Yoshihide Iwazaki

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Tsukuba, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat-resistant adhesive sheet
- Patent number 6,558,791
- Issue date May 6, 2003
- Hitachi Chemical Company
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a crack resistant resin encapsulated semico...
- Patent number 6,372,080
- Issue date Apr 16, 2002
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a crack resistant resin encapsulated semico...
- Patent number 6,248,613
- Issue date Jun 19, 2001
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a crack resistant resin encapsulated semico...
- Patent number 6,046,072
- Issue date Apr 4, 2000
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming resin film of desired pattern on semiconductor su...
- Patent number 5,958,653
- Issue date Sep 28, 1999
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming resin film of desired pattern on semiconductor su...
- Patent number 5,955,779
- Issue date Sep 21, 1999
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat -resistant adhesive sheet
- Publication number 20010015484
- Publication date Aug 23, 2001
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS