Yu Gu

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of thinning silicon on epoxy mold compound for radio freque...
- Patent number 11,355,358
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 11,024,561
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 10,707,150
- Issue date Jul 7, 2020
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming vias in polymer layers
- Patent number 10,636,696
- Issue date Apr 28, 2020
- Applied Materials, Inc.
- Yu Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 10,446,479
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming supporting layer over se...
- Patent number 10,297,518
- Issue date May 21, 2019
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for wafer level packaging
- Patent number 10,276,424
- Issue date Apr 30, 2019
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of redistribution layer formation for advanced packaging app...
- Patent number 10,229,827
- Issue date Mar 12, 2019
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reconstituted substrate formation for advanced packaging...
- Patent number 10,211,072
- Issue date Feb 19, 2019
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming stacked vias within inte...
- Patent number 10,170,385
- Issue date Jan 1, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 10,049,964
- Issue date Aug 14, 2018
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 9,875,973
- Issue date Jan 23, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method and device of forming a fan-out PoP device wit...
- Patent number 9,865,525
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 9,842,798
- Issue date Dec 12, 2017
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method and device of forming a fan-out device with PW...
- Patent number 9,837,303
- Issue date Dec 5, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,666,500
- Issue date May 30, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 9,520,365
- Issue date Dec 13, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming supporting layer over se...
- Patent number 9,385,102
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming stacked vias within inte...
- Patent number 9,385,009
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming stress relieving vias fo...
- Patent number 9,318,404
- Issue date Apr 19, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming through mold hole with a...
- Patent number 9,252,092
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,087,930
- Issue date Jul 21, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a robust fan-out package...
- Patent number 9,082,780
- Issue date Jul 14, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method and device of forming a fan-out PoP device wit...
- Patent number 8,810,024
- Issue date Aug 19, 2014
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,759,155
- Issue date Jun 24, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 8,492,203
- Issue date Jul 23, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,456,002
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF THINNING SILICON ON EPOXY MOLD COMPOUND FOR RADIO FREQUE...
- Publication number 20210090905
- Publication date Mar 25, 2021
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...
- Publication number 20200294890
- Publication date Sep 17, 2020
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EMBEDDED ANTIFUSES
- Publication number 20190287898
- Publication date Sep 19, 2019
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING...
- Publication number 20190181019
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- Han-Wen CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF...
- Publication number 20190051454
- Publication date Feb 14, 2019
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INCREASING EMBEDDED 3D METAL-INSULATOR-METAL (MIM) CAPACI...
- Publication number 20190051596
- Publication date Feb 14, 2019
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR WAFER LEVEL PACKAGING
- Publication number 20190006223
- Publication date Jan 3, 2019
- GUAN HUEI SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDISTRIBUTION LAYER FORMATION FOR ADVANCED PACKAGING APP...
- Publication number 20180374696
- Publication date Dec 27, 2018
- Applied Materials, Inc.
- Han-Wen CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING...
- Publication number 20180374718
- Publication date Dec 27, 2018
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL VIAS IN A POLYMER LAYER DISPOSED ON A SUBSTRATE
- Publication number 20180350732
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- YU GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...
- Publication number 20180331018
- Publication date Nov 15, 2018
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Supporting Layer Over Se...
- Publication number 20160276238
- Publication date Sep 22, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stacked Vias Within Inte...
- Publication number 20160276239
- Publication date Sep 22, 2016
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20150228552
- Publication date Aug 13, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Through Mold Hole with A...
- Publication number 20150028471
- Publication date Jan 29, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Method and Device of Forming a Fan-Out POP Device wit...
- Publication number 20140319679
- Publication date Oct 30, 2014
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20140246779
- Publication date Sep 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stress Relieving Vias fo...
- Publication number 20140217597
- Publication date Aug 7, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20140103527
- Publication date Apr 17, 2014
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Supporting Layer Over Se...
- Publication number 20140091454
- Publication date Apr 3, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...
- Publication number 20140048906
- Publication date Feb 20, 2014
- STATS ChipPAC, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Method and Device of Forming a Fan-Out Device with PW...
- Publication number 20130277851
- Publication date Oct 24, 2013
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Method of Device of Forming a Fan-Out PoP Device with...
- Publication number 20130249101
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Robust Fan-Out Package...
- Publication number 20130249106
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Method and Device of Forming a Fan-Out PoP Device wit...
- Publication number 20130249115
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Semiconductor Package H...
- Publication number 20130241048
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20130175696
- Publication date Jul 11, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Semiconductor Package H...
- Publication number 20130140719
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSE...
- Publication number 20130113092
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods of thinning silicon on epoxy mold compound for radio freque...

Semiconductor device and method of forming a fan-out PoP device wit...

Semiconductor device and method of forming a fan-out PoP device wit...

Methods for forming vias in polymer layers

Semiconductor device and method of forming a PoP device with embedd...

Semiconductor device and method of forming supporting layer over se...

Method and apparatus for wafer level packaging

Method of redistribution layer formation for advanced packaging app...

Method of reconstituted substrate formation for advanced packaging...

Semiconductor device and method of forming stacked vias within inte...

Semiconductor device and method of forming a fan-out PoP device wit...

Semiconductor device and method for forming semiconductor package h...

Semiconductor method and device of forming a fan-out PoP device wit...

Semiconductor device and method of forming a PoP device with embedd...

Semiconductor method and device of forming a fan-out device with PW...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device and method for forming semiconductor package h...

Semiconductor device and method of forming supporting layer over se...

Semiconductor device and method of forming stacked vias within inte...

Semiconductor device and method of forming stress relieving vias fo...

Semiconductor device and method of forming through mold hole with a...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device and method of forming a robust fan-out package...

Semiconductor method and device of forming a fan-out PoP device wit...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device and method for forming semiconductor package h...

Semiconductor device and method of forming insulating layer dispose...

Patents Applicationslast 30 patents

METHODS OF THINNING SILICON ON EPOXY MOLD COMPOUND FOR RADIO FREQUE...

Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...

METHODS AND APPARATUS FOR EMBEDDED ANTIFUSES

METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING...

SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF...

METHOD OF INCREASING EMBEDDED 3D METAL-INSULATOR-METAL (MIM) CAPACI...

METHOD AND APPARATUS FOR WAFER LEVEL PACKAGING

METHOD OF REDISTRIBUTION LAYER FORMATION FOR ADVANCED PACKAGING APP...

METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING...

SMALL VIAS IN A POLYMER LAYER DISPOSED ON A SUBSTRATE

Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...

Semiconductor Device and Method of Forming a POP Device with Embedd...

Semiconductor Device and Method of Forming Supporting Layer Over Se...

Semiconductor Device and Method of Forming Stacked Vias Within Inte...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device and Method of Forming Through Mold Hole with A...

Semiconductor Method and Device of Forming a Fan-Out POP Device wit...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device and Method of Forming Stress Relieving Vias fo...

Semiconductor Device and Method of Forming a POP Device with Embedd...

Semiconductor Device and Method of Forming Supporting Layer Over Se...

Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...

Semiconductor Method and Device of Forming a Fan-Out Device with PW...

Semiconductor Method of Device of Forming a Fan-Out PoP Device with...

Semiconductor Device and Method of Forming a Robust Fan-Out Package...

Semiconductor Method and Device of Forming a Fan-Out PoP Device wit...

Semiconductor Device and Method for Forming Semiconductor Package H...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device and Method for Forming Semiconductor Package H...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSE...