Yuan Li

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 11,832,396
- Issue date Nov 28, 2023
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weight optimized stiffener and sealing structure for direct liquid...
- Patent number 11,721,641
- Issue date Aug 8, 2023
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weight optimized stiffener and sealing structure for direct liquid...
- Patent number 11,664,329
- Issue date May 30, 2023
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,600,548
- Issue date Mar 7, 2023
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct liquid cooling with O-ring sealing
- Patent number 11,488,890
- Issue date Nov 1, 2022
- Google LLC
- Jorge Padilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for direct liquid cooling via metal channels
- Patent number 10,964,625
- Issue date Mar 30, 2021
- Google LLC
- Padam Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,681,846
- Issue date Jun 9, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,548,239
- Issue date Jan 28, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,548,240
- Issue date Jan 28, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package stiffener for protecting semiconductor die
- Patent number 10,468,359
- Issue date Nov 5, 2019
- Google LLC
- William Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stiffener for protecting semiconductor die
- Patent number 10,083,920
- Issue date Sep 25, 2018
- Google LLC
- William Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading structures for integrated circuits
- Patent number 9,330,997
- Issue date May 3, 2016
- Altera Corporation
- Ken Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with a heat conductor
- Patent number 9,230,874
- Issue date Jan 5, 2016
- Altera Corporation
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with cavity in substrate
- Patent number 9,196,575
- Issue date Nov 24, 2015
- Altera Corporation
- Myung June Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with fluid flow barriers
- Patent number 8,710,643
- Issue date Apr 29, 2014
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 8,212,353
- Issue date Jul 3, 2012
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with non-solder mask defined like pads
- Patent number 8,198,699
- Issue date Jun 12, 2012
- Altera Corporation
- Yuanlin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 7,883,937
- Issue date Feb 8, 2011
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 7,741,160
- Issue date Jun 22, 2010
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 7,585,702
- Issue date Sep 8, 2009
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener for flip chip BGA package
- Patent number 7,459,782
- Issue date Dec 2, 2008
- Altera Corporation
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structures to improve board-level reliability of solder-on-pad...
- Patent number 7,446,399
- Issue date Nov 4, 2008
- Altera Corporation
- Yuan Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure, material, and design for assembling a low-K Si die to ac...
- Patent number 7,427,813
- Issue date Sep 23, 2008
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage flip chip package solution-channel heat spreader
- Patent number 7,300,822
- Issue date Nov 27, 2007
- Altera Corporation
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and material for assembling a low-K Si die to achieve a l...
- Patent number 7,144,756
- Issue date Dec 5, 2006
- Altera Corporation
- Wen-Chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress and warpage laminate flip chip BGA package
- Patent number 7,009,307
- Issue date Mar 7, 2006
- Altera Corporation
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package with warpage control
- Patent number 6,949,404
- Issue date Sep 27, 2005
- Altera Corporation
- Don Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and material for assembling a low-K Si die to achieve a l...
- Patent number 6,909,176
- Issue date Jun 21, 2005
- Altera Corporation
- Wen-Chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage flip chip package solution-channel heat spreader
- Patent number 6,888,238
- Issue date May 3, 2005
- Altera Corporation
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Weight Optimized Stiffener and Sealing Structure for Direct Liquid...
- Publication number 20230260931
- Publication date Aug 17, 2023
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20230230896
- Publication date Jul 20, 2023
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Liquid Cooling With O-Ring Sealing
- Publication number 20230037380
- Publication date Feb 9, 2023
- Google LLC
- Jorge Padilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20210375715
- Publication date Dec 2, 2021
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20210378106
- Publication date Dec 2, 2021
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Weight Optimized Stiffener and Sealing Structure for Direct Liquid...
- Publication number 20210366841
- Publication date Nov 25, 2021
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spring Loaded Compliant Coolant Distribution Manifold for Direct Li...
- Publication number 20210366806
- Publication date Nov 25, 2021
- Google LLC
- Madhusudan K. Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Direct Liquid Cooling With O-Ring Sealing
- Publication number 20210366807
- Publication date Nov 25, 2021
- Google LLC
- Jorge Padilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
- Publication number 20200296862
- Publication date Sep 17, 2020
- Google LLC
- Madhusudan Krishnan Iyengar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR DIRECT LIQUID COOLING VIA METAL CHANNELS
- Publication number 20200273777
- Publication date Aug 27, 2020
- Google LLC
- Padam Jain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
- Publication number 20190327859
- Publication date Oct 24, 2019
- Google LLC
- Madhusudan Krishnan Iyengar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STIFFENER FOR PROTECTING SEMICONDUCTOR DIE
- Publication number 20190237411
- Publication date Aug 1, 2019
- Google LLC
- William Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package with Fluid Flow Barriers
- Publication number 20110204476
- Publication date Aug 25, 2011
- Altera Corporation
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low warpage flip chip package solution-channel heat spreader
- Publication number 20050250252
- Publication date Nov 10, 2005
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods and heat distribution devices for thermal management of chi...

Cooling electronic devices in a data center

Weight optimized stiffener and sealing structure for direct liquid...

Weight optimized stiffener and sealing structure for direct liquid...

Methods and heat distribution devices for thermal management of chi...

Direct liquid cooling with O-ring sealing

Device and method for direct liquid cooling via metal channels

Cooling electronic devices in a data center

Cooling electronic devices in a data center

Cooling electronic devices in a data center

Package stiffener for protecting semiconductor die

Package stiffener for protecting semiconductor die

Heat spreading structures for integrated circuits

Integrated circuit package with a heat conductor

Integrated circuit package with cavity in substrate

Electronic package with fluid flow barriers

Structure and assembly procedure for low stress thin die flip chip...

Integrated circuit package with non-solder mask defined like pads

Electronic package and method of forming the same

Structure and assembly procedure for low stress thin die flip chip...

Structure and assembly procedure for low stress thin die flip chip...

Stiffener for flip chip BGA package

Pad structures to improve board-level reliability of solder-on-pad...

Structure, material, and design for assembling a low-K Si die to ac...

Low warpage flip chip package solution-channel heat spreader

Structure and material for assembling a low-K Si die to achieve a l...

Low stress and warpage laminate flip chip BGA package

Flip chip package with warpage control

Structure and material for assembling a low-K Si die to achieve a l...

Low warpage flip chip package solution-channel heat spreader

Patents Applicationslast 30 patents

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Weight Optimized Stiffener and Sealing Structure for Direct Liquid...

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Direct Liquid Cooling With O-Ring Sealing

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Weight Optimized Stiffener and Sealing Structure for Direct Liquid...

Spring Loaded Compliant Coolant Distribution Manifold for Direct Li...

Direct Liquid Cooling With O-Ring Sealing

COOLING ELECTRONIC DEVICES IN A DATA CENTER

DEVICE AND METHOD FOR DIRECT LIQUID COOLING VIA METAL CHANNELS

COOLING ELECTRONIC DEVICES IN A DATA CENTER

PACKAGE STIFFENER FOR PROTECTING SEMICONDUCTOR DIE

Electronic Package with Fluid Flow Barriers

Low warpage flip chip package solution-channel heat spreader