Yun-Hyoek Im

Person

Hwaeong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of dynamic thermal management of electronic device
- Patent number 11,782,466
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretchable substrate, method for manufacturing stretchable substra...
- Patent number 11,683,882
- Issue date Jun 20, 2023
- Korea University Research and Business Foundation, Sejong Campus
- Sang Il Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 11,658,094
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Soo Jeoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable substrate, method for manufacturing stretchable substra...
- Patent number 11,477,882
- Issue date Oct 18, 2022
- Korea University Research and Business Foundation, Sejong Campus
- Sang Il Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device package and apparatus comprising the same
- Patent number 11,244,936
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Yun Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,171,128
- Issue date Nov 9, 2021
- Samsung Electronics Co., Ltd.
- Yun Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dynamic thermal management of electronic device
- Patent number 11,119,517
- Issue date Sep 14, 2021
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretchable substrate, method for manufacturing stretchable substra...
- Patent number 11,076,481
- Issue date Jul 27, 2021
- Korea University Research and Business Foundation, Sejong Campus
- Sang Il Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Controllers, apparatuses, and methods for thermal management using...
- Patent number 10,852,080
- Issue date Dec 1, 2020
- Samsung Electronics Co., Ltd.
- Yun-hyeok Im
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package
- Patent number 10,607,971
- Issue date Mar 31, 2020
- Samsung Electronics Co., Ltd.
- Yun Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic system including the same
- Patent number 9,666,503
- Issue date May 30, 2017
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 9,589,945
- Issue date Mar 7, 2017
- Samsung Electronics Co., Ltd.
- Cha-jea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for predicting the temperature of a device
- Patent number 9,482,584
- Issue date Nov 1, 2016
- Samsung Electronics Co., Ltd.
- Yun-hyeok Im
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor package including a surface...
- Patent number 9,293,389
- Issue date Mar 22, 2016
- Samsung Electronics Co., Ltd.
- Kyol Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure including nano-wires and a body connecting ends of t...
- Patent number 9,076,881
- Issue date Jul 7, 2015
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal dissipating member and method of...
- Patent number 9,054,067
- Issue date Jun 9, 2015
- Samsung Electronics Co., Ltd.
- Yun-Hyoek Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,921,990
- Issue date Dec 30, 2014
- Samsung Electronics Co., Ltd.
- Kyol Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack package and semiconductor package including the same
- Patent number 8,791,562
- Issue date Jul 29, 2014
- Samsung Electronics Co., Ltd.
- Chung-sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure including nano-wires and a body connecting ends of t...
- Patent number 8,643,179
- Issue date Feb 4, 2014
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 8,587,134
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro heat flux sensor array
- Patent number 8,104,952
- Issue date Jan 31, 2012
- Samsung Electronics Co., Ltd.
- Jae-Wook Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro heat flux sensor array
- Patent number 7,699,520
- Issue date Apr 20, 2010
- Samsung Electronics Co., Ltd.
- Jae-Wook Yoo
- G01 - MEASURING TESTING
Information Patent Grant
Heat-radiating tape carrier package and method for manufacturing th...
- Patent number 7,601,561
- Issue date Oct 13, 2009
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folded dipole loop antenna having matching circuit integrally forme...
- Patent number 7,583,235
- Issue date Sep 1, 2009
- Samsung Electronics Co., Ltd.
- Yong-jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having enhanced heat dissipation and method o...
- Patent number 7,388,286
- Issue date Jun 17, 2008
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,375,426
- Issue date May 20, 2008
- Samsung Electronics Co., Ltd.
- Suk-Chae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having coolant path, semiconductor package and p...
- Patent number 7,372,148
- Issue date May 13, 2008
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having thermal interface material (TIM)
- Patent number 7,081,375
- Issue date Jul 25, 2006
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having dam and method for fabricating the same
- Patent number 6,891,259
- Issue date May 10, 2005
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor module and method of manufacturing the same
- Patent number 6,835,598
- Issue date Dec 28, 2004
- Samsung Electronics Co., Ltd.
- Joong-hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE
- Publication number 20210405670
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...
- Publication number 20210368620
- Publication date Nov 25, 2021
- KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
- Sang Il KIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...
- Publication number 20210329780
- Publication date Oct 21, 2021
- KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
- Sang Il KIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210257275
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- Soo Jeoung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...
- Publication number 20200229301
- Publication date Jul 16, 2020
- KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
- Sang Il KIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200219860
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- Yun Hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND APPARATUS COMPRISING THE SAME
- Publication number 20190295998
- Publication date Sep 26, 2019
- Samsung Electronics Co., Ltd.
- Yun Hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190115325
- Publication date Apr 18, 2019
- Samsung Electronics Co., Ltd.
- Yun Hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180315740
- Publication date Nov 1, 2018
- Samsung Electronics Co., Ltd.
- Yun Hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE
- Publication number 20180259985
- Publication date Sep 13, 2018
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- G05 - CONTROLLING REGULATING
Information Patent Application
CONTROLLERS, APPARATUSES, AND METHODS FOR THERMAL MANAGEMENT USING...
- Publication number 20180209750
- Publication date Jul 26, 2018
- Samsung Electronics Co., Ltd.
- Yun-hyeok IM
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE I...
- Publication number 20160315029
- Publication date Oct 27, 2016
- Dong-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
- Publication number 20160093598
- Publication date Mar 31, 2016
- Cha-jea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20150104905
- Publication date Apr 16, 2015
- Samsung Electronics Co., Ltd.
- Kyol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THERMOELECTRIC MODULE
- Publication number 20150062824
- Publication date Mar 5, 2015
- Samsung Electronics Co., Ltd.
- YOUNG-HOON HYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING HEAT EXHAUST PART
- Publication number 20150054148
- Publication date Feb 26, 2015
- Eon-Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20140254092
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140217576
- Publication date Aug 7, 2014
- Samsung Electronics Co., Ltd.
- Yun- Hyoek Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140168902
- Publication date Jun 19, 2014
- Kyol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE INCLUDING NANO-WIRES AND A BODY CONNECTING ENDS OF T...
- Publication number 20140147974
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PREDICTING THE TEMPERATURE OF A DEVICE
- Publication number 20130259092
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok IM
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20130134606
- Publication date May 30, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE
- Publication number 20120119359
- Publication date May 17, 2012
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20120018871
- Publication date Jan 26, 2012
- Samsung Electronics Co., Ltd.
- Chung-sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro heat flux sensor array
- Publication number 20100158069
- Publication date Jun 24, 2010
- Jae-Wook Yoo
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ENHANCED HEAT DISSIPATION AND METHOD O...
- Publication number 20080213992
- Publication date Sep 4, 2008
- Samsung Electronics Co., Ltd.
- Sang-uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Folded dipole loop antenna having matching circuit integrally forme...
- Publication number 20080122710
- Publication date May 29, 2008
- Samsung Electronics Co., Ltd.
- Yong-jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-radiating tape carrier package and method for manufacturing th...
- Publication number 20070216016
- Publication date Sep 20, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro heat flux sensor array
- Publication number 20070181650
- Publication date Aug 9, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Wook Yoo
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor chip package with a metal substrate and semiconductor...
- Publication number 20070108599
- Publication date May 17, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS

Yun-Hyoek Im

Person

Patents Grantslast 30 patents

Method of dynamic thermal management of electronic device

Stretchable substrate, method for manufacturing stretchable substra...

Semiconductor package

Stretchable substrate, method for manufacturing stretchable substra...

Semiconductor device package and apparatus comprising the same

Semiconductor package

Method of dynamic thermal management of electronic device

Stretchable substrate, method for manufacturing stretchable substra...

Controllers, apparatuses, and methods for thermal management using...

Semiconductor package

Semiconductor package and electronic system including the same

Semiconductor package having stacked semiconductor chips

System and method for predicting the temperature of a device

Method of manufacturing a semiconductor package including a surface...

Bump structure including nano-wires and a body connecting ends of t...

Semiconductor package with thermal dissipating member and method of...

Semiconductor package

Stack package and semiconductor package including the same

Bump structure including nano-wires and a body connecting ends of t...

Semiconductor packages

Micro heat flux sensor array

Micro heat flux sensor array

Heat-radiating tape carrier package and method for manufacturing th...

Folded dipole loop antenna having matching circuit integrally forme...

Semiconductor package having enhanced heat dissipation and method o...

Semiconductor package

Semiconductor chip having coolant path, semiconductor package and p...

Semiconductor package having thermal interface material (TIM)

Semiconductor package having dam and method for fabricating the same

Stacked semiconductor module and method of manufacturing the same

Patents Applicationslast 30 patents

METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE

STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...

STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...

SEMICONDUCTOR PACKAGE

STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND APPARATUS COMPRISING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE

CONTROLLERS, APPARATUSES, AND METHODS FOR THERMAL MANAGEMENT USING...

SEMICONDUCTOR PACKAGE AND THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE I...

SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE HAVING THERMOELECTRIC MODULE

SEMICONDUCTOR PACKAGES INCLUDING HEAT EXHAUST PART

SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

BUMP STRUCTURE INCLUDING NANO-WIRES AND A BODY CONNECTING ENDS OF T...

SYSTEM AND METHOD FOR PREDICTING THE TEMPERATURE OF A DEVICE

SEMICONDUCTOR PACKAGES

BUMP STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE

STACK PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Micro heat flux sensor array

SEMICONDUCTOR PACKAGE HAVING ENHANCED HEAT DISSIPATION AND METHOD O...

Folded dipole loop antenna having matching circuit integrally forme...

Heat-radiating tape carrier package and method for manufacturing th...

Micro heat flux sensor array

Semiconductor chip package with a metal substrate and semiconductor...