Yoshifumi Watanabe

Person

Anjo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Temperature sensor and mounting structure for same
- Patent number 10,401,230
- Issue date Sep 3, 2019
- Denso Corporation
- Kazuaki Fujisawa
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor with sensing chip protected by protective material
- Patent number 7,600,432
- Issue date Oct 13, 2009
- Denso Corporation
- Takashi Nomura
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing pressure sensor
- Patent number 7,268,008
- Issue date Sep 11, 2007
- Denso Corporation
- Manabu Tomisaka
- G01 - MEASURING TESTING
Information Patent Grant
Humidity sensor and composite sensor having humidity detecting func...
- Patent number 7,213,462
- Issue date May 8, 2007
- Denso Corporation
- Yoshifumi Watanabe
- G01 - MEASURING TESTING
Information Patent Grant
Bonding structure having protrusions
- Patent number 6,854,918
- Issue date Feb 15, 2005
- Denso Corporation
- Masato Ueno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pressure detecting apparatus and installation structure of same
- Patent number 6,604,424
- Issue date Aug 12, 2003
- Denso Corporation
- Yasuyuki Kawabe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor device having sensor chip covered wit...
- Patent number 6,512,255
- Issue date Jan 28, 2003
- Denso Corporation
- Takashi Aoki
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor device with multi-layered protective...
- Patent number 6,260,417
- Issue date Jul 17, 2001
- Denso Corporation
- Yoshifumi Watanabe
- G01 - MEASURING TESTING
Information Patent Grant
Liquid-sealed semiconductor pressure sensor and manufacturing metho...
- Patent number 5,595,939
- Issue date Jan 21, 1997
- Nippondenso Co., Ltd.
- Seiichirou Otake
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure transducer
- Patent number 4,843,454
- Issue date Jun 27, 1989
- Nippondenso Co., Ltd.
- Yukihiro Kato
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
TEMPERATURE SENSOR AND MOUNTING STRUCTURE FOR SAME
- Publication number 20180031427
- Publication date Feb 1, 2018
- Denso Corporation
- Kazuaki FUJISAWA
- G01 - MEASURING TESTING
Information Patent Application
Pressure sensor with sensing chip protected by protective material
- Publication number 20080264174
- Publication date Oct 30, 2008
- DENSO CORPORTION
- Takashi NOMURA
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing pressure sensor
- Publication number 20060160263
- Publication date Jul 20, 2006
- DENSO CORPORATION
- Manabu Tomisaka
- G01 - MEASURING TESTING
Information Patent Application
Humidity sensor and composite sensor having humidity detecting func...
- Publication number 20060037404
- Publication date Feb 23, 2006
- DENSO Corporation
- Yoshifumi Watanabe
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor sensor and method of plating semiconductor devices
- Publication number 20050034526
- Publication date Feb 17, 2005
- DENSO Corporation
- Keiji Shinyama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method of wire bonding for semiconductor d...
- Publication number 20040188858
- Publication date Sep 30, 2004
- DENSO Corporation
- Yoshifumi Watanabe
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor pressure sensor device
- Publication number 20040169190
- Publication date Sep 2, 2004
- Masato Ueno
- G01 - MEASURING TESTING
Information Patent Application
Bonding structure having protrusions
- Publication number 20040028894
- Publication date Feb 12, 2004
- Masato Ueno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor pressure sensor device having sensor chip covered wit...
- Publication number 20010028072
- Publication date Oct 11, 2001
- Takashi Aoki
- G01 - MEASURING TESTING

Yoshifumi Watanabe

Person

Patents Grantslast 30 patents

Temperature sensor and mounting structure for same

Pressure sensor with sensing chip protected by protective material

Method for manufacturing pressure sensor

Humidity sensor and composite sensor having humidity detecting func...

Bonding structure having protrusions

Pressure detecting apparatus and installation structure of same

Semiconductor pressure sensor device having sensor chip covered wit...

Semiconductor pressure sensor device with multi-layered protective...

Liquid-sealed semiconductor pressure sensor and manufacturing metho...

Semiconductor pressure transducer

Patents Applicationslast 30 patents

TEMPERATURE SENSOR AND MOUNTING STRUCTURE FOR SAME

Pressure sensor with sensing chip protected by protective material

Method for manufacturing pressure sensor

Humidity sensor and composite sensor having humidity detecting func...

Semiconductor sensor and method of plating semiconductor devices

Semiconductor device and method of wire bonding for semiconductor d...

Semiconductor pressure sensor device

Bonding structure having protrusions

Semiconductor pressure sensor device having sensor chip covered wit...