Yu-Wei Liang

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer high-k gate dielectric structure
- Patent number 12,171,091
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Hsu
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,165,946
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared thermopile sensor
- Patent number 12,085,451
- Issue date Sep 10, 2024
- ORIENTAL SYSTEM TECHNOLOGY INC.
- Wen-Chie Huang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,080,563
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,062,604
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer high-k gate dielectric structure
- Patent number 12,041,760
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Hsu
Information Patent Grant
Multi-layer high-k gate dielectric structure
- Patent number 12,022,643
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Hsu
Information Patent Grant
Test structure and testing method thereof
- Patent number 12,020,993
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacture
- Patent number 11,894,312
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 11,894,332
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,855,057
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 11,824,032
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,810,847
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared thermopile sensor
- Patent number 11,808,633
- Issue date Nov 7, 2023
- ORIENTAL SYSTEM TECHNOLOGY INC.
- Chein-Hsun Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,784,106
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,749,594
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 11,705,378
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,705,408
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacture
- Patent number 11,688,693
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET with dummy fins and methods of making the same
- Patent number 11,677,014
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,616,037
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate
- Patent number 11,605,652
- Issue date Mar 14, 2023
- Au Optronics Corporation
- Yu-Hsing Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection of circuit boards for unauthorized modifications
- Patent number 11,599,988
- Issue date Mar 7, 2023
- Super Micro Computer, Inc.
- Bo-Han Wo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,594,479
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 11,515,173
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,508,640
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,424,220
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal sensor package for earbuds
- Patent number 11,408,781
- Issue date Aug 9, 2022
- Oriental System Technology Inc.
- Chein-Hsun Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
FINFET WITH DUMMY FINS AND METHODS OF MAKING THE SAME
- Publication number 20240395910
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240387440
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER HIGH-K GATE DIELECTRIC STRUCTURE
- Publication number 20240381608
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Yu Hsu
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR STRUCTURE HAVING CAVITIES FOR INCREASED RESISTOR PERFORMANCE
- Publication number 20240371917
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR WITH GRADED RESISTIVE LAYER
- Publication number 20240363529
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20240363366
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT DESIGN OF A THIN FILM RESISTOR
- Publication number 20240355729
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUDIC PURIFICATION DEVICE
- Publication number 20240326046
- Publication date Oct 3, 2024
- ORIENTAL SYSTEM TECHNOLOGY INC.
- Wen-Chie HUANG
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MICROFLUIDIC ELECTROPORATION DEVICE
- Publication number 20240327774
- Publication date Oct 3, 2024
- ORIENTAL SYSTEM TECHNOLOGY INC.
- Wen-Chie HUANG
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240297090
- Publication date Sep 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Jui-Shan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSING DEVICE
- Publication number 20240230414
- Publication date Jul 11, 2024
- ORIENTAL SYSTEM TECHNOLOGY INC.
- Chein-Hsun WANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240234302
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
- Publication number 20240136299
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20240136317
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSING DEVICE
- Publication number 20240133745
- Publication date Apr 25, 2024
- ORIENTAL SYSTEM TECHNOLOGY INC.
- Chein-Hsun WANG
- G01 - MEASURING TESTING
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20240097090
- Publication date Mar 21, 2024
- CORETRONIC CORPORATION
- Ming-Chuan Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240079346
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071939
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071888
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clock management circuit and clock management method
- Publication number 20240069590
- Publication date Feb 29, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- YU-JIE LIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20240063130
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240047322
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages and Methods of Forming the Same
- Publication number 20240038646
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING A SEMICONDUCTOR PA...
- Publication number 20240030157
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TUNABLE THRESHOLD VOLTAGE AND METHOD FOR...
- Publication number 20240021709
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chansyun David YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014074
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ORGANIC-INORGANIC CONDUCTIVE THIN FILM AND ELECTRONIC ELEMEN...
- Publication number 20230413660
- Publication date Dec 21, 2023
- National Tsing Hua University
- JWO-HUEI JOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
- Publication number 20230387061
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Yu-Wei Liang

Person

Patents Grantslast 30 patents

Multi-layer high-k gate dielectric structure

Semiconductor package and manufacturing method thereof

Semiconductor packages and methods of forming same

Infrared thermopile sensor

Semiconductor devices and methods of manufacturing

Semiconductor structure and manufacturing method thereof

Multi-layer high-k gate dielectric structure

Multi-layer high-k gate dielectric structure

Test structure and testing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor packages and method of manufacture

Substrate and package structure

Package structure and method of forming the same

Die corner removal for underfill crack suppression in semiconductor...

Package structure and method of fabricating the same

Infrared thermopile sensor

Semiconductor package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor packages and methods of forming the same

Semiconductor package

Semiconductor packages and method of manufacture

FinFET with dummy fins and methods of making the same

Integrated fan-out package and manufacturing method thereof

Array substrate

Inspection of circuit boards for unauthorized modifications

Semiconductor structure and manufacturing method thereof

Semiconductor devices and methods of manufacturing

Semiconductor package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Thermal sensor package for earbuds

Patents Applicationslast 30 patents

FINFET WITH DUMMY FINS AND METHODS OF MAKING THE SAME

MANUFACTURING METHOD OF PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MULTI-LAYER HIGH-K GATE DIELECTRIC STRUCTURE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

RESISTOR STRUCTURE HAVING CAVITIES FOR INCREASED RESISTOR PERFORMANCE

THIN FILM RESISTOR WITH GRADED RESISTIVE LAYER

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

INTERCONNECT DESIGN OF A THIN FILM RESISTOR

MICROFLUDIC PURIFICATION DEVICE

MICROFLUIDIC ELECTROPORATION DEVICE

PACKAGE STRUCTURE

TEMPERATURE SENSING DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE

SUBSTRATE AND PACKAGE STRUCTURE

TEMPERATURE SENSING DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

Clock management circuit and clock management method

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

Semiconductor Device Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING A SEMICONDUCTOR PA...

SEMICONDUCTOR DEVICE WITH TUNABLE THRESHOLD VOLTAGE AND METHOD FOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HYBRID ORGANIC-INORGANIC CONDUCTIVE THIN FILM AND ELECTRONIC ELEMEN...

DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...