Yoshifumi TAKATA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device having surface protect...
- Patent number 8,716,122
- Issue date May 6, 2014
- Renesas Electronics Corporation
- Takuro Honma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having surface protective films on bond pad
- Patent number 8,390,134
- Issue date Mar 5, 2013
- Renesas Electronics Corporation
- Takuro Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer wiring structure and pad e...
- Patent number 6,890,857
- Issue date May 10, 2005
- Renesas Technology Corp.
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number 6,777,738
- Issue date Aug 17, 2004
- Renesas Technology Corp.
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an improved interlayer conductor connec...
- Patent number 6,727,170
- Issue date Apr 27, 2004
- Renesas Technology Corp.
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device having capacitive element
- Patent number 6,500,675
- Issue date Dec 31, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer wiring structure and pad e...
- Patent number 6,476,491
- Issue date Nov 5, 2002
- Mitsubishi Denki Kabushiki Kaihsa
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved interconnection-wiring structures
- Patent number 6,448,658
- Issue date Sep 10, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,319,812
- Issue date Nov 20, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Anma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an improved interlayer conductor connec...
- Patent number 6,278,187
- Issue date Aug 21, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing interconnection structure of a semiconducto...
- Patent number 5,712,140
- Issue date Jan 27, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Atsushi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an interconnection structure of a semiconductor de...
- Patent number 5,561,084
- Issue date Oct 1, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnection structure for a semiconductor device
- Patent number 5,475,267
- Issue date Dec 12, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Atsushi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor device
- Patent number 5,442,238
- Issue date Aug 15, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnection structure for a semiconductor device
- Patent number 5,313,100
- Issue date May 17, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Atsushi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a multilayer wiring structure employing me...
- Patent number 4,962,061
- Issue date Oct 9, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130149855
- Publication date Jun 13, 2013
- RENESAS ELECTRONICS CORPORATION
- Takuro HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100295044
- Publication date Nov 25, 2010
- RENESAS TECHNOLOGY CORP.
- Takuro HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having capacitive element and manufacturing me...
- Publication number 20030109100
- Publication date Jun 12, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a multilayer wiring structure and pad e...
- Publication number 20030052339
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20020140017
- Publication date Oct 3, 2002
- YOSHIFUMI TAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020093097
- Publication date Jul 18, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Takao Kamoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having capacitive element and manufacturing me...
- Publication number 20020074587
- Publication date Jun 20, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20010052650
- Publication date Dec 20, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having an improved interlayer conductor connec...
- Publication number 20010050440
- Publication date Dec 13, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Yoshifumi Takata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same and appara...
- Publication number 20010008311
- Publication date Jul 19, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS

Yoshifumi TAKATA

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device having surface protect...

Semiconductor device having surface protective films on bond pad

Semiconductor device having a multilayer wiring structure and pad e...

Semiconductor integrated circuit

Semiconductor device having an improved interlayer conductor connec...

Manufacturing method of semiconductor device having capacitive element

Semiconductor device having a multilayer wiring structure and pad e...

Semiconductor device having improved interconnection-wiring structures

Method of manufacturing a semiconductor device

Semiconductor device having an improved interlayer conductor connec...

Method of manufacturing interconnection structure of a semiconducto...

Method of making an interconnection structure of a semiconductor de...

Multilayer interconnection structure for a semiconductor device

Interconnection structure of a semiconductor device

Multilayer interconnection structure for a semiconductor device

Method for manufacturing a multilayer wiring structure employing me...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having capacitive element and manufacturing me...

Semiconductor device having a multilayer wiring structure and pad e...

SEMICONDUCTOR INTEGRATED CIRCUIT

Semiconductor device

Semiconductor device having capacitive element and manufacturing me...

Semiconductor device and method of manufacturing the same

Semiconductor device having an improved interlayer conductor connec...

Semiconductor device and method for fabricating the same and appara...