Zhou Wei

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 10,923,448
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making semiconductor devices
- Patent number 10,734,370
- Issue date Aug 4, 2020
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 10,636,678
- Issue date Apr 28, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising protected side surfaces and relate...
- Patent number 10,312,226
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 10,153,178
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 10,103,134
- Issue date Oct 16, 2018
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 9,865,578
- Issue date Jan 9, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing wafer-level assemblies to reduce warpage, and...
- Patent number 9,786,612
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising protected side surfaces and relate...
- Patent number 9,786,643
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 9,716,019
- Issue date Jul 25, 2017
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing wafer-level assemblies to reduce warpage, and...
- Patent number 9,589,933
- Issue date Mar 7, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic components
- Patent number 9,418,872
- Issue date Aug 16, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 9,349,670
- Issue date May 24, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of protecting peripheries of in-process semiconductor wafer...
- Patent number 9,337,064
- Issue date May 10, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,202,714
- Issue date Dec 1, 2015
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic components with terminals exposed through...
- Patent number 8,637,973
- Issue date Jan 28, 2014
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 8,008,126
- Issue date Aug 30, 2011
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,679,179
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,528,477
- Issue date May 5, 2009
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multichip wafer level packages and computing syste...
- Patent number 7,485,562
- Issue date Feb 3, 2009
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,304,375
- Issue date Dec 4, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,276,387
- Issue date Oct 2, 2007
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,271,027
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic components
- Patent number 7,195,957
- Issue date Mar 27, 2007
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,193,312
- Issue date Mar 20, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 7,087,992
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip wafer level system packages and methods of forming same
- Patent number 6,964,881
- Issue date Nov 15, 2005
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 6,949,407
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 6,855,572
- Issue date Feb 15, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic components
- Patent number 6,836,009
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MAKING SEMICONDUCTOR DEVICES
- Publication number 20190252362
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20190109019
- Publication date Apr 11, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...
- Publication number 20180033780
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20180033781
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20170323802
- Publication date Nov 9, 2017
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20170287864
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...
- Publication number 20170179045
- Publication date Jun 22, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20160358898
- Publication date Dec 8, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20160233110
- Publication date Aug 11, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20160093583
- Publication date Mar 31, 2016
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROTECTING PERIPHERIES OF IN-PROCESS SEMICONDUCTOR WAFER...
- Publication number 20160079094
- Publication date Mar 17, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20160035648
- Publication date Feb 4, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...
- Publication number 20160013154
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...
- Publication number 20150371969
- Publication date Dec 24, 2015
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20140141544
- Publication date May 22, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130280861
- Publication date Oct 24, 2013
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20100068851
- Publication date Mar 18, 2010
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENTS
- Publication number 20080067642
- Publication date Mar 20, 2008
- Micron Technology, Inc.
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20080067675
- Publication date Mar 20, 2008
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frames, microelectronic devices with lead frames, and methods...
- Publication number 20080006940
- Publication date Jan 10, 2008
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor constructions having interconnect structures, methods...
- Publication number 20070222053
- Publication date Sep 27, 2007
- Micron Technology, Inc.
- Zhou Wei
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060014319
- Publication date Jan 19, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060008946
- Publication date Jan 12, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060006519
- Publication date Jan 12, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001143
- Publication date Jan 5, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001142
- Publication date Jan 5, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20050130345
- Publication date Jun 16, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making multichip wafer level packages and computing syste...
- Publication number 20050116337
- Publication date Jun 2, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20050073029
- Publication date Apr 7, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic components
- Publication number 20050026325
- Publication date Feb 3, 2005
- Eng Meow Koon
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Bond pad with micro-protrusions for direct metallic bonding

Methods of making semiconductor devices

Semiconductor die assemblies with heat sink and associated systems...

Semiconductor devices comprising protected side surfaces and relate...

Semiconductor die assemblies with heat sink and associated systems...

Methods of manufacturing multi-die semiconductor device packages an...

Methods of manufacturing multi-die semiconductor device packages an...

Methods of processing wafer-level assemblies to reduce warpage, and...

Semiconductor devices comprising protected side surfaces and relate...

Semiconductor die assemblies with heat sink and associated systems...

Methods of processing wafer-level assemblies to reduce warpage, and...

Packaged microelectronic components

Semiconductor die assemblies with heat sink and associated systems...

Methods of protecting peripheries of in-process semiconductor wafer...

Methods for forming semiconductor device packages

Packaged microelectronic components with terminals exposed through...

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Method of making multichip wafer level packages and computing syste...

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Packaged microelectronic components

Castellation wafer level packaging of integrated circuit chips

Multichip wafer level packages and computing systems incorporating...

Multi-chip wafer level system packages and methods of forming same

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Packaged microelectronic components

Patents Applicationslast 30 patents

METHODS OF MAKING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...

METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...

METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHODS OF PROTECTING PERIPHERIES OF IN-PROCESS SEMICONDUCTOR WAFER...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...

METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...

PACKAGED MICROELECTRONIC COMPONENTS

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

PACKAGED MICROELECTRONIC COMPONENTS

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

Lead frames, microelectronic devices with lead frames, and methods...

Semiconductor constructions having interconnect structures, methods...

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

Method of making multichip wafer level packages and computing syste...

Multichip wafer level packages and computing systems incorporating...

Packaged microelectronic components