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CPC
H01L2924/0479
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/0479
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Patents Grants
last 30 patents
Information
Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
Patent number
11,562,975
Issue date
Jan 24, 2023
SanDisk Technologies LLC
Lin Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including a metal silicide layer and methods...
Patent number
11,063,014
Issue date
Jul 13, 2021
Infineon Technologies AG
Michael Roesner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package systems including passive electrical components
Patent number
9,660,532
Issue date
May 23, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Alan Roth
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Patents Applications
last 30 patents
Information
Patent Application
BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...
Publication number
20220352104
Publication date
Nov 3, 2022
SANDISK TECHNOLOGIES LLC
Lin HOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices Including a Metal Silicide Layer and Methods...
Publication number
20190355691
Publication date
Nov 21, 2019
Michael Roesner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
Publication number
20170063236
Publication date
Mar 2, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Alan ROTH
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER