Yoshitaka Mukaiyama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Paddle, processing apparatus having the paddle, and method of produ...
- Patent number 11,891,715
- Issue date Feb 6, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,047,063
- Issue date Jun 29, 2021
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 11,015,261
- Issue date May 25, 2021
- Ebara Corporation
- Yoshitaka Mukaiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate attachment/detachment device, plating device, control dev...
- Patent number 10,665,495
- Issue date May 26, 2020
- Ebara Corporation
- Toshio Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,577,714
- Issue date Mar 3, 2020
- Ebara Corporation
- Yoshitaka Mukaiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,294,578
- Issue date May 21, 2019
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 9,714,476
- Issue date Jul 25, 2017
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 8,961,755
- Issue date Feb 24, 2015
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 8,075,756
- Issue date Dec 13, 2011
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method
- Patent number 8,012,332
- Issue date Sep 6, 2011
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 7,833,393
- Issue date Nov 16, 2010
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method
- Patent number 7,402,227
- Issue date Jul 22, 2008
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor wafer holder and electroplating system for plating a...
- Patent number 7,022,211
- Issue date Apr 4, 2006
- Ebara Corporation
- Junichiro Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for detecting the conductivity between plating co...
- Patent number 6,500,317
- Issue date Dec 31, 2002
- Ebara Corporation
- Junichiro Yoshioka
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
BUFFER CHAMBER AND AM SYSTEM INCLUDING A BUFFER CHAMBER
- Publication number 20240001448
- Publication date Jan 4, 2024
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PADDLE, PROCESSING APPARATUS HAVING THE PADDLE, AND METHOD OF PRODU...
- Publication number 20210262111
- Publication date Aug 26, 2021
- EBARA CORPORATION
- Yasuyuki Masuda
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
SUBSTRATE-HOLDER INSPECTION APPARATUS, PLATING APPARATUS INCLUDING...
- Publication number 20200255968
- Publication date Aug 13, 2020
- EBARA CORPORATION
- Yoshitaka MUKAIYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20190226114
- Publication date Jul 25, 2019
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20190084777
- Publication date Mar 21, 2019
- EBARA CORPORATION
- Yoshitaka MUKAIYAMA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE ATTACHMENT/DETACHMENT DEVICE, PLATING DEVICE, CONTROL DEV...
- Publication number 20180182659
- Publication date Jun 28, 2018
- EBARA CORPORATION
- Toshio YOKOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20170298531
- Publication date Oct 19, 2017
- EBARA CORPORATION
- Yoshitaka MUKAIYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR SUPPLYING PLATING SOLUTION TO PLATING TANK...
- Publication number 20170226656
- Publication date Aug 10, 2017
- EBARA CORPORATION
- Chunhui DOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20160145760
- Publication date May 26, 2016
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF OPERATING AN ELECTROLESS PLATING APPARATUS
- Publication number 20160130702
- Publication date May 12, 2016
- EBARA CORPORATION
- Yoichi NAKAGAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...
- Publication number 20150122635
- Publication date May 7, 2015
- EBARA CORPORATION
- Junichiro YOSHIOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WET PROCESSING APPARATUS AND PLATING APPARATUS
- Publication number 20150013905
- Publication date Jan 15, 2015
- EBARA CORPORATION
- Yoichi NAKAGAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...
- Publication number 20120048727
- Publication date Mar 1, 2012
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...
- Publication number 20110036722
- Publication date Feb 17, 2011
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND METHOD
- Publication number 20080245669
- Publication date Oct 9, 2008
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor wafer holder and electroplating system for plating a...
- Publication number 20060151317
- Publication date Jul 13, 2006
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20050082163
- Publication date Apr 21, 2005
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic solution supply and recovery facility and liquid compo...
- Publication number 20040256221
- Publication date Dec 23, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor wafer holder and electroplating system for plating a...
- Publication number 20020029963
- Publication date Mar 14, 2002
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20020027080
- Publication date Mar 7, 2002
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Yoshitaka Mukaiyama

Person

Patents Grantslast 30 patents

Paddle, processing apparatus having the paddle, and method of produ...

Plating apparatus and plating method

Substrate holder and plating apparatus

Substrate attachment/detachment device, plating device, control dev...

Plating apparatus and plating method

Plating apparatus and plating method

Semiconductor wafer holder and electroplating system for plating a...

Semiconductor wafer holder and electroplating system for plating a...

Semiconductor wafer holder and electroplating system for plating a...

Plating apparatus and method

Semiconductor wafer holder and electroplating system for plating a...

Plating apparatus and method

Semiconductor wafer holder and electroplating system for plating a...

Plating apparatus for detecting the conductivity between plating co...

Patents Applicationslast 30 patents

BUFFER CHAMBER AND AM SYSTEM INCLUDING A BUFFER CHAMBER

PADDLE, PROCESSING APPARATUS HAVING THE PADDLE, AND METHOD OF PRODU...

SUBSTRATE-HOLDER INSPECTION APPARATUS, PLATING APPARATUS INCLUDING...

PLATING APPARATUS AND PLATING METHOD

SUBSTRATE HOLDER AND PLATING APPARATUS

SUBSTRATE ATTACHMENT/DETACHMENT DEVICE, PLATING DEVICE, CONTROL DEV...

PLATING APPARATUS AND PLATING METHOD

APPARATUS AND METHOD FOR SUPPLYING PLATING SOLUTION TO PLATING TANK...

PLATING APPARATUS AND PLATING METHOD

METHOD OF OPERATING AN ELECTROLESS PLATING APPARATUS

SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...

WET PROCESSING APPARATUS AND PLATING APPARATUS

SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...

SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A...

PLATING APPARATUS AND METHOD

Semiconductor wafer holder and electroplating system for plating a...

Plating apparatus and method

Electrolytic solution supply and recovery facility and liquid compo...

Semiconductor wafer holder and electroplating system for plating a...

Plating apparatus and method