a substrate forming part of the encapsulation

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CPC
H01L23/3121

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3121a substrate forming part of the encapsulation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with compartment shield formed from metal bars...
- Patent number 12,308,327
- Issue date May 20, 2025
- STATS ChipPAC Pte. Ltd.
- YongKook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including differential height PCB
- Patent number 12,300,557
- Issue date May 13, 2025
- SanDisk Technologies, Inc.
- Nandha Kumar Mohanraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,682
- Issue date May 13, 2025
- Kabushiki Kaisha Toshiba
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor device structure with angled wire bonds
- Patent number 12,300,564
- Issue date May 13, 2025
- Wolfspeed, Inc.
- Kyoung-Keun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and electronic device
- Patent number 12,300,681
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor apparatus
- Patent number 12,300,562
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Yushi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,293,955
- Issue date May 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module having a compartment shield structure
- Patent number 12,293,975
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising discrete antenna device
- Patent number 12,293,980
- Issue date May 6, 2025
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding and method of makin...
- Patent number 12,288,753
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- Changoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 12,283,540
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Bin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,283,541
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 12,283,492
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with bond wire loop exposed from a molded body...
- Patent number 12,283,563
- Issue date Apr 22, 2025
- Infineon Technologies Austria AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,283,569
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,283,551
- Issue date Apr 22, 2025
- KIOXIA CORPORATION
- Akihito Sawanobori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,272,671
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic textile assembly having electronic componentry which is...
- Patent number 12,272,611
- Issue date Apr 8, 2025
- University of Southampton
- Stephen Paul Beeby
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,272,622
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,678
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 12,272,677
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided coolable semiconductor package
- Patent number 12,266,586
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20250167007
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC PACKAGES
- Publication number 20250167185
- Publication date May 22, 2025
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20250167156
- Publication date May 22, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH RECESSED TERMINALS
- Publication number 20250167082
- Publication date May 22, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20250157873
- Publication date May 15, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD
- Publication number 20250157998
- Publication date May 15, 2025
- ROBERT BOSCH GmbH
- Dorothea Papathanassiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...
- Publication number 20250157857
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE WITH EXTENDED CONDUCTIVE PLANE FOR HEAT DISSIPATION
- Publication number 20250157885
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kaleb A. WILSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20250157911
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Kazuki NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...
- Publication number 20250149395
- Publication date May 8, 2025
- Utkarsh Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...
- Publication number 20250149420
- Publication date May 8, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20250151392
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250149400
- Publication date May 8, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERM...
- Publication number 20250149432
- Publication date May 8, 2025
- Wolfspeed, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGING STRUCTURE AND SEMICO...
- Publication number 20250149347
- Publication date May 8, 2025
- Delta Electronics, Inc.
- Hsin-Chun CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149392
- Publication date May 8, 2025
- Unimicron Technology Corp.
- Chia Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149410
- Publication date May 8, 2025
- RENESAS ELECTRONICS CORPORATION
- Seiya ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250149415
- Publication date May 8, 2025
- JCET Group Co., LTD.
- Yun GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140656
- Publication date May 1, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH A CIRCUIT CARRIER
- Publication number 20250140663
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MOLD CHASE SURFACE FOR SEMICONDUCTOR BONDING AND RELATED SYS...
- Publication number 20250140574
- Publication date May 1, 2025
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
- Publication number 20250140653
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME
- Publication number 20250140679
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SangHoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140721
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FIXING PROTECTIVE MEMBER
- Publication number 20250140622
- Publication date May 1, 2025
- Disco Corporation
- Noboru TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250140667
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Power Converter Assembly
- Publication number 20250140621
- Publication date May 1, 2025
- Lotus Microsystems APS
- Ahmed Morsi Ammar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250132213
- Publication date Apr 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS

a substrate forming part of the encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with compartment shield formed from metal bars...

Chiplet first architecture for die tiling applications

Package for power semiconductor devices

Semiconductor device including differential height PCB

Semiconductor package

Transistor device structure with angled wire bonds

Electronic package and electronic device

Semiconductor device including heat sink with exposed side from enc...

Semiconductor module and semiconductor apparatus

High power module package structures

High-frequency module having a compartment shield structure

Semiconductor module and method for manufacturing semiconductor module

Package comprising discrete antenna device

Semiconductor device and method of forming leadframe with clip bond...

Semiconductor device with partial EMI shielding and method of makin...

Semiconductor device and manufacturing method thereof

Semiconductor device, method of manufacturing semiconductor device,...

Manufacturing method of semiconductor package

Photonic integrated package and method forming same

Semiconductor module with bond wire loop exposed from a molded body...

Semiconductor device package and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device package and method for manufacturing the same

Electronic textile assembly having electronic componentry which is...

Package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Direct bonded stack structures for increased reliability and improv...

Double-sided coolable semiconductor package

Stacked dies and methods for forming bonded structures

Method for forming a semiconductor device including forming a first...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

STACKED ELECTRONIC PACKAGES

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

ELECTRONIC PACKAGE WITH RECESSED TERMINALS

DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE

MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD

COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...

MEMORY MODULE WITH EXTENDED CONDUCTIVE PLANE FOR HEAT DISSIPATION

SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...

SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERM...

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGING STRUCTURE AND SEMICO...

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR MODULE

POWER MODULE WITH A CIRCUIT CARRIER

HYBRID MOLD CHASE SURFACE FOR SEMICONDUCTOR BONDING AND RELATED SYS...

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FIXING PROTECTIVE MEMBER

SEMICONDUCTOR PACKAGE AND METHOD

Stacked Power Converter Assembly

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGING STRUCTURE