10th Group

Industry

CPC
H01L2924/048

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/04810th Group

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
- Patent number 11,562,975
- Issue date Jan 24, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a metal silicide layer and methods...
- Patent number 11,063,014
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,660,532
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 9,553,067
- Issue date Jan 24, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takeshi Fukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 9,257,398
- Issue date Feb 9, 2016
- SK Hynix Inc.
- Jung Sam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding a die and a substrate
- Patent number 9,111,901
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices that include a die bonded to a substrate with...
- Patent number 9,105,599
- Issue date Aug 11, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding a semiconductor device
- Patent number 8,753,983
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced contact resistance
- Patent number 8,390,131
- Issue date Mar 5, 2013
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240128154
- Publication date Apr 18, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SE...
- Publication number 20240055375
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Takashi TSUJI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER
- Publication number 20230317667
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Mark HARRISON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER
- Publication number 20230317666
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Gregor Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...
- Publication number 20220352104
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Metal Silicide Layer and Methods...
- Publication number 20190355691
- Publication date Nov 21, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180308812
- Publication date Oct 25, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180211930
- Publication date Jul 26, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20170063236
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan ROTH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION
- Publication number 20170040295
- Publication date Feb 9, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160284660
- Publication date Sep 29, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takeshi FUKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20150262946
- Publication date Sep 17, 2015
- SK HYNIX INC.
- Jung Sam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
- Publication number 20150171047
- Publication date Jun 18, 2015
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DEVICES HAVING INHOMOGENEOUS SILICIDE SCHOTTKY BARRIER CONTACTS
- Publication number 20150061034
- Publication date Mar 5, 2015
- TEXAS INSTRUMENTS INCORPORATED
- DEBORAH JEAN RILEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Reduced Contact Resistance
- Publication number 20150001722
- Publication date Jan 1, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING A DIE AND A SUBSTRATE
- Publication number 20140256091
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- JIN-WOOK JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH...
- Publication number 20140252586
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- JIN-WOOK JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with Reduced Contact Resistance
- Publication number 20130175690
- Publication date Jul 11, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING A SEMICONDUCTOR DEVICE
- Publication number 20110163439
- Publication date Jul 7, 2011
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with reduced contact resistance
- Publication number 20080017987
- Publication date Jan 24, 2008
- International Rectifier Corporation
- Sven Fuchs
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded assembly employing metal-semiconductor bonding and metal-met...

Semiconductor devices including a metal silicide layer and methods...

Vertically integrated wafers with thermal dissipation

Package systems including passive electrical components

Semiconductor device

Reduced expansion thermal compression bonding process bond head

Semiconductor device and method for forming the same

Methods for bonding a die and a substrate

Semiconductor devices that include a die bonded to a substrate with...

Die bonding a semiconductor device

Semiconductor device with reduced contact resistance

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SE...

SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER

SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER

BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...

Semiconductor Devices Including a Metal Silicide Layer and Methods...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD

DEVICES HAVING INHOMOGENEOUS SILICIDE SCHOTTKY BARRIER CONTACTS

Semiconductor Device with Reduced Contact Resistance

METHODS FOR BONDING A DIE AND A SUBSTRATE

SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH...

Power Semiconductor Device with Reduced Contact Resistance

DIE BONDING A SEMICONDUCTOR DEVICE

Semiconductor device with reduced contact resistance