a substrate forming part of the encapsulation

Industry

CPC
H01L23/3121

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3121a substrate forming part of the encapsulation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package substrate having porous dielectric layer
- Patent number 11,973,017
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 11,973,041
- Issue date Apr 30, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple conductive posts
- Patent number 11,973,043
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-based items with electrical component arrays
- Patent number 11,967,561
- Issue date Apr 23, 2024
- Apple Inc.
- Daniel D. Sunshine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device including the same
- Patent number 11,967,752
- Issue date Apr 23, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho Kyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
- Patent number 11,967,562
- Issue date Apr 23, 2024
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked chip structure
- Patent number 11,961,824
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,414
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kohei Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,955,463
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded stress absorber in package
- Patent number 11,955,455
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,411
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Regulator circuit package techniques
- Patent number 11,955,437
- Issue date Apr 9, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,413
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kohei Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deformable conductors
- Patent number 11,955,420
- Issue date Apr 9, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,948,881
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded board
- Patent number 11,948,849
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,948,830
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic component module including the...
- Patent number 11,948,854
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,385
- Issue date Mar 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structure, manufacturing method thereof and substrate
- Patent number 11,942,465
- Issue date Mar 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having a plurality of lead frames connected to a sub...
- Patent number 11,935,819
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Hideshi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of floated singulation
- Patent number 11,935,789
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Chang-Yen Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20240145357
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145373
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- HYEONGSEOK KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cross-Wafer RDLs in Constructed Wafers
- Publication number 20240145257
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASING TO ATTACH DIE TO LEAD FRAME
- Publication number 20240145419
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daiki KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145330
- Publication date May 2, 2024
- Mitsubishi Electric Corporation
- Yuji IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20240145458
- Publication date May 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136320
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20240136203
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
InFO-POP Structures with TIVs Having Cavities
- Publication number 20240136298
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Dp., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRIPS
- Publication number 20240128094
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- CHIH-CHIEN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20240128139
- Publication date Apr 18, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- WEI-LI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
- Publication number 20240128185
- Publication date Apr 18, 2024
- PANJIT INTERNATIONAL INC.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING MIRRORED LEADS
- Publication number 20240128140
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240128153
- Publication date Apr 18, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240128166
- Publication date Apr 18, 2024
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240124799
- Publication date Apr 18, 2024
- Kabushiki Kaisha Toshiba
- Masato YASUI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...
- Publication number 20240128253
- Publication date Apr 18, 2024
- Intel Corporation
- Denis MYASISHCHEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240120288
- Publication date Apr 11, 2024
- Advanced Semiconductor Engineering, Inc.
- Chih-Hsin LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20240120322
- Publication date Apr 11, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240120291
- Publication date Apr 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
- Publication number 20240120248
- Publication date Apr 11, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package having component carrier with cavity and electronic compone...
- Publication number 20240113037
- Publication date Apr 4, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112996
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Hiroshi OJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240112978
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Vikas GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240112994
- Publication date Apr 4, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE STRUCTURE, MANUFACTU...
- Publication number 20240113036
- Publication date Apr 4, 2024
- AZUREWAVE TECHNOLOGIES, INC.
- CHIH-HAO LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240112983
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY
- Publication number 20240112977
- Publication date Apr 4, 2024
- LITTELFUSE, INC.
- Rhodri Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113001
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Kyounglim SUK
- H01 - BASIC ELECTRIC ELEMENTS

a substrate forming part of the encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package substrate having porous dielectric layer

Chiplet first architecture for die tiling applications

Multiple conductive posts

Giga interposer integration through Chip-On-Wafer-On-Substrate

Fabric-based items with electrical component arrays

Antenna module and electronic device including the same

Packaged semiconductor device and method for fabricating a packaged...

Semiconductor package and fabricating method thereof

Semiconductor device package having multi-layer molding compound an...

Semiconductor package including stacked chip structure

Semiconductor module

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor assemblies using edge stacking and methods of manufac...

Semiconductor device package comprising a pin in the form of a dril...

Direct bonded stack structures for increased reliability and improv...

Semiconductor module

Embedded stress absorber in package

Semiconductor device

Regulator circuit package techniques

Semiconductor module

Semiconductor module

Structures with deformable conductors

Semiconductor structure

Package-embedded board

RF devices with enhanced performance and methods of forming the sam...

Electronic component and electronic component module including the...

Semiconductor package structure

Embedded structure, manufacturing method thereof and substrate

Circuit module having a plurality of lead frames connected to a sub...

Method of floated singulation

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLY

SEMICONDUCTOR PACKAGE

Cross-Wafer RDLs in Constructed Wafers

LASING TO ATTACH DIE TO LEAD FRAME

SEMICONDUCTOR DEVICE

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

SEMICONDUCTOR DEVICE

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

InFO-POP Structures with TIVs Having Cavities

INTERCONNECT STRIPS

SENSOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF

POWER MODULE PACKAGE HAVING MIRRORED LEADS

SEMICONDUCTOR POWER DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

CLEANING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATIO...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Embedded Package with Electrically Isolating Dielectric Liner

Package having component carrier with cavity and electronic compone...

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE STRUCTURE, MANUFACTU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ISOLATED POWER PACKAGING WITH FLEXIBLE CONNECTIVITY

SEMICONDUCTOR PACKAGE