Zongliang Huo

Person

Beijing, CN

People

Patents Grantslast 30 patents

Information Patent Grant
3D NAND memory device with non-uniform channel structure and method...
- Patent number 12,363,898
- Issue date Jul 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- LinChun Wu
Information Patent Grant
Trench structures for three-dimensional memory devices
- Patent number 12,363,896
- Issue date Jul 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Openings layout of three-dimensional memory device
- Patent number 12,356,616
- Issue date Jul 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Jia He
Information Patent Grant
Method and structure for cutting dense line patterns using self-ali...
- Patent number 12,347,684
- Issue date Jul 1, 2025
- Yangtze Memory Technologies Co., Ltd.
- Lu Ming Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods for operating the same
- Patent number 12,327,592
- Issue date Jun 10, 2025
- Yangtze Memory Technologies Co., Ltd.
- DongXue Zhao
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,328,867
- Issue date Jun 10, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with divided drain select gate line...
- Patent number 12,302,560
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
Information Patent Grant
Memory devices having vertical transistors and stacked storage unit...
- Patent number 12,274,049
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,272,645
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Lei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic flash memory (DFM) with multi-cells
- Patent number 12,262,533
- Issue date Mar 25, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices with improved back-side channel st...
- Patent number 12,256,540
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 12,255,181
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory devices and data erasing methods
- Patent number 12,205,649
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Data recovery method for flash memory
- Patent number 12,197,282
- Issue date Jan 14, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Qianhui Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional memory device with backside source contact
- Patent number 12,136,618
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,127,393
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage unit and method of manufacturing the same and three-dimensi...
- Patent number 12,120,875
- Issue date Oct 15, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Gang Zhang
Information Patent Grant
L-shaped stepped word line structure, method of manufacturing the s...
- Patent number 12,107,046
- Issue date Oct 1, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Gang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Read-write method and apparatus for LEPS soft decoding estimation,...
- Patent number 12,088,323
- Issue date Sep 10, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Qi Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices having vertical transistors in staggered layouts
- Patent number 12,082,399
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for performing LDPC soft decoding, memory, and electronic de...
- Patent number 12,068,757
- Issue date Aug 20, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Qi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,058,858
- Issue date Aug 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory and fabrication method thereof
- Patent number 12,052,871
- Issue date Jul 30, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ji Xia
Information Patent Grant
Methods for forming three-dimensional memory devices with backside...
- Patent number 12,048,151
- Issue date Jul 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,048,148
- Issue date Jul 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,035,523
- Issue date Jul 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wenxiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods for operating the same
- Patent number 12,027,207
- Issue date Jul 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- DongXue Zhao
- G11 - INFORMATION STORAGE
Information Patent Grant
Multiple-stack three-dimensional memory device and fabrication meth...
- Patent number 11,968,832
- Issue date Apr 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIVIDED DRAIN SELECT GATE LINE...
- Publication number 20250240954
- Publication date Jul 24, 2025
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
Information Patent Application
SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250240941
- Publication date Jul 24, 2025
- Yangtze Memory Technologies Co., Ltd.
- Wei Xu
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND STACKED STORAGE UNIT...
- Publication number 20250212391
- Publication date Jun 26, 2025
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250194087
- Publication date Jun 12, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
Information Patent Application
SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF AND MEMORY...
- Publication number 20250176160
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng YANG
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250157900
- Publication date May 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM
- Publication number 20250159872
- Publication date May 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yaqin LIU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES, THREE-DIMENSIONAL MEMORY DEVICES, AND METHOD...
- Publication number 20250151289
- Publication date May 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Jiangang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF, AND MEMORY S...
- Publication number 20250151257
- Publication date May 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Dongmen Song
Information Patent Application
NON-VOLATILE MEMORY DEVICES AND DATA ERASING METHODS
- Publication number 20250111880
- Publication date Apr 3, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao YANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250089235
- Publication date Mar 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
Information Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
- Publication number 20250048630
- Publication date Feb 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiaoxin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM
- Publication number 20250048646
- Publication date Feb 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF AND MEMORY S...
- Publication number 20250040125
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhaoyun TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTE...
- Publication number 20250038150
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiaoxin Liu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM
- Publication number 20250031368
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiaoxin LIU
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT
- Publication number 20250029972
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20250016985
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE UTILIZING DUMMY MEMORY BLOCKS TO MI...
- Publication number 20250017006
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Fan Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION
- Publication number 20250017026
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY AND MEM...
- Publication number 20250016984
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiaoxin LIU
Information Patent Application
THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF, MEMORY SYS...
- Publication number 20240431108
- Publication date Dec 26, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
Information Patent Application
THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF, MEMORY SYS...
- Publication number 20240431100
- Publication date Dec 26, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...
- Publication number 20240421032
- Publication date Dec 19, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Gang ZHANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF AND MEMORY SY...
- Publication number 20240407174
- Publication date Dec 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF AND MEMORY...
- Publication number 20240407169
- Publication date Dec 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Tingting Zhao
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AN...
- Publication number 20240389307
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongxue ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING DEVICES AND METHODS OF WAFER DICING
- Publication number 20240375212
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY
- Publication number 20240379578
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongyu Fan
- H01 - BASIC ELECTRIC ELEMENTS

Zongliang Huo

Person

Patents Grantslast 30 patents

3D NAND memory device with non-uniform channel structure and method...

Trench structures for three-dimensional memory devices

Openings layout of three-dimensional memory device

Method and structure for cutting dense line patterns using self-ali...

Vertical memory devices and methods for operating the same

Memory devices having vertical transistors and methods for forming...

Three-dimensional memory device with divided drain select gate line...

Memory devices having vertical transistors and stacked storage unit...

Three-dimensional memory devices and fabricating methods thereof

Dynamic flash memory (DFM) with multi-cells

Three-dimensional memory devices with improved back-side channel st...

Methods for forming three-dimensional memory devices

Word line structure of three-dimensional memory device

Three-dimensional memory device having staircase structure and meth...

Non-volatile memory devices and data erasing methods

Data recovery method for flash memory

Three-dimensional memory device with backside source contact

Memory devices having vertical transistors and methods for forming...

Storage unit and method of manufacturing the same and three-dimensi...

L-shaped stepped word line structure, method of manufacturing the s...

Read-write method and apparatus for LEPS soft decoding estimation,...

Memory devices having vertical transistors in staggered layouts

Method for performing LDPC soft decoding, memory, and electronic de...

Three-dimensional memory devices and methods for forming the same

Three-dimensional memory and fabrication method thereof

Methods for forming three-dimensional memory devices with backside...

Three-dimensional memory devices and methods for forming the same

Three-dimensional memory devices and fabricating methods thereof

Vertical memory devices and methods for operating the same

Multiple-stack three-dimensional memory device and fabrication meth...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE WITH DIVIDED DRAIN SELECT GATE LINE...

SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND STACKED STORAGE UNIT...

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF AND MEMORY...

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR PACKAGING STRUCTURES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM

SEMICONDUCTOR DEVICES, THREE-DIMENSIONAL MEMORY DEVICES, AND METHOD...

SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF, AND MEMORY S...

NON-VOLATILE MEMORY DEVICES AND DATA ERASING METHODS

SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF

SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF AND MEMORY S...

CHIP-PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTE...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM

THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...

THREE-DIMENSIONAL MEMORY DEVICE UTILIZING DUMMY MEMORY BLOCKS TO MI...

3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY AND MEM...

THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF, MEMORY SYS...

THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF, MEMORY SYS...

MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...

SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF AND MEMORY SY...

SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF AND MEMORY...

FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AN...

WAFER DICING DEVICES AND METHODS OF WAFER DICING

SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY