6th Group

Industry

CPC
H01L2924/0496

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/04966th Group

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,694,960
- Issue date Jul 4, 2023
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,133,257
- Issue date Sep 28, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,475,745
- Issue date Nov 12, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,319,692
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor and manufacturing method thereof
- Patent number 10,242,963
- Issue date Mar 26, 2019
- National Tsing Hua University
- Yu-Lin Wang
- G01 - MEASURING TESTING
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 9,806,062
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 9,728,490
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 9,406,650
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly method, of the flip-chip type, for connecting two electron...
- Patent number 9,368,473
- Issue date Jun 14, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a bond
- Patent number 8,955,219
- Issue date Feb 17, 2015
- Infineon Technologies AG
- Roman Roth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 8,592,984
- Issue date Nov 26, 2013
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with bond-pads and methods of forming bump...
- Patent number 7,939,948
- Issue date May 10, 2011
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with intergrated capacitor and methods for makin...
- Patent number 7,759,768
- Issue date Jul 20, 2010
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure with stress-buffering layer capping interconnect...
- Patent number 7,741,714
- Issue date Jun 22, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with bond-pads and methods of forming bump...
- Patent number 7,528,064
- Issue date May 5, 2009
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with bond-pads and methods of forming bump...
- Patent number 7,282,433
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure
- Patent number 7,233,075
- Issue date Jun 19, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a bond pad interface
- Patent number 7,169,694
- Issue date Jan 30, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure
- Patent number 7,057,296
- Issue date Jun 6, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,015,127
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad of a semiconductor device and formation method thereof
- Patent number 6,995,082
- Issue date Feb 7, 2006
- DongbuAnam Semiconductor, Inc.
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method making bonding pad
- Patent number 6,987,057
- Issue date Jan 17, 2006
- United Microelectronics Corp.
- Ellis Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a composite layer in addition to a barr...
- Patent number 6,960,831
- Issue date Nov 1, 2005
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having a mechanically rob...
- Patent number 6,803,302
- Issue date Oct 12, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor element with copper pad m...
- Patent number 6,798,050
- Issue date Sep 28, 2004
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure
- Patent number 6,794,752
- Issue date Sep 21, 2004
- United Microelectronics Corp.
- Ellis Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE
- Publication number 20240213382
- Publication date Jun 27, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrick LE MAITRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY
- Publication number 20240088071
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230361062
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170103955
- Publication date Apr 13, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-PING CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing the Same
- Publication number 20170062308
- Publication date Mar 2, 2017
- Samsung Electronics Co., Ltd.
- Ju-ll Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly Method, of the Flip-Chip Type, for Connecting Two Electron...
- Publication number 20150235985
- Publication date Aug 20, 2015
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Packaged Semiconduct...
- Publication number 20150221611
- Publication date Aug 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20110304049
- Publication date Dec 15, 2011
- Renesas Electronics Corporation
- Hiromi SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Bond
- Publication number 20100212153
- Publication date Aug 26, 2010
- INFINEON TECHNOLOGIES AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP...
- Publication number 20090179330
- Publication date Jul 16, 2009
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP...
- Publication number 20080032494
- Publication date Feb 7, 2008
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures with bond-pads and methods of forming bump...
- Publication number 20060151880
- Publication date Jul 13, 2006
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad structure
- Publication number 20060131759
- Publication date Jun 22, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure with stress-buffering layer capping interconnect...
- Publication number 20060091536
- Publication date May 4, 2006
- Tai-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with intergrated capacitor and methods for makin...
- Publication number 20050224908
- Publication date Oct 13, 2005
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad structure
- Publication number 20050093176
- Publication date May 5, 2005
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a composite layer in addition to a barr...
- Publication number 20050067708
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a bond pad interface
- Publication number 20050014356
- Publication date Jan 20, 2005
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20040238955
- Publication date Dec 2, 2004
- KABUSHIKI KAISHA TOSHIBA
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040142551
- Publication date Jul 22, 2004
- Hitachi, Ltd.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad of a semiconductor device and formation method thereof
- Publication number 20040115942
- Publication date Jun 17, 2004
- Date-Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030168740
- Publication date Sep 11, 2003
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bridge interconnection with layered interconnect structures

Semiconductor device with composite conductive features and method...

Bridge interconnection with layered interconnect structures

Chip assembly

Bridge interconnection with layered interconnect structures

Chip assembly

Bridge interconnection with layered interconnect structures

Semiconductor structure and manufacturing method thereof

Sensor and manufacturing method thereof

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor devices and methods of manufacturing the same

Methods of packaging semiconductor devices and packaged semiconduct...

Assembly method, of the flip-chip type, for connecting two electron...

Method for fabricating a bond

Semiconductor integrated circuit device and method of manufacturing...

Interconnect structures with bond-pads and methods of forming bump...

Integrated circuit with intergrated capacitor and methods for makin...

Bond pad structure with stress-buffering layer capping interconnect...

Interconnect structures with bond-pads and methods of forming bump...

Interconnect structures with bond-pads and methods of forming bump...

Bonding pad structure

Method for forming a bond pad interface

Bonding pad structure

Semiconductor device and a method of manufacturing the same

Bonding pad of a semiconductor device and formation method thereof

Method making bonding pad

Semiconductor device having a composite layer in addition to a barr...

Method for forming a semiconductor device having a mechanically rob...

Semiconductor device having semiconductor element with copper pad m...

Bonding pad structure

Patents Applicationslast 30 patents

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE

METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY

THICK REDISTRIBUTION LAYER FEATURES

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

DISPLAY DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Devices and Methods of Manufacturing the Same

Assembly Method, of the Flip-Chip Type, for Connecting Two Electron...

Methods of Packaging Semiconductor Devices and Packaged Semiconduct...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING...

Method for Fabricating a Bond

INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP...

INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP...

Interconnect structures with bond-pads and methods of forming bump...

Bonding pad structure

Bond pad structure with stress-buffering layer capping interconnect...

Integrated circuit with intergrated capacitor and methods for makin...

Bonding pad structure

Semiconductor device having a composite layer in addition to a barr...

Method for forming a bond pad interface

Semiconductor device and method of fabricating the same

Semiconductor device and a method of manufacturing the same

Bonding pad of a semiconductor device and formation method thereof

Semiconductor device and a method of manufacturing the same