Yuan Yuan

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly having a heat spreader
- Patent number 8,754,521
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die for heat dissipation and method therefor
- Patent number 8,536,697
- Issue date Sep 17, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control using a package carrier assembly
- Patent number 7,803,662
- Issue date Sep 28, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die edge reconditioning
- Patent number 7,374,971
- Issue date May 20, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced molded package for semiconductors
- Patent number 7,361,985
- Issue date Apr 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
State retention within a data processing system
- Patent number 7,183,825
- Issue date Feb 27, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Milind P. Padhye
- G11 - INFORMATION STORAGE
Information Patent Grant
Warpage control of array packaging
- Patent number 7,172,927
- Issue date Feb 6, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-flop circuit having low power data retention
- Patent number 7,138,842
- Issue date Nov 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Milind P. Padhye
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED DIE FOR HEAT DISSIPATION AND METHOD THEREFOR
- Publication number 20130134575
- Publication date May 30, 2013
- YUAN YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH COINED INNER LEADS
- Publication number 20120248589
- Publication date Oct 4, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinquan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL USING A PACKAGE CARRIER ASSEMBLY
- Publication number 20090081831
- Publication date Mar 26, 2009
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die having a protective periphery region and method f...
- Publication number 20070087067
- Publication date Apr 19, 2007
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die edge reconditioning
- Publication number 20060237850
- Publication date Oct 26, 2006
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-FLOP CIRCUIT HAVING LOW POWER DATA RETENTION
- Publication number 20060220717
- Publication date Oct 5, 2006
- Milind P. Padhye
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Thermally enhanced molded package for semiconductors
- Publication number 20060087015
- Publication date Apr 27, 2006
- Freescale Semiconductor Inc.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making an interconnect pad
- Publication number 20050245059
- Publication date Nov 3, 2005
- Yuan Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
State retention within a data processing system
- Publication number 20050218952
- Publication date Oct 6, 2005
- Milind P. Padhye
- G11 - INFORMATION STORAGE
Information Patent Application
Warpage control of array packaging
- Publication number 20050136567
- Publication date Jun 23, 2005
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder joint reliability by changing solder pad surface from flat t...
- Publication number 20040099716
- Publication date May 27, 2004
- MOTOROLA INC.
- Yuan Yuan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Person

Patents Grantslast 30 patents

Semiconductor device assembly having a heat spreader

Packaged die for heat dissipation and method therefor

Warpage control using a package carrier assembly

Semiconductor die edge reconditioning

Thermally enhanced molded package for semiconductors

State retention within a data processing system

Warpage control of array packaging

Flip-flop circuit having low power data retention

Patents Applicationslast 30 patents

PACKAGED DIE FOR HEAT DISSIPATION AND METHOD THEREFOR

LEAD FRAME WITH COINED INNER LEADS

WARPAGE CONTROL USING A PACKAGE CARRIER ASSEMBLY

Semiconductor die having a protective periphery region and method f...

Semiconductor die edge reconditioning

FLIP-FLOP CIRCUIT HAVING LOW POWER DATA RETENTION

Thermally enhanced molded package for semiconductors

Method for making an interconnect pad

State retention within a data processing system

Warpage control of array packaging

Solder joint reliability by changing solder pad surface from flat t...