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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,016,130
- Issue date Jun 18, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 11,871,523
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 11,842,893
- Issue date Dec 12, 2023
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,723,151
- Issue date Aug 8, 2023
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronics assemblies for downhole use
- Patent number 11,619,128
- Issue date Apr 4, 2023
- Baker Hughes Holdings LLC
- Silke Bramlage
- E21 - EARTH DRILLING MINING
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Maintenance board
- Patent number 11,432,443
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Takeshi Sakurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,304,302
- Issue date Apr 12, 2022
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe substrate having modulator and crack inhibiting structure...
- Patent number 11,291,146
- Issue date Mar 29, 2022
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a fine line
- Patent number 11,212,921
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Chengqiang Cui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package substrate
- Patent number 11,166,379
- Issue date Nov 2, 2021
- Intel Corporation
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package, and method of fabricating interp...
- Patent number 11,018,026
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Asymmetric electronic substrate and method of manufacture
- Patent number 10,980,129
- Issue date Apr 13, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical circuit board printer
- Patent number 10,917,975
- Issue date Feb 9, 2021
- Shenzhen Jingjiang Yunchuang Technology Co., Ltd.
- Xue-Qin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing interposer
- Patent number 10,910,300
- Issue date Feb 2, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for wiring board
- Patent number 10,874,021
- Issue date Dec 22, 2020
- Disco Corporation
- Ye Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Layer stack of component carrier material with embedded components...
- Patent number 10,863,631
- Issue date Dec 8, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,849,226
- Issue date Nov 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi-Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded 3D interposer structure
- Patent number 10,847,414
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 10,827,622
- Issue date Nov 3, 2020
- Ajinomoto Co., Inc.
- Shigeo Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 10,813,214
- Issue date Oct 20, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for improving performance of sliding rheostat of 5G communi...
- Patent number 10,813,226
- Issue date Oct 20, 2020
- Kunshan TVS Electronic Technology Co., Ltd
- Jiting Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrates with ultra fine pitch flip chip bumps
- Patent number 10,779,417
- Issue date Sep 15, 2020
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable electrical contacts with conformable target pads
- Patent number 10,750,614
- Issue date Aug 18, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of composite substrate
- Patent number 10,743,423
- Issue date Aug 11, 2020
- AZOTEK CO., LTD.
- Hung-Jung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing through wiring substrate and method for ma...
- Patent number 10,667,392
- Issue date May 26, 2020
- Canon Kabushiki Kaisha
- Shinan Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240298411
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240237195
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20240040703
- Publication date Feb 1, 2024
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20230328877
- Publication date Oct 12, 2023
- MURATA MANUFACTURING CO., LTD.
- Yukiya YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD FOR MANUFACTURING MODULE
- Publication number 20230209788
- Publication date Jun 29, 2023
- Murata Manufacturing Co., Ltd.
- Shota HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230200032
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Shota HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230189490
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20230171896
- Publication date Jun 1, 2023
- Innolux Corporation
- Pei-Chi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220408559
- Publication date Dec 22, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Joon CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20220386473
- Publication date Dec 1, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20220330435
- Publication date Oct 13, 2022
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20220264748
- Publication date Aug 18, 2022
- Murata Manufacturing Co., Ltd.
- Ryohei OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE HAVING BUFFER MATERIAL AND CRACK STOPPER AND...
- Publication number 20210289678
- Publication date Sep 16, 2021
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20210100106
- Publication date Apr 1, 2021
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20210028099
- Publication date Jan 28, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE
- Publication number 20200221577
- Publication date Jul 9, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200178392
- Publication date Jun 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Mi-Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Device, Soldering System And Method
- Publication number 20200156168
- Publication date May 21, 2020
- ERSA GMBH
- Meinrad Eckert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ASSEMBLY HAVING DUAL WIRING STRUCTURES AND WARP BALANCER
- Publication number 20200146192
- Publication date May 7, 2020
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS ASSEMBLIES FOR DOWNHOLE USE
- Publication number 20200072045
- Publication date Mar 5, 2020
- BAKER HUGHES, A GE COMPANY, LLC
- Silke BRAMLAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL CIRCUIT BOARD PRINTER
- Publication number 20190357359
- Publication date Nov 21, 2019
- FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- XUE-QIN ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAINTENANCE BOARD
- Publication number 20190335630
- Publication date Oct 31, 2019
- FUJI CORPORATION
- Takeshi SAKURAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADFRAME SUBSTRATE HAVING MODULATOR AND CRACK INHIBITING STRUCTURE...
- Publication number 20190182997
- Publication date Jun 13, 2019
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Deformable Electrical Contacts With Conformable Target Pads
- Publication number 20180359855
- Publication date Dec 13, 2018
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CREATING PATTERNED COATINGS ON A MOLDED ARTICLE, AND DEV...
- Publication number 20180332711
- Publication date Nov 15, 2018
- PLASMA INNOVATIONS GMBH
- Michael BISGES
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Method of manufacturing printed circuit board

Redistribution plate

Electronic component module and method for manufacturing electronic...

Printed circuit board and package substrate including same

Methods of creating exposed cavities in molded electronic devices

Electroless and electrolytic deposition process for forming traces...

Electronics assemblies for downhole use

Redistribution plate

Maintenance board

Methods of creating exposed cavities in molded electronic devices

Leadframe substrate having modulator and crack inhibiting structure...

Method for repairing a fine line

Integrated circuit package substrate

Interposer, semiconductor package, and method of fabricating interp...

Asymmetric electronic substrate and method of manufacture

Vertical circuit board printer

Method for manufacturing interposer

Manufacturing method for wiring board

Layer stack of component carrier material with embedded components...

Printed circuit board and method of manufacturing the same

Embedded 3D interposer structure

Process for forming traces on a catalytic laminate

Method for manufacturing wiring board

Cavities containing multi-wiring structures and devices

Process for improving performance of sliding rheostat of 5G communi...

Substrates with ultra fine pitch flip chip bumps

Deformable electrical contacts with conformable target pads

Manufacturing method of composite substrate

Method for manufacturing through wiring substrate and method for ma...

Patents Applicationslast 30 patents

Ultra-Thin Sandwich Component

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

MODULE AND METHOD FOR MANUFACTURING MODULE

MODULE

MODULE

MANUFACTURING METHOD OF ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

INTERCONNECT SUBSTRATE HAVING BUFFER MATERIAL AND CRACK STOPPER AND...

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

METHOD FOR MANUFACTURING INTERPOSER

ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Soldering Device, Soldering System And Method

SEMICONDUCTOR ASSEMBLY HAVING DUAL WIRING STRUCTURES AND WARP BALANCER

ELECTRONICS ASSEMBLIES FOR DOWNHOLE USE

VERTICAL CIRCUIT BOARD PRINTER

MAINTENANCE BOARD

LEADFRAME SUBSTRATE HAVING MODULATOR AND CRACK INHIBITING STRUCTURE...

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

Deformable Electrical Contacts With Conformable Target Pads

METHOD FOR CREATING PATTERNED COATINGS ON A MOLDED ARTICLE, AND DEV...