Zhiqiang Niu

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Intelligent power module containing exposed surfaces of transistor...
- Patent number 12,249,562
- Issue date Mar 11, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number D1042375
- Issue date Sep 17, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power semiconductor module
- Patent number D1037187
- Issue date Jul 30, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power converter for high power density applications
- Patent number 12,015,336
- Issue date Jun 18, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Ziwei Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power converter for high power density
- Patent number 11,750,089
- Issue date Sep 5, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Ziwei Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
DMOS FET chip scale package and method of making the same
- Patent number 11,699,627
- Issue date Jul 11, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module containing IGBT and super-junction MOSFET
- Patent number 11,417,648
- Issue date Aug 16, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Bum-Seok Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having enlarged gate pad and method of making...
- Patent number 11,222,858
- Issue date Jan 11, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making reverse conducting insulated gate bipolar transistor
- Patent number 11,101,137
- Issue date Aug 24, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of making the same
- Patent number 11,069,604
- Issue date Jul 20, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD. GRAND
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HV converter with reduced EMI
- Patent number 10,763,221
- Issue date Sep 1, 2020
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded intelligent power module for motors
- Patent number 10,600,727
- Issue date Mar 24, 2020
- Alpha and Omega Semiconductor (Cayman) LTD
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HV converter with reduced EMI
- Patent number 10,438,900
- Issue date Oct 8, 2019
- Alpha and Omega Semiconductor (Cayman) LTD
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Molded intelligent power module and method of making the same
- Patent number 10,396,019
- Issue date Aug 27, 2019
- Alpha and Omega Semiconductor (Cayman) LTD
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Molded intelligent power module
- Patent number 10,177,080
- Issue date Jan 8, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded intelligent power module and method of making the same
- Patent number 10,141,249
- Issue date Nov 27, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Molded power module having single in-line leads
- Patent number 10,056,893
- Issue date Aug 21, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Bum-Seok Suh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Hybrid packaged lead frame based multi-chip semiconductor device wi...
- Patent number 10,043,736
- Issue date Aug 7, 2018
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device having single in-line lead module and me...
- Patent number 9,966,328
- Issue date May 8, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded intelligent power module
- Patent number 9,881,856
- Issue date Jan 30, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Bum-Seok Suh
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power device and preparation method thereof
- Patent number 9,837,386
- Issue date Dec 5, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Battery protection package and process of making the same
- Patent number 9,768,146
- Issue date Sep 19, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor power device having single in-line lead module and me...
- Patent number 9,754,864
- Issue date Sep 5, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded intelligent power module
- Patent number 9,704,789
- Issue date Jul 11, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Bum-Seok Suh
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Embedded package and method thereof
- Patent number 9,685,430
- Issue date Jun 20, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery protection package and process of making the same
- Patent number 9,564,406
- Issue date Feb 7, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,520,380
- Issue date Dec 13, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of hybrid packaging a lead frame based multi-chip semiconduc...
- Patent number 9,425,181
- Issue date Aug 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MCSP power semiconductor devices and preparation methods thereof
- Patent number 9,318,424
- Issue date Apr 19, 2016
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,269,699
- Issue date Feb 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...
- Publication number 20250183123
- Publication date Jun 5, 2025
- Alpha and Omega Semiconductor International LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFE...
- Publication number 20250118638
- Publication date Apr 10, 2025
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SLANTED SECTIONS
- Publication number 20250112132
- Publication date Apr 3, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...
- Publication number 20250069973
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...
- Publication number 20240429140
- Publication date Dec 26, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER FOR HIGH POWER DENSITY APPLICATIONS
- Publication number 20230412070
- Publication date Dec 21, 2023
- Alpha and Omega Semiconductor International LP
- Ziwei Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS
- Publication number 20230335474
- Publication date Oct 19, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE CONTAINING EXPOSED SURFACES OF TRANSISTOR...
- Publication number 20230282554
- Publication date Sep 7, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER FOR HIGH POWER DENSITY APPLICATIONS
- Publication number 20230137176
- Publication date May 4, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Ziwei Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20220278009
- Publication date Sep 1, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ENLARGED GATE PAD AND METHOD OF MAKING...
- Publication number 20210398926
- Publication date Dec 23, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...
- Publication number 20210175155
- Publication date Jun 10, 2021
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE CONTAINING IGBT AND SUPER-JUNCTION MOSFET
- Publication number 20210098448
- Publication date Apr 1, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Bum-Seok Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200194395
- Publication date Jun 18, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200194347
- Publication date Jun 18, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HV CONVERTER WITH REDUCED EMI
- Publication number 20190385953
- Publication date Dec 19, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HV CONVERTER WITH REDUCED EMI
- Publication number 20190304924
- Publication date Oct 3, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME
- Publication number 20190067175
- Publication date Feb 28, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MOLDED INTELLIGENT POWER MODULE FOR MOTORS
- Publication number 20190006270
- Publication date Jan 3, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTELLIGENT POWER MODULE
- Publication number 20180108598
- Publication date Apr 19, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME
- Publication number 20180108601
- Publication date Apr 19, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MOLDED POWER MODULE HAVING SINGLE IN-LINE LEADS
- Publication number 20180109249
- Publication date Apr 19, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Bum-Seok Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE HAVING SINGLE IN-LINE LEAD MODULE AND ME...
- Publication number 20170372987
- Publication date Dec 28, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20170200705
- Publication date Jul 13, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Xiaotian Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME
- Publication number 20170098626
- Publication date Apr 6, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME
- Publication number 20170033060
- Publication date Feb 2, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...
- Publication number 20160315039
- Publication date Oct 27, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD THEREOF
- Publication number 20160099238
- Publication date Apr 7, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...
- Publication number 20160079203
- Publication date Mar 17, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCSP POWER SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF
- Publication number 20160035653
- Publication date Feb 4, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS

Zhiqiang Niu

Person

Patents Grantslast 30 patents

Intelligent power module containing exposed surfaces of transistor...

Power semiconductor module

Power semiconductor module

Power converter for high power density applications

Power converter for high power density

DMOS FET chip scale package and method of making the same

Intelligent power module containing IGBT and super-junction MOSFET

Semiconductor package having enlarged gate pad and method of making...

Method of making reverse conducting insulated gate bipolar transistor

Semiconductor package and method of making the same

HV converter with reduced EMI

Molded intelligent power module for motors

HV converter with reduced EMI

Molded intelligent power module and method of making the same

Molded intelligent power module

Molded intelligent power module and method of making the same

Molded power module having single in-line leads

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Semiconductor power device having single in-line lead module and me...

Molded intelligent power module

Power device and preparation method thereof

Battery protection package and process of making the same

Semiconductor power device having single in-line lead module and me...

Molded intelligent power module

Embedded package and method thereof

Battery protection package and process of making the same

Wafer process for molded chip scale package (MCSP) with thick backs...

Method of hybrid packaging a lead frame based multi-chip semiconduc...

MCSP power semiconductor devices and preparation methods thereof

Embedded package and method thereof

Patents Applicationslast 30 patents

POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...

APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFE...

SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SLANTED SECTIONS

CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...

SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...

POWER CONVERTER FOR HIGH POWER DENSITY APPLICATIONS

SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS

INTELLIGENT POWER MODULE CONTAINING EXPOSED SURFACES OF TRANSISTOR...

POWER CONVERTER FOR HIGH POWER DENSITY APPLICATIONS

DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE HAVING ENLARGED GATE PAD AND METHOD OF MAKING...

POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...

INTELLIGENT POWER MODULE CONTAINING IGBT AND SUPER-JUNCTION MOSFET

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

HV CONVERTER WITH REDUCED EMI

HV CONVERTER WITH REDUCED EMI

MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME

MOLDED INTELLIGENT POWER MODULE FOR MOTORS

MOLDED INTELLIGENT POWER MODULE

MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME

MOLDED POWER MODULE HAVING SINGLE IN-LINE LEADS

SEMICONDUCTOR POWER DEVICE HAVING SINGLE IN-LINE LEAD MODULE AND ME...

POWER DEVICE AND PREPARATION METHOD THEREOF

BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME

BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME

Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...

EMBEDDED PACKAGE AND METHOD THEREOF

WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...

MCSP POWER SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF