Yuan Chang SU

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate and method for manufacturing the same
- Patent number 11,398,421
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate mitigating bridging
- Patent number 10,181,438
- Issue date Jan 15, 2019
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double side via last method for double embedded patterned substrate
- Patent number 10,128,198
- Issue date Nov 13, 2018
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, semiconductor package structure and manufacturing process
- Patent number 10,096,542
- Issue date Oct 9, 2018
- Advanced Semiconductor Engineering, Inc.
- Chih Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and semiconductor process
- Patent number 10,083,902
- Issue date Sep 25, 2018
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including dielectric layers defining via hole...
- Patent number 10,079,156
- Issue date Sep 18, 2018
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side via last method for double embedded patterned substrate
- Patent number 9,659,853
- Issue date May 23, 2017
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, semiconductor package structure and method...
- Patent number 9,583,427
- Issue date Feb 28, 2017
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier, semiconductor package, and process for fabricating...
- Patent number 9,564,346
- Issue date Feb 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and semiconductor process
- Patent number 9,420,695
- Issue date Aug 16, 2016
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded component device and manufacturing methods thereof
- Patent number 9,406,658
- Issue date Aug 2, 2016
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, semiconductor package structure and method...
- Patent number 9,373,601
- Issue date Jun 21, 2016
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with single sided substrate design and manufa...
- Patent number 9,196,597
- Issue date Nov 24, 2015
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package and process for fabricating same
- Patent number 9,165,900
- Issue date Oct 20, 2015
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate and method for making the same
- Patent number 9,117,697
- Issue date Aug 25, 2015
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with single sided substrate design and manufa...
- Patent number 8,884,424
- Issue date Nov 11, 2014
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and process for fabricating same
- Patent number 8,786,062
- Issue date Jul 22, 2014
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with single sided substrate design and manufa...
- Patent number 8,569,894
- Issue date Oct 29, 2013
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate having single patterned metal layer, and package applied...
- Patent number 8,399,776
- Issue date Mar 19, 2013
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having single patterned metal layer exposing patterned di...
- Patent number 8,367,473
- Issue date Feb 5, 2013
- Advanced Semiconductor Engineering, Inc.
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, and chip package structure
- Patent number 8,357,861
- Issue date Jan 22, 2013
- Advanced Semiconductor Engineering, Inc.
- Shih-Fu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 8,330,267
- Issue date Dec 11, 2012
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component substrate and manufacturing methods thereof
- Patent number 8,320,134
- Issue date Nov 27, 2012
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Leadframe package structure and manufacturing method thereof
- Patent number 8,309,400
- Issue date Nov 13, 2012
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with substrate having single metal layer and...
- Patent number 8,288,869
- Issue date Oct 16, 2012
- Advanced Semiconductor Engineering, Inc.
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure
- Patent number 8,284,561
- Issue date Oct 9, 2012
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating multi-layered substrate
- Patent number 8,104,171
- Issue date Jan 31, 2012
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359361
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190148280
- Publication date May 16, 2019
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190088506
- Publication date Mar 21, 2019
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20190067211
- Publication date Feb 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Chih Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING PROCESS
- Publication number 20180240743
- Publication date Aug 23, 2018
- Advanced Semiconductor Engineering, Inc.
- Chih Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE VIA LAST METHOD FOR DOUBLE EMBEDDED PATTERNED SUBSTRATE
- Publication number 20170229402
- Publication date Aug 10, 2017
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
- Publication number 20160322292
- Publication date Nov 3, 2016
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE VIA LAST METHOD FOR DOUBLE EMBEDDED PATTERNED SUBSTRATE
- Publication number 20160315041
- Publication date Oct 27, 2016
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD...
- Publication number 20160240469
- Publication date Aug 18, 2016
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160218021
- Publication date Jul 28, 2016
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING...
- Publication number 20160218019
- Publication date Jul 28, 2016
- Advanced Semiconductor Engineering, Inc.
- YUAN-CHANG SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
- Publication number 20160143149
- Publication date May 19, 2016
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING EMBEDDED COMPONENTS AND METHOD OF M...
- Publication number 20160133562
- Publication date May 12, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Chih-Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD...
- Publication number 20150348931
- Publication date Dec 3, 2015
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME
- Publication number 20140367837
- Publication date Dec 18, 2014
- Chun-Che LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFA...
- Publication number 20140346670
- Publication date Nov 27, 2014
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING SAME
- Publication number 20140151876
- Publication date Jun 5, 2014
- Advanced Semiconductor Engineering, Inc.
- YUAN-CHANG SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFA...
- Publication number 20140021636
- Publication date Jan 23, 2014
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT DEVICE AND MANUFACTURING METHODS THEREOF
- Publication number 20120153493
- Publication date Jun 21, 2012
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- CHUN-CHE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120091569
- Publication date Apr 19, 2012
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED SUBSTRATE
- Publication number 20120073871
- Publication date Mar 29, 2012
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING EMBEDDED COMPONENT PACKAGE STRUCTURE AND THE...
- Publication number 20120033394
- Publication date Feb 9, 2012
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded Component Substrate and Manufacturing Methods Thereof
- Publication number 20110194265
- Publication date Aug 11, 2011
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Single Sided Substrate Design and Manufa...
- Publication number 20110169150
- Publication date Jul 14, 2011
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING...
- Publication number 20110084372
- Publication date Apr 14, 2011
- Advanced Semiconductor Engineering, Inc.
- YUAN-CHANG SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING SAME
- Publication number 20110084370
- Publication date Apr 14, 2011
- Advanced Semiconductor Engineering, Inc.
- YUAN-CHANG SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD OF CIRCUIT BOARD, CIRCUIT BOARD, AND CHIP PACKAG...
- Publication number 20110056736
- Publication date Mar 10, 2011
- Advanced Semiconductor Engineering, Inc.
- SHIH-FU HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110057301
- Publication date Mar 10, 2011
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE HAVING SINGLE METAL LAYER AND...
- Publication number 20100320610
- Publication date Dec 23, 2010
- SHIH-FU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DI...
- Publication number 20100314744
- Publication date Dec 16, 2010
- Shih-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Yuan Chang SU

Person

Patents Grantslast 30 patents

Semiconductor substrate and method for manufacturing the same

Semiconductor substrate mitigating bridging

Double side via last method for double embedded patterned substrate

Substrate, semiconductor package structure and manufacturing process

Semiconductor package structure and semiconductor process

Semiconductor package including dielectric layers defining via hole...

Double side via last method for double embedded patterned substrate

Semiconductor substrate, semiconductor package structure and method...

Package carrier, semiconductor package, and process for fabricating...

Semiconductor package structure and semiconductor process

Embedded component device and manufacturing methods thereof

Semiconductor substrate, semiconductor package structure and method...

Semiconductor package with single sided substrate design and manufa...

Semiconductor package and process for fabricating same

Semiconductor substrate and method for making the same

Semiconductor package with single sided substrate design and manufa...

Semiconductor package and process for fabricating same

Semiconductor package with single sided substrate design and manufa...

Substrate having single patterned metal layer, and package applied...

Substrate having single patterned metal layer exposing patterned di...

Circuit board, and chip package structure

Semiconductor package

Embedded component substrate and manufacturing methods thereof

Leadframe package structure and manufacturing method thereof

Semiconductor package with substrate having single metal layer and...

Embedded component package structure

Method of fabricating multi-layered substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING PROCESS

DOUBLE SIDE VIA LAST METHOD FOR DOUBLE EMBEDDED PATTERNED SUBSTRATE

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS

DOUBLE SIDE VIA LAST METHOD FOR DOUBLE EMBEDDED PATTERNED SUBSTRATE

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING...

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS

SEMICONDUCTOR PACKAGE INCLUDING EMBEDDED COMPONENTS AND METHOD OF M...

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD...

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFA...

SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING SAME

SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFA...

EMBEDDED COMPONENT DEVICE AND MANUFACTURING METHODS THEREOF

LEADFRAME PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-LAYERED SUBSTRATE

METHOD OF FABRICATING EMBEDDED COMPONENT PACKAGE STRUCTURE AND THE...

Embedded Component Substrate and Manufacturing Methods Thereof

Semiconductor Package with Single Sided Substrate Design and Manufa...

PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING...

SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING SAME

FABRICATION METHOD OF CIRCUIT BOARD, CIRCUIT BOARD, AND CHIP PACKAG...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH SUBSTRATE HAVING SINGLE METAL LAYER AND...

SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DI...