The present invention relates generally to semiconductor packaging and more particularly to a lead frame for a semiconductor device.
Lead frame type semiconductor devices typically comprise a die bond pad, an integrated circuit or die that is attached to a surface of the die bond pad and one or more rows of leads that surround the die. The die is electrically connected to the leads with wires via a wire bonding process. The die, leads and wires are then covered with a plastic molding compound with ends or bottoms of the leads being exposed to allow for external electrical connection.
One problem with such devices is that the molding compound may not adhere well to the leads, in which case the molding compound can separate from one or more of the leads, especially when stresses are induced by temperature changes. This problem is known as delamination. The lead tip, which is the end of the lead closest to the die and where the bond wire is attached or bonded is a place of high internal stress and often is where delamination is initiated.
Lead frames usually are formed of Copper alloy and the bond wires are often formed of Gold. To promote the wire bonding, the lead tips often are coated with Silver. Unfortunately, the molding compound does not bond well with Silver, although it does bond well with Copper. The delamination that may occur between the molding compound and the Silver coating can cause wire bonding failure. In addition, because the Copper lead and molding compound have different coefficients of thermal expansion (CTE), shear stress often occurs near the lead tip. This shear stress can also cause the wire bond connection to fail.
Thus, it would be advantageous to have a lead frame with inner leads that are less susceptible to delamination.
The following detailed description of preferred embodiments of the invention will be better understood when read in conjunction with the appended drawings. The present invention is illustrated by way of example and is not limited by the accompanying figures, in which like references indicate similar elements. It is to be understood that the drawings are not to scale and have been simplified for ease of understanding the invention.
The detailed description set forth below in connection with the appended drawings is intended as a description of the presently preferred embodiments of the invention, and is not intended to represent the only form in which the present invention may be practiced. It is to be understood that the same or equivalent functions may be accomplished by different embodiments that are intended to be encompassed within the spirit and scope of the invention.
In one embodiment, the present invention provides a lead frame for a semiconductor device. The lead frame includes a generally rectangular outer dam bar and a plurality of inner leads extending from the dam bar. The inner leads are disposed within the lead frame and near a die bond pad or substrate configured to receive an integrated circuit die. Distal ends of the inner leads are the ends of the leads that are spaced from the dam bar. The distal ends have a tip. A first major surface of each inner lead includes a coined area at the distal end. The coined area is spaced from the tip by a predetermined distance. The spacing of the coined area from the tip forms a shoulder at the tip. An inner surface of the coined area may be plated with Silver or another metal or alloy that allows for a strong bond with a bond wire, while the shoulder area remains bare so that a strong bond is made with a molding compound used to cover the integrated circuit die, the bond wire, and the inner lead.
In another embodiment, the present invention provides an integrated circuit device including a semiconductor die having a plurality of die wire bond pads formed on a surface thereof and a plurality of inner leads spaced from and surrounding the semiconductor die. The inner leads each have a tip at a distal end that is proximate to the semiconductor die. A first major surface of the inner leads includes a coined area that is spaced from the distal end by a predetermined distance. A plurality of bond wires connects the die wire bond pads with the coined areas of respective ones of the inner leads. One end of each of the bond wires is attached or bonded to the coined areas and the other ends of the bond wires are attached or bonded to respective ones of the die wire bond pads. An encapsulation material covers the die wire bond pads, the bond wires and the coined areas. In one embodiment, the inner leads are formed from Copper, the coined areas are plated with Silver and the bond wires are formed from Gold.
Referring now to
The lead frame 20 is formed of conductive metal with the dam bar 22, inner leads 24, die bond pad 28, and tie bar 29 being formed by cutting, stamping, punching or etching. In one embodiment, the lead frame 20 is formed from Copper. Lead frames are generally well known to those of skill in the art so further description as well as discussion of variations in lead frame types is not necessary for a complete understanding of the present invention. Suffice it to say that those of skill in the art will understand that the present invention can be applied to various types of lead frames.
Referring now to
In the embodiment shown, the inner lead 24 includes a coined area 34 on a top or first major surface at the distal end 26. The coined area 34 is spaced from the distal end 26 by a predetermined distance such that a shoulder 36 is formed at the distal end 26. The bond wire 32 is attached or bonded to the coined area 34 of the inner lead 24. In order to form a good bond between, for example a Gold bond wire and a Copper inner lead 24, at least a portion of an inner surface of the coined area 34 may be plated with a metal or metal alloy. In one embodiment, the coined area 34 is plated with Silver. The coined area 34 may be formed by any suitable method such as cutting, stamping or etching.
As shown in
As is evident from the foregoing discussion, the present invention provides a lead frame with coined inner leads that allows reliable lead to mold compound attachment, which reduces the chance of delamination occurring at the ends of the inner leads.
While the preferred embodiments of the invention have been illustrated and described, it will be clear that the invention is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions and equivalents will be apparent to those skilled in the art without departing from the spirit and scope of the invention as described in the claims.
Number | Date | Country | Kind |
---|---|---|---|
201110097375.0 | Mar 2011 | CN | national |