Wiring board and semiconductor apparatus

Abstract

A wiring board of the present invention includes a dummy wiring in a semiconductor-chip mount area on which a semiconductor chip is to be mounted. The dummy wiring is arranged in a manner such that all wiring-lines included in the dummy wiring each have a free end within the semiconductor-chip mount area. This prevents a defect due to vaporization and expansion of moisture inside a semiconductor apparatus, with a simple structure and without raising costs.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a wiring board according to an embodiment of the present invention.

FIG. 2 is a cross section of a semiconductor apparatus according to an embodiment of the present invention.

FIGS. 3( a), 3(b), and 3(c) are plan views each showing a wiring board employed in the present example.

FIGS. 4( a), 4(b), 4(c), 4(d) are plan views of wiring boards according to another embodiment of the present invention.

FIG. 5 is a cross section of a conventional semiconductor apparatus, for explaining a defect in the apparatus.

FIG. 6 is a cross section of a conventional semiconductor apparatus having vents for allowing the air to be released.

Claims

1. A wiring board, having a first surface including a semiconductor-chip mount area on which a semiconductor chip is to be mounted and a second surface, opposite to the first surface, to which an external connection terminal is to be provided, the wiring board comprising:a dummy wiring, in the semiconductor-chip mount area, arranged in a manner such that a wiring line included in the dummy wiring has a free end within the semiconductor-chip mount area.

2. The board according to claim 1, wherein the dummy wiring is provided in a manner such that a wiring width and a wiring space are constant.

3. The board according to claim 1, wherein the dummy wiring is arranged in such a way as to extend from at least a point in the semiconductor-chip mount area to or toward an outside of the semiconductor-chip mount area.

4. The board according to claim 1, wherein, in the semiconductor-chip mount area, a ratio of a first area occupied by an entire wiring including the dummy wiring with respect to a second area not occupied by the entire wiring, which second area is constituted of space between wiring lines, is in a range of 40:60 to 60:40.

5. A wiring board having a first surface including a semiconductor-chip mount area on which a semiconductor chip is to be mounted and a second surface, opposite to the first surface, to which an external connection terminal is to be provided, the wiring board comprising:a dummy wiring, provided in the semiconductor-chip mount area, arranged in a manner such that, when a semiconductor chip is mounted, the dummy wiring is not closed under the semiconductor chip.

6. A semiconductor apparatus, comprising: a wiring board having a first surface including a semiconductor-chip mount area on which a semiconductor chip is mounted and a second surface, opposite to the first surface, on which an external connection terminal is provided,the wiring board comprising:a dummy wiring, in the semiconductor-chip mount area, arranged in a manner such that a wiring line included in the dummy wiring has a free end within the semiconductor-chip mount area.