2N purity grades

Industry

CPC
H01L2924/01202

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/012022N purity grades

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming
- Patent number 8,786,084
- Issue date Jul 22, 2014
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 8,587,133
- Issue date Nov 19, 2013
- Renesas Electronics Corporation
- Mitsuru Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding connection between a bonding wire and a power semiconductor...
- Patent number 8,541,892
- Issue date Sep 24, 2013
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold wire for semiconductor element connection
- Patent number 8,415,797
- Issue date Apr 9, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Aluminum bump bonding for fine aluminum wire
- Patent number 8,138,081
- Issue date Mar 20, 2012
- Fairchild Semiconductor Corporation
- Adams Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip scale leadframe package and method of manufacturi...
- Patent number 8,129,222
- Issue date Mar 6, 2012
- United Test and Assembly Test Center Ltd.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,044,521
- Issue date Oct 25, 2011
- Renesas Electronics Corporation
- Mitsuru Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device and method for producing the...
- Patent number 7,969,021
- Issue date Jun 28, 2011
- Nippon Steel Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package including wire bonds
- Patent number 7,888,257
- Issue date Feb 15, 2011
- Agere Systems Inc.
- Joze Eura Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a stacked bump to reduce kirkendall voi...
- Patent number 7,847,398
- Issue date Dec 7, 2010
- Amkor Technology, Inc.
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding personalization and discrete component attachment on w...
- Patent number 7,696,631
- Issue date Apr 13, 2010
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,595,560
- Issue date Sep 29, 2009
- NEC Electronics Corporation
- Mitsuru Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved adhesion between bonding and b...
- Patent number 7,449,786
- Issue date Nov 11, 2008
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,417,324
- Issue date Aug 26, 2008
- NEC Electronics Corporation
- Tomochika Obiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip scale leadframe package and method of manufacturi...
- Patent number 7,345,357
- Issue date Mar 18, 2008
- United Test & Assembly Center Ltd.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with a precision-for...
- Patent number 7,232,706
- Issue date Jun 19, 2007
- Bridge Semiconductor Corporation
- Chia-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with bumped metal pillar
- Patent number 7,129,575
- Issue date Oct 31, 2006
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with a bumped metal...
- Patent number 7,112,521
- Issue date Sep 26, 2006
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device to provide improved...
- Patent number 7,049,214
- Issue date May 23, 2006
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 6,680,545
- Issue date Jan 20, 2004
- Koninklijke Philips Electronics N.V.
- Merlyn P. Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with elongated wire ball bonded to chip...
- Patent number 6,653,170
- Issue date Nov 25, 2003
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite noble metal wire
- Patent number 6,610,930
- Issue date Aug 26, 2003
- Kulicke & Soffa Investments, Inc.
- Jeffrey Michael Seuntjens
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Fine wire made of a gold alloy, method for its production, and its use
- Patent number 6,242,106
- Issue date Jun 5, 2001
- W. C. Hereaeus GmbH & Co. KG
- Günter Herklotz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved leads comprising palladium pla...
- Patent number 5,521,432
- Issue date May 28, 1996
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3272625
- Patent number 3,272,625
- Issue date Sep 13, 1966
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150054146
- Publication date Feb 26, 2015
- SUMITOMO BAKELITE CO., LTD.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120292774
- Publication date Nov 22, 2012
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120074551
- Publication date Mar 29, 2012
- Renesas Electronics Corporation
- Mitsuru OHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Connection Between a Bonding Wire and a Power Semiconductor...
- Publication number 20110121458
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110089549
- Publication date Apr 21, 2011
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20100244249
- Publication date Sep 30, 2010
- STMicroelectronics (Grenoble) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTUR...
- Publication number 20100126763
- Publication date May 27, 2010
- Fujitsu Limited
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM BUMP BONDING FOR FINE ALUMINUM WIRE
- Publication number 20100035385
- Publication date Feb 11, 2010
- Adams Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCT...
- Publication number 20090191088
- Publication date Jul 30, 2009
- Jun-Der LEE
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Semiconductor device
- Publication number 20090152729
- Publication date Jun 18, 2009
- NEC Electronics Corporation
- Mitsuru Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING PERSONALIZATION AND DISCRETE COMPONENT ATTACHMENT ON W...
- Publication number 20090146321
- Publication date Jun 11, 2009
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION
- Publication number 20090115059
- Publication date May 7, 2009
- Nippon Steel Materials Co., Ltd
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Integrated circuit package including wire bonds
- Publication number 20090098687
- Publication date Apr 16, 2009
- Joze Eura Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090039509
- Publication date Feb 12, 2009
- Matsushita Electric Industrial Co., Ltd.
- Manabu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20090032947
- Publication date Feb 5, 2009
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080073786
- Publication date Mar 27, 2008
- Matsushita Electric Industrial Co., Ltd.
- Manabu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Au Alloy Bonding Wire
- Publication number 20080050267
- Publication date Feb 28, 2008
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Aluminum bump bonding for fine aluminum wire
- Publication number 20070216026
- Publication date Sep 20, 2007
- Adams Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060186553
- Publication date Aug 24, 2006
- NEC Electronics Corporation
- Mitsuru Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having improved adhesion between bonding and b...
- Publication number 20060138679
- Publication date Jun 29, 2006
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density chip scale leadframe package and method of manufacturi...
- Publication number 20050275077
- Publication date Dec 15, 2005
- UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050200015
- Publication date Sep 15, 2005
- NEC Electronics Corporation
- Tomochika Obiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device to provide improved...
- Publication number 20050035449
- Publication date Feb 17, 2005
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density chip scale leadframe package and method of manufacturi...
- Publication number 20040104457
- Publication date Jun 3, 2004
- UNITED TEST AND ASSEMBLY TEST CENTER LTD.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite noble metal wire
- Publication number 20040065468
- Publication date Apr 8, 2004
- Jeffrey Michael Seuntjens
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Bonding wire for semiconductor and method of manufacturing the bond...
- Publication number 20040014266
- Publication date Jan 22, 2004
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS

2N purity grades

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of forming

Semiconductor device

Bonding connection between a bonding wire and a power semiconductor...

Gold wire for semiconductor element connection

Aluminum bump bonding for fine aluminum wire

High density chip scale leadframe package and method of manufacturi...

Semiconductor device

Bonding wire for semiconductor device and method for producing the...

Integrated circuit package including wire bonds

Semiconductor device having a stacked bump to reduce kirkendall voi...

Wire bonding personalization and discrete component attachment on w...

Semiconductor device

Semiconductor device having improved adhesion between bonding and b...

Semiconductor device and method for manufacturing the same

High density chip scale leadframe package and method of manufacturi...

Method of making a semiconductor chip assembly with a precision-for...

Semiconductor chip assembly with bumped metal pillar

Method of making a semiconductor chip assembly with a bumped metal...

Method of manufacturing a semiconductor device to provide improved...

Semiconductor devices

Semiconductor chip assembly with elongated wire ball bonded to chip...

Composite noble metal wire

Fine wire made of a gold alloy, method for its production, and its use

Semiconductor device having improved leads comprising palladium pla...

3272625

Patents Applicationslast 30 patents

WIRE BONDING SYSTEMS AND RELATED METHODS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Bonding Connection Between a Bonding Wire and a Power Semiconductor...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTUR...

ALUMINUM BUMP BONDING FOR FINE ALUMINUM WIRE

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCT...

Semiconductor device

WIRE BONDING PERSONALIZATION AND DISCRETE COMPONENT ATTACHMENT ON W...

GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION

Integrated circuit package including wire bonds

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

Semiconductor device and method of manufacturing the same

Au Alloy Bonding Wire

Aluminum bump bonding for fine aluminum wire

Semiconductor device

Semiconductor device having improved adhesion between bonding and b...

High density chip scale leadframe package and method of manufacturi...

Semiconductor device and method for manufacturing the same

Method of manufacturing a semiconductor device to provide improved...

High density chip scale leadframe package and method of manufacturi...

Composite noble metal wire

Bonding wire for semiconductor and method of manufacturing the bond...

Semiconductor device and method to produce the same