ZHICHAO ZHANG

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Device, method and system for optical communication with a waveguid...
- Patent number 12,164,147
- Issue date Dec 10, 2024
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial transmission line SLI socket designs for 224GBS and beyond
- Patent number 12,126,103
- Issue date Oct 22, 2024
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided socket device with corrugation structures and shield str...
- Patent number 12,009,612
- Issue date Jun 11, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package 3D antenna
- Patent number 12,003,023
- Issue date Jun 4, 2024
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna package using ball attach array to connect antenna and base...
- Patent number 11,870,163
- Issue date Jan 9, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential crosstalk self-cancelation in stackable structures
- Patent number 11,862,547
- Issue date Jan 2, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,804,426
- Issue date Oct 31, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
- Patent number 11,791,528
- Issue date Oct 17, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,737,227
- Issue date Aug 22, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slow wave structure for millimeter wave antennas
- Patent number 11,715,889
- Issue date Aug 1, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal pitch translation using embedded bridge dies
- Patent number 11,694,952
- Issue date Jul 4, 2023
- Intel Corporation
- Sujit Sharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 11,664,596
- Issue date May 30, 2023
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband multi-pin edge connector for radio frequency front end module
- Patent number 11,611,164
- Issue date Mar 21, 2023
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tunable passive semiconductor elements
- Patent number 11,437,366
- Issue date Sep 6, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,380,609
- Issue date Jul 5, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package using ball attach array to connect antenna and base...
- Patent number 11,355,849
- Issue date Jun 7, 2022
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines having l-shaped cros...
- Patent number 11,329,358
- Issue date May 10, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,291,133
- Issue date Mar 29, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with out-plane inductors
- Patent number 11,282,633
- Issue date Mar 22, 2022
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal pitch translation using embedded bridge dies
- Patent number 11,276,635
- Issue date Mar 15, 2022
- Intel Corporation
- Sujit Sharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin count socket having reduced pin count and pattern transformation
- Patent number 11,212,932
- Issue date Dec 28, 2021
- Intel Corporation
- Srikant Nekkanty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna modules and communication devices
- Patent number 11,121,468
- Issue date Sep 14, 2021
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,107,757
- Issue date Aug 31, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slow wave structure for millimeter wave antennas
- Patent number 11,095,045
- Issue date Aug 17, 2021
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,089,689
- Issue date Aug 10, 2021
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna modules and communication devices
- Patent number 10,797,394
- Issue date Oct 6, 2020
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin count socket having reduced pin count and pattern transformation
- Patent number 10,716,231
- Issue date Jul 14, 2020
- Intel Corporation
- Srikant Nekkanty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKETS HAVING FINE PITCH 3D FEATURES
- Publication number 20240283197
- Publication date Aug 22, 2024
- Intel Corporation
- Saikat Mondal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY COUPLED OPTICAL INTERPOSER
- Publication number 20240111090
- Publication date Apr 4, 2024
- Intel Corporation
- Robert A. May
- G02 - OPTICS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20240063544
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEE...
- Publication number 20230420347
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-...
- Publication number 20230420377
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE SIGNAL INTEGRITY PERFORMANCE IN IN...
- Publication number 20230352416
- Publication date Nov 2, 2023
- Intel Corporation
- Cemil Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDES WITHIN A GLASS SUBSTRATE TO OPTICALLY COUPLE DIE...
- Publication number 20230091050
- Publication date Mar 23, 2023
- Intel Corporation
- Zhichao ZHANG
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH IN...
- Publication number 20230077633
- Publication date Mar 16, 2023
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A PHOTONIC...
- Publication number 20220413214
- Publication date Dec 29, 2022
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A WAVEGUID...
- Publication number 20220413210
- Publication date Dec 29, 2022
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
THROUGH-SUBSTRATE OPTICAL VIAS
- Publication number 20220404551
- Publication date Dec 22, 2022
- Intel Corporation
- Pooya Tadayon
- G02 - OPTICS
Information Patent Application
HETEROGENOUS SOCKET CONTACT FOR ELECTRICAL AND MECHANICAL PERFORMAN...
- Publication number 20220407254
- Publication date Dec 22, 2022
- Intel Corporation
- Zhichao Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20220278038
- Publication date Sep 1, 2022
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
- Publication number 20220231394
- Publication date Jul 21, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20220216611
- Publication date Jul 7, 2022
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL CONNECTOR DESIGNS FOR PHOTONICS PACKAGING INTEGRATION
- Publication number 20220196935
- Publication date Jun 23, 2022
- Intel Corporation
- Xiaoqian LI
- G02 - OPTICS
Information Patent Application
WAVEGUIDE WITH SELF-ALIGNED MIRROR IN PACKAGE FOR LONG RANGE CHIP-T...
- Publication number 20220196914
- Publication date Jun 23, 2022
- Intel Corporation
- Jeremy D. ECTON
- G02 - OPTICS
Information Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
- Publication number 20220199600
- Publication date Jun 23, 2022
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL TRANSMISSION LINE SLI SOCKET DESIGNS FOR 224GBS AND BEYOND
- Publication number 20220200178
- Publication date Jun 23, 2022
- Intel Corporation
- Feifei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20220183177
- Publication date Jun 9, 2022
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
- Publication number 20220155539
- Publication date May 19, 2022
- Intel Corporation
- Srinivas V. PIETAMBARAM
- G02 - OPTICS
Information Patent Application
HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
- Publication number 20220157706
- Publication date May 19, 2022
- Intel Corporation
- Sujit SHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...
- Publication number 20220102892
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS
- Publication number 20220037803
- Publication date Feb 3, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS
- Publication number 20210352807
- Publication date Nov 11, 2021
- Intel Corporation
- ERIC LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
- Publication number 20210351116
- Publication date Nov 11, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20210344116
- Publication date Nov 4, 2021
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAND PAD IN CLOSED-LOOP TRACE FOR HIGH SPEED DATA SIGNALING
- Publication number 20210305138
- Publication date Sep 30, 2021
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL CROSSTALK SELF-CANCELATION IN STACKABLE STRUCTURES
- Publication number 20210272892
- Publication date Sep 2, 2021
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

ZHICHAO ZHANG

Person

Patents Grantslast 30 patents

Device, method and system for optical communication with a waveguid...

Optical multichip package with multiple system-on-chip dies

Coaxial transmission line SLI socket designs for 224GBS and beyond

Dual-sided socket device with corrugation structures and shield str...

In-package 3D antenna

Fine feature formation techniques for printed circuit boards

Antenna package using ball attach array to connect antenna and base...

Differential crosstalk self-cancelation in stackable structures

Integrated circuit structures in package substrates

Low loss and low cross talk transmission lines with stacked dielect...

Selective ground flood around reduced land pad on package base laye...

Slow wave structure for millimeter wave antennas

Horizontal pitch translation using embedded bridge dies

Antenna modules and communication devices

Wideband multi-pin edge connector for radio frequency front end module

Reduced capacitance land pad

Tunable passive semiconductor elements

Microelectronic assemblies having conductive structures with differ...

Antenna package using ball attach array to connect antenna and base...

Low loss and low cross talk transmission lines having l-shaped cros...

Selective ground flood around reduced land pad on package base laye...

Device with out-plane inductors

Horizontal pitch translation using embedded bridge dies

Pin count socket having reduced pin count and pattern transformation

Antenna modules and communication devices

Integrated circuit structures in package substrates

Slow wave structure for millimeter wave antennas

Fine feature formation techniques for printed circuit boards

Antenna modules and communication devices

Pin count socket having reduced pin count and pattern transformation

Patents Applicationslast 30 patents

LIQUID METAL CONNECTION DEVICE AND METHOD

SOCKETS HAVING FINE PITCH 3D FEATURES

DIRECTLY COUPLED OPTICAL INTERPOSER

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEE...

PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-...

METHODS AND APPARATUS TO IMPROVE SIGNAL INTEGRITY PERFORMANCE IN IN...

OPTICAL WAVEGUIDES WITHIN A GLASS SUBSTRATE TO OPTICALLY COUPLE DIE...

PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH IN...

DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A PHOTONIC...

DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A WAVEGUID...

THROUGH-SUBSTRATE OPTICAL VIAS

HETEROGENOUS SOCKET CONTACT FOR ELECTRICAL AND MECHANICAL PERFORMAN...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...

LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

NOVEL CONNECTOR DESIGNS FOR PHOTONICS PACKAGING INTEGRATION

WAVEGUIDE WITH SELF-ALIGNED MIRROR IN PACKAGE FOR LONG RANGE CHIP-T...

OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES

COAXIAL TRANSMISSION LINE SLI SOCKET DESIGNS FOR 224GBS AND BEYOND

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...

SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES

ANTENNA MODULES AND COMMUNICATION DEVICES

PACKAGE LAND PAD IN CLOSED-LOOP TRACE FOR HIGH SPEED DATA SIGNALING

DIFFERENTIAL CROSSTALK SELF-CANCELATION IN STACKABLE STRUCTURES