seal
- Publication number 20180065227
- Publication date Mar 8, 2018
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING TOOL WITH ROBOT ACCESS TO CASSETTES
- Publication number 20180056479
- Publication date Mar 1, 2018
- Applied Materials, Inc.
- Yongqi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW IN THIN POLISHING PAD
- Publication number 20170246722
- Publication date Aug 31, 2017
- Applied Materials, Inc.
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Application
EXTERNAL CLAMP RING FOR A CHECMICAL MECHANICAL POLISHING CARRIER HEAD
- Publication number 20170106496
- Publication date Apr 20, 2017
- Applied Materials, Inc.
- Patrick ALA
- B24 - GRINDING POLISHING
Information Patent Application
CORROSION RESISTANT RETAINING RINGS
- Publication number 20170106495
- Publication date Apr 20, 2017
- Applied Materials, Inc.
- Gangadhar SHEELAVANT
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING RING FOR LOWER WAFER DEFECTS
- Publication number 20160271750
- Publication date Sep 22, 2016
- Applied Materials, Inc.
- Yongqi HU
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad with Secondary Window Seal
- Publication number 20150126100
- Publication date May 7, 2015
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad with Secondary Window Seal
- Publication number 20140273762
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- Rajkumar Alagarsamy
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Planarization Pad With Surface Characteristics
- Publication number 20110105000
- Publication date May 5, 2011
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Application
Pad for electrochemical processing
- Publication number 20090120803
- Publication date May 14, 2009
- Paul Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE CONTROL FOR ECMP PROCESS
- Publication number 20090036032
- Publication date Feb 5, 2009
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PAD WITH SHALLOW CELLS FOR ELECTROCHEMICAL MECHANICAL PROCESSING
- Publication number 20080293343
- Publication date Nov 27, 2008
- Yuchun Wang
- B24 - GRINDING POLISHING
Information Patent Application
CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20080156657
- Publication date Jul 3, 2008
- Paul D. Butterfield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Polishing Article for Electrochemical Mechanical Polishing
- Publication number 20080108288
- Publication date May 8, 2008
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
- Publication number 20070295611
- Publication date Dec 27, 2007
- FENG Q. LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20070254485
- Publication date Nov 1, 2007
- Daxin Mao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for high copper removal rate with good planarization and su...
- Publication number 20070235344
- Publication date Oct 11, 2007
- APPLIED MATERIALS, INC.
- Renhe Jia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Temperature control for ECMP process
- Publication number 20070227901
- Publication date Oct 4, 2007
- APPLIED MATERIALS, INC.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOFT CONDUCTIVE POLYMER PROCESSING PAD AND METHOD FOR FABRICATING T...
- Publication number 20070218587
- Publication date Sep 20, 2007
- APPLIED MATERIALS, INC.
- Yuchun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for evaluating polishing pad conditioning
- Publication number 20070209946
- Publication date Sep 13, 2007
- APPLIED MATERIALS, INC.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for electrochemically mechanically polishing a conductive ma...
- Publication number 20070161250
- Publication date Jul 12, 2007
- APPLIED MATERIALS, INC.
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and a method for electrochemical mechanical processing wi...
- Publication number 20070151867
- Publication date Jul 5, 2007
- APPLIED MATERIALS, INC.
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fully conductive pad for electrochemical mechanical processing
- Publication number 20070153453
- Publication date Jul 5, 2007
- APPLIED MATERIALS, INC.
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROC...
- Publication number 20070144915
- Publication date Jun 28, 2007
- APPLIED MATERIALS, INC.
- Yuan A. Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for planarizing a substrate with low fluid con...
- Publication number 20070131562
- Publication date Jun 14, 2007
- APPLIED MATERIALS, INC.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING
- Publication number 20070034506
- Publication date Feb 15, 2007
- Yongqi Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Window in thin polishing pad

Polishing pad with secondary window seal

Window in thin polishing pad

Polishing pad with secondary window seal

Retaining ring for lower wafer defects

Method of placing window in thin polishing pad

External clamp ring for a chemical mechanical polishing carrier head

Corrosion resistant retaining rings

Polishing pad with secondary window seal

Polishing pad with secondary window seal

Method and apparatus for evaluating polishing pad conditioning

Method and apparatus for electrochemical mechanical processing

Process and composition for conductive material removal by electroc...

Method for electrochemically mechanically polishing a conductive ma...

Contacts for electrochemical processing

Full sequence metal and barrier layer electrochemical mechanical pr...

Conductive polishing article for electrochemical mechanical polishing

Pad assembly for electrochemical mechanical processing

Method and composition for polishing a substrate

Contacts for electrochemical processing

Method and composition for polishing a substrate

Hydrogen bubble reduction on the cathode using double-cell designs

Method and apparatus for reduced wear polishing pad conditioning

Conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

Method and composition for polishing a substrate

Contacts for electrochemical processing

Full sequence metal and barrier layer electrochemical mechanical pr...

Pad assembly for electrochemical mechanical processing

Conductive polishing article for electrochemical mechanical polishing

Patents Applicationslast 30 patents

Polishing Pad with Secondary Window Seal

WINDOW IN THIN POLISHING PAD

Polishing Pad with Secondary Window Seal

Window in Thin Polishing Pad

Polishing Pad with Secondary Window Seal

CHEMICAL MECHANICAL POLISHING TOOL WITH ROBOT ACCESS TO CASSETTES

WINDOW IN THIN POLISHING PAD

EXTERNAL CLAMP RING FOR A CHECMICAL MECHANICAL POLISHING CARRIER HEAD

CORROSION RESISTANT RETAINING RINGS

RETAINING RING FOR LOWER WAFER DEFECTS

Polishing Pad with Secondary Window Seal

Polishing Pad with Secondary Window Seal

Chemical Mechanical Planarization Pad With Surface Characteristics

Pad for electrochemical processing

TEMPERATURE CONTROL FOR ECMP PROCESS

PAD WITH SHALLOW CELLS FOR ELECTROCHEMICAL MECHANICAL PROCESSING

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

Conductive Polishing Article for Electrochemical Mechanical Polishing

METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE

ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING

Process for high copper removal rate with good planarization and su...

Temperature control for ECMP process

SOFT CONDUCTIVE POLYMER PROCESSING PAD AND METHOD FOR FABRICATING T...

Method and apparatus for evaluating polishing pad conditioning

Method for electrochemically mechanically polishing a conductive ma...

Apparatus and a method for electrochemical mechanical processing wi...

Fully conductive pad for electrochemical mechanical processing

PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROC...

Method and apparatus for planarizing a substrate with low fluid con...

PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING