a substrate forming part of the encapsulation

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CPC
H01L23/3121

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3121a substrate forming part of the encapsulation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 12,283,540
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 12,283,492
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,283,541
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with bond wire loop exposed from a molded body...
- Patent number 12,283,563
- Issue date Apr 22, 2025
- Infineon Technologies Austria AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,283,569
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,283,551
- Issue date Apr 22, 2025
- KIOXIA CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,272,671
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,272,622
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,678
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic textile assembly having electronic componentry which is...
- Patent number 12,272,611
- Issue date Apr 8, 2025
- University of Southampton
- Stephen Paul Beeby
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 12,272,677
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided coolable semiconductor package
- Patent number 12,266,586
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of conductive via or trench for intra module EMI shielding
- Patent number 12,261,127
- Issue date Mar 25, 2025
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,261,102
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 12,255,114
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding passive devices on active dies to form 3D packages
- Patent number 12,255,174
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,255,191
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Hideki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,249,570
- Issue date Mar 11, 2025
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising interconnect structures
- Patent number 12,249,518
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal contacts at periphery of integrated circuit packages
- Patent number 12,249,553
- Issue date Mar 11, 2025
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-mold substrate and method of manufacturing pre-mold substrate
- Patent number 12,249,571
- Issue date Mar 11, 2025
- HAESUNG DS CO., LTD.
- Kwang Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,249,585
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,824
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250132213
- Publication date Apr 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...
- Publication number 20250132273
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...
- Publication number 20250132266
- Publication date Apr 24, 2025
- Universal Global Technology(Shanghai)Co.,Ltd.
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125237
- Publication date Apr 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250125207
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20250125275
- Publication date Apr 17, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125295
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125313
- Publication date Apr 17, 2025
- Siliconware Precision Industries Co., Ltd.
- I-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-WETTABLE PACKAGE WITH EDGE-RECESSED BOND PADS
- Publication number 20250125292
- Publication date Apr 17, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250125228
- Publication date Apr 17, 2025
- STMicroelectronics International N.V.
- Guendalina CATALANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20250118695
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-WEI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118650
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118610
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250118617
- Publication date Apr 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Huibin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Publication number 20250112173
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...
- Publication number 20250112161
- Publication date Apr 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250112562
- Publication date Apr 3, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...
- Publication number 20250112141
- Publication date Apr 3, 2025
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250105161
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105078
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shunsuke SHOJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MO...
- Publication number 20250105107
- Publication date Mar 27, 2025
- Aculon, Inc.
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250105082
- Publication date Mar 27, 2025
- JCET Management Co., Ltd.
- Xiao GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105090
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...
- Publication number 20250105079
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096215
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096086
- Publication date Mar 20, 2025
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS

a substrate forming part of the encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, method of manufacturing semiconductor device,...

Photonic integrated package and method forming same

Manufacturing method of semiconductor package

Semiconductor module with bond wire loop exposed from a molded body...

Semiconductor device package and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device package and method for manufacturing the same

Package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Electronic textile assembly having electronic componentry which is...

Direct bonded stack structures for increased reliability and improv...

Stacked dies and methods for forming bonded structures

Double-sided coolable semiconductor package

Method for forming a semiconductor device including forming a first...

Application of conductive via or trench for intra module EMI shielding

Fan-out wafer level packaging of semiconductor devices

Semiconductor package and method of forming the same

Method for manufacturing leadless semiconductor package with wettab...

Embedded package with electrically isolating dielectric liner

Bonding passive devices on active dies to form 3D packages

Semiconductor device

Antenna modules employing three-dimensional (3D) build-up on mold p...

Silicon spacers with improved adhesion and semiconductor device ass...

Semiconductor device

Semiconductor device comprising interconnect structures

Thermal contacts at periphery of integrated circuit packages

Pre-mold substrate and method of manufacturing pre-mold substrate

Semiconductor device package

Semiconductor devices and methods of manufacture

Packaged electronic device with film isolated power stack

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING STRUCTURE

ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SIDE-WETTABLE PACKAGE WITH EDGE-RECESSED BOND PADS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

PACKAGE COMPONENT AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

POWER MODULE AND MANUFACTURING METHOD THEREFOR

PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...

SEMICONDUCTOR DEVICE

QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MO...

PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF