Zheng Zheng

Follow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with tiebar-less design and met...
- Patent number 8,637,974
- Issue date Jan 28, 2014
- Stats Chippac Ltd.
- Zheng Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with integral inner lead and paddle
- Patent number 8,110,913
- Issue date Feb 7, 2012
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit leadframe with ground plane
- Patent number 7,064,420
- Issue date Jun 20, 2006
- ST Assembly Test Services Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground plane for exposed package
- Patent number 6,876,069
- Issue date Apr 5, 2005
- ST Assembly Test Services PTE LTD
- Jefferey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground plane for exposed package
- Patent number 6,630,373
- Issue date Oct 7, 2003
- ST Assembly Test Service Ltd.
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die paddle enhancement for exposed pad in semiconductor packaging
- Patent number 6,380,048
- Issue date Apr 30, 2002
- ST Assembly Test Services PTE LTD
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TIEBAR-LESS DESIGN AND MET...
- Publication number 20130334674
- Publication date Dec 19, 2013
- Zheng Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADDLE
- Publication number 20090001531
- Publication date Jan 1, 2009
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ground plane for exposed package
- Publication number 20040070055
- Publication date Apr 15, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit leadframe with ground plane
- Publication number 20040061204
- Publication date Apr 1, 2004
- ST ASSEMBLY TEST SERVICES LTD.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND PLANE FOR EXPOSED PACKAGE
- Publication number 20030160309
- Publication date Aug 28, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS