Zhao-Chong Zeng

Person

Hsin-chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging substrate having embedded passive c...
- Patent number 10,219,390
- Issue date Feb 26, 2019
- Unimicron Technology Corp.
- Shih-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating packaging substrate with embedded semiconduc...
- Patent number 9,295,159
- Issue date Mar 22, 2016
- Unimicron Technology Corporation
- Zhao Chong Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating packaging substrate having a passive element...
- Patent number 9,232,665
- Issue date Jan 5, 2016
- Unimicron Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate having embedded passive component and fabricati...
- Patent number 9,179,549
- Issue date Nov 3, 2015
- Unimicron Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure having embedded electronic component
- Patent number 9,129,870
- Issue date Sep 8, 2015
- Unimicron Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having embedded electronic component and fabricat...
- Patent number 8,884,429
- Issue date Nov 11, 2014
- Unimicron Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having a passive element embedded therein and m...
- Patent number 8,829,356
- Issue date Sep 9, 2014
- Unimicron Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 8,421,213
- Issue date Apr 16, 2013
- Unimicron Technology Corporation
- Shin-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate with embedded semiconductor component and metho...
- Patent number 8,242,383
- Issue date Aug 14, 2012
- Unimicron Technology Corporation
- Zhao Chong Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 7,948,085
- Issue date May 24, 2011
- Unimicron Technology Corp.
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure with semiconductor chips embeded therein
- Patent number 7,763,969
- Issue date Jul 27, 2010
- Phoenix Precision Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded package structure and fabrication method thereof
- Patent number 7,554,131
- Issue date Jun 30, 2009
- Phoenix Precision Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE C...
- Publication number 20160007483
- Publication date Jan 7, 2016
- Unimicron Technology Corp.
- Shih-Pin Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...
- Publication number 20140345125
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN
- Publication number 20140345930
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...
- Publication number 20140345126
- Publication date Nov 27, 2014
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC COMPONENT
- Publication number 20140306340
- Publication date Oct 16, 2014
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC ELEMENT AND FABRICATIO...
- Publication number 20130258623
- Publication date Oct 3, 2013
- Unimicron Technology Corporation
- Zhao Chong Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING PACKAGING SUBSTRATE WITH EMBEDDED SEMICONDUC...
- Publication number 20120302012
- Publication date Nov 29, 2012
- Unimicron Technology Corporation
- Zhao Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC COMPONENT AND FABRICAT...
- Publication number 20120273941
- Publication date Nov 1, 2012
- Unimicron Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING THROUGH-SILICON-VIA (TSV) CHIP EMBEDDED TH...
- Publication number 20120049366
- Publication date Mar 1, 2012
- Unimicron Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN AND M...
- Publication number 20120037404
- Publication date Feb 16, 2012
- Unimicron Technology Corporation
- Shih- Ping Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENT AND FABRICATI...
- Publication number 20120037411
- Publication date Feb 16, 2012
- Unimicron Technology Corporation
- Shih- Ping Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20110042800
- Publication date Feb 24, 2011
- Phoenix Precision Technology Corporation
- Shin-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE WITH EMBEDDED SEMICONDUCTOR COMPONENT AND METHO...
- Publication number 20100053920
- Publication date Mar 4, 2010
- Unimicron Technology Corporation
- Zhao Chong Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD OF THE SAME
- Publication number 20080176035
- Publication date Jul 24, 2008
- Phoenix Precision Technology Corporation
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier Board Structure Embedded with Semiconductor Component and M...
- Publication number 20080048310
- Publication date Feb 28, 2008
- Phoenix Precision Technology Corporation
- Zhao Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER BOARD STRUCTURE WITH CHIP EMBEDDED THEREIN AND METHOD FOR F...
- Publication number 20070241444
- Publication date Oct 18, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure with semiconductor chips embeded therein and method of fa...
- Publication number 20070145577
- Publication date Jun 28, 2007
- Phoenix Precision Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with electroless plating metal connecting laye...
- Publication number 20070085205
- Publication date Apr 19, 2007
- Shang-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer structure with electroless plating metal connecting layer and...
- Publication number 20070087547
- Publication date Apr 19, 2007
- Shang Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip embedded package structure and fabrication method thereof
- Publication number 20060220222
- Publication date Oct 5, 2006
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Zhao-Chong Zeng

Person

Patents Grantslast 30 patents

Fabrication method of packaging substrate having embedded passive c...

Method for fabricating packaging substrate with embedded semiconduc...

Method of fabricating packaging substrate having a passive element...

Packaging substrate having embedded passive component and fabricati...

Package structure having embedded electronic component

Package structure having embedded electronic component and fabricat...

Packaging substrate having a passive element embedded therein and m...

Package structure

Packaging substrate with embedded semiconductor component and metho...

Circuit board structure

Structure with semiconductor chips embeded therein

Chip embedded package structure and fabrication method thereof

Patents Applicationslast 30 patents

FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE C...

METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...

PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN

METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...

PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC COMPONENT

PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC ELEMENT AND FABRICATIO...

METHOD FOR FABRICATING PACKAGING SUBSTRATE WITH EMBEDDED SEMICONDUC...

PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC COMPONENT AND FABRICAT...

PACKAGE STRUCTURE HAVING THROUGH-SILICON-VIA (TSV) CHIP EMBEDDED TH...

PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN AND M...

PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENT AND FABRICATI...

PACKAGE STRUCTURE

PACKAGING SUBSTRATE WITH EMBEDDED SEMICONDUCTOR COMPONENT AND METHO...

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD OF THE SAME

Carrier Board Structure Embedded with Semiconductor Component and M...

CARRIER BOARD STRUCTURE WITH CHIP EMBEDDED THEREIN AND METHOD FOR F...

Structure with semiconductor chips embeded therein and method of fa...

Semiconductor device with electroless plating metal connecting laye...

Wafer structure with electroless plating metal connecting layer and...

Chip embedded package structure and fabrication method thereof