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YounSang Kim
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Irvine, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Thermally conductive pre-applied underfill formulations and uses th...
Patent number
10,913,879
Issue date
Feb 9, 2021
Henkel IP & Holding GmbH
Jie Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Formulations containing mixed resin systems and the use thereof for...
Patent number
10,242,923
Issue date
Mar 26, 2019
Henkel IP & Holding GmbH
Jie Bai
G01 - MEASURING TESTING
Information
Patent Grant
Pre-cut wafer applied underfill film on dicing tape
Patent number
9,362,105
Issue date
Jun 7, 2016
Henkel IP & Holding GmbH
Gina Hoang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-cut wafer applied underfill film
Patent number
9,281,182
Issue date
Mar 8, 2016
Henkel IP & Holding GmbH
YounSang Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coating adhesives onto dicing before grinding and micro-fabricated...
Patent number
9,082,840
Issue date
Jul 14, 2015
Henkel IP & Holding GmbH
Hwang Kyu Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coating adhesives onto dicing before grinding and micro-fabricated...
Patent number
8,753,959
Issue date
Jun 17, 2014
Henkel IP & Holding GmbH
Hwang Kyu Yun
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FORMULATIONS CONTAINING MIXED RESIN SYSTEMS AND THE USE THEREOF FOR...
Publication number
20180226313
Publication date
Aug 9, 2018
Henkel IP & Holding GmbH
Jie Bai
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
THERMALLY CONDUCTIVE PRE-APPLIED UNDERFILL FORMULATIONS AND USES TH...
Publication number
20160340557
Publication date
Nov 24, 2016
Henkel IP & Holding GmbH
Jie Bai
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
METHOD OF PREPARING AN ADHESIVE FILM INTO A PRECUT SEMICONDUCTOR WA...
Publication number
20140290843
Publication date
Oct 2, 2014
YounSang Kim
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
COATING ADHESIVES ONTO DICING BEFORE GRINDING AND MICRO-FABRICATED...
Publication number
20140242781
Publication date
Aug 28, 2014
Hwang Kyu Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING BEFORE GRINDING AFTER COATING
Publication number
20140057411
Publication date
Feb 27, 2014
HENKEL US IP LLC
Gina Hoang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-CUT WAFER APPLIED UNDERFILL FILM
Publication number
20130210239
Publication date
Aug 15, 2013
Henkel Corporation
YounSang Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-CUT WAFER APPLIED UNDERFILL FILM ON DICING TAPE
Publication number
20130196472
Publication date
Aug 1, 2013
Henkel Corporation
Gina Hoang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COATING ADHESIVES ONTO DICING BEFORE GRINDING AND MICRO-FABRICATED...
Publication number
20130011999
Publication date
Jan 10, 2013
Henkel Corporation
Hwang Kyu Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective Deposition in the Fabrication of Electronic Substrates
Publication number
20120175746
Publication date
Jul 12, 2012
YounSang Kim
H01 - BASIC ELECTRIC ELEMENTS