ZHIGANG BAI

Person

Tianjin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame with bendable leads
- Patent number 10,515,880
- Issue date Dec 24, 2019
- NXP USA, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling QFP type semiconductor device
- Patent number 10,290,593
- Issue date May 14, 2019
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame with high density lead array
- Patent number 10,217,697
- Issue date Feb 26, 2019
- NXP B.V.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for integrated circuit device having J-leads and Gull Wi...
- Patent number 10,217,700
- Issue date Feb 26, 2019
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for integrated circuit device having J-leads and gull wi...
- Patent number 10,181,434
- Issue date Jan 15, 2019
- NXP USA, INC.
- Xingshou Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with dummy leads for burr mitigation during encapsulation
- Patent number 10,037,935
- Issue date Jul 31, 2018
- NXP USA, INC.
- Xingshou Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity type pressure sensor device
- Patent number 9,890,034
- Issue date Feb 13, 2018
- NXP B.V.
- Zhigang Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Combined QFN and QFP semiconductor package
- Patent number 9,589,928
- Issue date Mar 7, 2017
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning mechanism for semiconductor singulation saws
- Patent number 9,498,898
- Issue date Nov 22, 2016
- Freescale Semiconductor,INC
- Zhijie Wang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Lead frame with deflecting tie bar for IC package
- Patent number 9,449,901
- Issue date Sep 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating mold tool for semicondcutor packaging
- Patent number 9,443,746
- Issue date Sep 13, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge seal employing low-K dielectric material
- Patent number 9,406,625
- Issue date Aug 2, 2016
- Freescale Semicondcutor, Inc.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wire feed system and method therefor
- Patent number 9,397,066
- Issue date Jul 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quad flat non-leaded semiconductor package with wettable flank
- Patent number 9,324,637
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device grid array package
- Patent number 9,252,114
- Issue date Feb 2, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with pre-molded die
- Patent number 9,214,413
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-leaded type semiconductor package and method of assembling same
- Patent number 9,214,447
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with webbing between leads
- Patent number 9,190,351
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC. AUSTIN
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame based semiconductor die package
- Patent number 8,901,721
- Issue date Dec 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor die with cap element
- Patent number 8,859,336
- Issue date Oct 14, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold chase
- Patent number 8,859,339
- Issue date Oct 14, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power device and method of packaging same
- Patent number 8,709,875
- Issue date Apr 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with staggered leads
- Patent number 8,643,153
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Shunan Qiu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame for assembling semiconductor device
- Patent number 8,643,156
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Shunan Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling shielded integrated circuit device
- Patent number 8,536,684
- Issue date Sep 17, 2013
- Freescale Semiconductor Inc.
- Wei Min Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame for semiconductor device
- Patent number 8,525,311
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and method for manufacturing same
- Patent number 8,354,739
- Issue date Jan 15, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yeqing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling stackable semiconductor packages
- Patent number 7,888,186
- Issue date Feb 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME WITH BENDABLE LEADS
- Publication number 20190287883
- Publication date Sep 19, 2019
- NXP USA, Inc.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING QFP TYPE SEMICONDUCTOR DEVICE
- Publication number 20190074254
- Publication date Mar 7, 2019
- NXP USA, Inc.
- ZHIGANG BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY
- Publication number 20180102305
- Publication date Apr 12, 2018
- NXP USA, Inc.
- ZHIJIE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY TYPE PRESSURE SENSOR DEVICE
- Publication number 20170362077
- Publication date Dec 21, 2017
- NXP USA,INC.
- ZHIGANG BAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE ARRAY FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20170125293
- Publication date May 4, 2017
- FREESCALE SEMICONDUCTOR, INC.
- ZHIJIE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE FEED SYSTEM AND METHOD THEREFOR
- Publication number 20160155718
- Publication date Jun 2, 2016
- ZHIJIE WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH INSPECTABLE SOLDER JOINTS
- Publication number 20160056097
- Publication date Feb 25, 2016
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING MOLD TOOL FOR SEMICONDCUTOR PACKAGING
- Publication number 20160049318
- Publication date Feb 18, 2016
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS
- Publication number 20150367529
- Publication date Dec 24, 2015
- Zhijie Wang
- B08 - CLEANING
Information Patent Application
DIE EDGE SEAL EMPLOYING LOW-K DIELECTRIC MATERIAL
- Publication number 20150371957
- Publication date Dec 24, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED QFN AND QFP SEMICONDUCTOR PACKAGE
- Publication number 20150294924
- Publication date Oct 15, 2015
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD OF ASSEMBLING SAME
- Publication number 20150294929
- Publication date Oct 15, 2015
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE
- Publication number 20150243623
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE
- Publication number 20150243586
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WEBBING BETWEEN LEADS
- Publication number 20150206831
- Publication date Jul 23, 2015
- Freescale Seminconductor, Inc.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT SEMICONDUCTOR DEVICE WITH ADDITIONAL BOTTOM FACE CONT...
- Publication number 20150097278
- Publication date Apr 9, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME
- Publication number 20150028468
- Publication date Jan 29, 2015
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE
- Publication number 20140361421
- Publication date Dec 11, 2014
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20140191383
- Publication date Jul 10, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20130249071
- Publication date Sep 26, 2013
- Jinzhong Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE
- Publication number 20130234306
- Publication date Sep 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Shunan Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD CHASE
- Publication number 20130196473
- Publication date Aug 1, 2013
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20130049183
- Publication date Feb 28, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STAGGERED LEADS
- Publication number 20120286406
- Publication date Nov 15, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Shunan QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT
- Publication number 20120238058
- Publication date Sep 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Junhua LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR DEVICE
- Publication number 20120056311
- Publication date Mar 8, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING INTEGRATED CIRCUIT DEVICE
- Publication number 20120018858
- Publication date Jan 26, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wei Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110316130
- Publication date Dec 29, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Yeqing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION
- Publication number 20110263077
- Publication date Oct 27, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP GRID ARRAY PACKAGE AND METHOD FOR FABRICATING SAME
- Publication number 20110108967
- Publication date May 12, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang BAI
- H01 - BASIC ELECTRIC ELEMENTS

ZHIGANG BAI

Person

Patents Grantslast 30 patents

Lead frame with bendable leads

Method of assembling QFP type semiconductor device

Semiconductor device and lead frame with high density lead array

Lead frame for integrated circuit device having J-leads and Gull Wi...

Lead frame for integrated circuit device having J-leads and gull wi...

Lead frame with dummy leads for burr mitigation during encapsulation

Cavity type pressure sensor device

Combined QFN and QFP semiconductor package

Cleaning mechanism for semiconductor singulation saws

Lead frame with deflecting tie bar for IC package

Floating mold tool for semicondcutor packaging

Die edge seal employing low-K dielectric material

Bond wire feed system and method therefor

Quad flat non-leaded semiconductor package with wettable flank

Semiconductor device grid array package

Semiconductor die package with pre-molded die

Non-leaded type semiconductor package and method of assembling same

Semiconductor device with webbing between leads

Lead frame based semiconductor die package

Method of packaging semiconductor die with cap element

Mold chase

Power device and method of packaging same

Semiconductor device with staggered leads

Lead frame for assembling semiconductor device

Method of assembling shielded integrated circuit device

Lead frame for semiconductor device

Thin semiconductor package and method for manufacturing same

Method for assembling stackable semiconductor packages

Patents Applicationslast 30 patents

LEAD FRAME WITH BENDABLE LEADS

METHOD OF ASSEMBLING QFP TYPE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY

CAVITY TYPE PRESSURE SENSOR DEVICE

SUBSTRATE ARRAY FOR PACKAGING INTEGRATED CIRCUITS

BOND WIRE FEED SYSTEM AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH INSPECTABLE SOLDER JOINTS

FLOATING MOLD TOOL FOR SEMICONDCUTOR PACKAGING

CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS

DIE EDGE SEAL EMPLOYING LOW-K DIELECTRIC MATERIAL

COMBINED QFN AND QFP SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE

SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE

SEMICONDUCTOR DEVICE WITH WEBBING BETWEEN LEADS

SURFACE MOUNT SEMICONDUCTOR DEVICE WITH ADDITIONAL BOTTOM FACE CONT...

NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME

LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE

POWER DEVICE AND METHOD OF PACKAGING SAME

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE

MOLD CHASE

POWER DEVICE AND METHOD OF PACKAGING SAME

SEMICONDUCTOR DEVICE WITH STAGGERED LEADS

METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT

LEADFRAME FOR SEMICONDUCTOR DEVICE

METHOD OF ASSEMBLING INTEGRATED CIRCUIT DEVICE

THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION

SEMICONDUCTOR CHIP GRID ARRAY PACKAGE AND METHOD FOR FABRICATING SAME