Yoshiki Sota

Person

Nara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting device, lead frame and resin cavity molding package
- Patent number 9,537,072
- Issue date Jan 3, 2017
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with reflective resin
- Patent number 9,537,065
- Issue date Jan 3, 2017
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 9,331,254
- Issue date May 3, 2016
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, inspection method thereof and electric device
- Patent number 8,749,263
- Issue date Jun 10, 2014
- Sharp Kabushiki Kaisha
- Masayuki Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device and method for manufacturing sem...
- Patent number 8,436,456
- Issue date May 7, 2013
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor apparatus
- Patent number 7,876,572
- Issue date Jan 25, 2011
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number RE41826
- Issue date Oct 19, 2010
- Sharp Kabushiki Kaisha
- Hisashige Nishida
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device
- Patent number 6,979,905
- Issue date Dec 27, 2005
- Sharp Kabushiki Kaisha
- Hisashige Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number RE38806
- Issue date Oct 4, 2005
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor package substrate, semiconductor package
- Patent number 6,731,014
- Issue date May 4, 2004
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate, semiconductor package
- Patent number 6,545,367
- Issue date Apr 8, 2003
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substance and semiconductor
- Patent number 6,403,895
- Issue date Jun 11, 2002
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,352,879
- Issue date Mar 5, 2002
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and substrate for semiconductor device
- Patent number 6,285,086
- Issue date Sep 4, 2001
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin overmolded type semiconductor device
- Patent number 6,265,783
- Issue date Jul 24, 2001
- Sharp Kabushiki Kaisha
- Hiroyuki Juso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor device, semiconductor device and manufa...
- Patent number 6,250,606
- Issue date Jun 26, 2001
- Sharp Kabushiki Kaisha
- Hiroyuki Juso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,236,108
- Issue date May 22, 2001
- Hitachi Chemical Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,229,217
- Issue date May 8, 2001
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate used for a resin-sealing type semiconductor device...
- Patent number 6,201,707
- Issue date Mar 13, 2001
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,198,165
- Issue date Mar 6, 2001
- Sharp Kabushiki Kaisha
- Yasuhisa Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of semiconductor chips
- Patent number 6,181,002
- Issue date Jan 30, 2001
- Sharp Kabushiki Kaisha
- Hiroyuki Juso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,100,594
- Issue date Aug 8, 2000
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,064,111
- Issue date May 16, 2000
- Hitachi Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having external connection terminals provided...
- Patent number 5,874,784
- Issue date Feb 23, 1999
- Sharp Kabushiki Kaisha
- Kazumasa Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 5,757,080
- Issue date May 26, 1998
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed type semiconductor device and method for manufacturing...
- Patent number 5,672,912
- Issue date Sep 30, 1997
- Sharp Kabushiki Kaisha
- Kazumasa Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device having fixed inner leads
- Patent number 5,646,829
- Issue date Jul 8, 1997
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGING DEVICE, BIOMETRIC AUTHENTICATION DEVICE, AND SEMICONDUCTOR...
- Publication number 20180325427
- Publication date Nov 15, 2018
- SHIN ITOH
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20160353544
- Publication date Dec 1, 2016
- SHARP KABUSHIKI KAISHA
- Nobumasa KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, LEAD FRAME AND RESIN CAVITY MOLDING PACKAGE
- Publication number 20160254430
- Publication date Sep 1, 2016
- Sharp Kabushiki Kaisha
- Yoshiki SOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20140175501
- Publication date Jun 26, 2014
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20140159076
- Publication date Jun 12, 2014
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, INSPECTION METHOD THEREOF AND ELECTRIC DEVICE
- Publication number 20120049882
- Publication date Mar 1, 2012
- Sharp Kabushiki Kaisha
- Masayuki OHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEM...
- Publication number 20110042828
- Publication date Feb 24, 2011
- Yoshiki Sota
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND...
- Publication number 20090184413
- Publication date Jul 23, 2009
- Kazuaki TATSUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, LAYERED TYPE SEMICONDUCTOR DEVICE USING THE S...
- Publication number 20090102049
- Publication date Apr 23, 2009
- Katsumasa Murata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board and semiconductor apparatus
- Publication number 20070176300
- Publication date Aug 2, 2007
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, laminated semiconductor device, and wiring su...
- Publication number 20070035036
- Publication date Feb 15, 2007
- SHARP KABUSHIKI KAISHA
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040150084
- Publication date Aug 5, 2004
- Sharp Kabushiki Kaisha
- Hisashige Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package substrate, semiconductor package
- Publication number 20030098502
- Publication date May 29, 2003
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package substrate, semiconductor package
- Publication number 20020171137
- Publication date Nov 21, 2002
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape carrier for semiconductor device and method of producing same
- Publication number 20010007373
- Publication date Jul 12, 2001
- Yoshinori Kadota
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiki Sota

Person

Patents Grantslast 30 patents

Light emitting device, lead frame and resin cavity molding package

Light-emitting device with reflective resin

Light emitting device

Semiconductor apparatus, inspection method thereof and electric device

Wiring board, semiconductor device and method for manufacturing sem...

Wiring board and semiconductor apparatus

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor package substrate, semiconductor package

Semiconductor package substrate, semiconductor package

Wiring substance and semiconductor

Semiconductor device and method of manufacturing the same

Semiconductor device and substrate for semiconductor device

Resin overmolded type semiconductor device

Substrate for semiconductor device, semiconductor device and manufa...

Substrate for holding a chip of semi-conductor package, semi-conduc...

Semiconductor device and method of manufacturing the same

Wiring substrate used for a resin-sealing type semiconductor device...

Semiconductor device

Semiconductor device having a plurality of semiconductor chips

Semiconductor device and method of manufacturing the same

Substrate for holding a chip of semi-conductor package, semi-conduc...

Semiconductor device having external connection terminals provided...

Resin-sealed semiconductor device

Resin-sealed type semiconductor device and method for manufacturing...

Resin sealing type semiconductor device having fixed inner leads

Patents Applicationslast 30 patents

IMAGING DEVICE, BIOMETRIC AUTHENTICATION DEVICE, AND SEMICONDUCTOR...

LIGHT-EMITTING DEVICE

LIGHT EMITTING DEVICE, LEAD FRAME AND RESIN CAVITY MOLDING PACKAGE

LIGHT EMITTING DEVICE

LIGHT-EMITTING DEVICE

SEMICONDUCTOR APPARATUS, INSPECTION METHOD THEREOF AND ELECTRIC DEVICE

WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEM...

INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND...

SEMICONDUCTOR DEVICE, LAYERED TYPE SEMICONDUCTOR DEVICE USING THE S...

Wiring board and semiconductor apparatus

Semiconductor device, laminated semiconductor device, and wiring su...

Semiconductor device

Semiconductor package substrate, semiconductor package

Semiconductor package substrate, semiconductor package

Tape carrier for semiconductor device and method of producing same