Acting in response to an ongoing measurement without interruption of processing

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/26Acting in response to an ongoing measurement without interruption of processing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma treatment apparatus, a method of monitoring a process of man...
- Patent number 12,170,233
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Meehyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for correction of impact of wafer tilt on misre...
- Patent number 12,170,215
- Issue date Dec 17, 2024
- KLA Corporation
- Vladimir Levinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical diagnostics of semiconductor process using hyperspectral im...
- Patent number 12,165,937
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable wafer chuck
- Patent number 12,165,898
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
End point control in etching processes
- Patent number 12,165,936
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui Fu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing monitoring
- Patent number 12,165,934
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zuoming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition process apparatus and method of optimizin...
- Patent number 12,165,935
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hung Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing control using a measured size distribution of...
- Patent number 12,148,674
- Issue date Nov 19, 2024
- Semes Co., Ltd.
- Jung Suk Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,144,167
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jin A Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop detection structure and etch stop detection method
- Patent number 12,142,519
- Issue date Nov 12, 2024
- United Microelectronics Corp.
- Runshun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for training neural network for use in in-situ monitoring...
- Patent number 12,136,574
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Sonar sensor in processing chamber
- Patent number 12,136,556
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 12,131,923
- Issue date Oct 29, 2024
- Ebara Corporation
- Yuta Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,131,964
- Issue date Oct 29, 2024
- HITACHI HIGH-TECH CORPORATION
- Kousuke Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool and methods of operation
- Patent number 12,131,962
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Position detection and determination device and position calibratio...
- Patent number 12,131,963
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chin-Kun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for detecting end point
- Patent number 12,131,965
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve wafer edge uniformity
- Patent number 12,125,683
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Mingle Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core configuration for in-situ electromagnetic induction monitoring...
- Patent number 12,103,135
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Hassan G. Iravani
- B24 - GRINDING POLISHING
Information Patent Grant
Annealing device and annealing method
- Patent number 12,106,983
- Issue date Oct 1, 2024
- Sumitomo Heavy Industries, Ltd.
- Teppei Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slurry, screening method, and polishing method
- Patent number 12,104,112
- Issue date Oct 1, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for forming a trench in a first semiconductor layer of a mul...
- Patent number 12,094,717
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Christof Schwenk
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for suction pad assemblies
- Patent number 12,087,646
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Chao
- B24 - GRINDING POLISHING
Information Patent Grant
Low open area and coupon endpoint detection
- Patent number 12,080,574
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Varoujan Chakarian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW OPEN AREA AND COUPON ENDPOINT DETECTION
- Publication number 20240420975
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Varoujan Chakarian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING A FLUID HEIGHT AND/OR A FLUID V...
- Publication number 20240421009
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Michael Carcasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING A LOCALIZED FLUID VELOCITY OF A...
- Publication number 20240420974
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Michael Carcasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING PROCESSING APPARATUS AND METHOD FOR FORMING COATING FILM
- Publication number 20240419077
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Tomoya AKAZAWA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS...
- Publication number 20240410078
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEAT TREATMENT APPARATUS AND SEMICONDUCTOR SUBSTRATE MANUFACTURING...
- Publication number 20240395584
- Publication date Nov 28, 2024
- GlobalWafers Japan Co., Ltd.
- Takuya KAKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODELLING AND PREDICTION OF VIRTUAL QUALITY CONTROL DATA INCORPORAT...
- Publication number 20240387295
- Publication date Nov 21, 2024
- SANDISK TECHNOLOGIES, INC.
- Tsuyoshi Sendoda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND FILM THICKNESS MEASURING METHOD
- Publication number 20240387301
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Hirokazu KYOKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE
- Publication number 20240379468
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT DETECTION IN LOW OPEN AREA AND/OR HIGH ASPECT RATIO ETCH A...
- Publication number 20240379469
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Lei LIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240379471
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
END POINT CONTROL IN ETCHING PROCESSES
- Publication number 20240379470
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui Fu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MEASURING SEMICONDUCTOR DEVICES
- Publication number 20240371706
- Publication date Nov 7, 2024
- Lodestar Licensing Group LLC
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION
- Publication number 20240371666
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SONAR SENSOR IN PROCESSING CHAMBER
- Publication number 20240371668
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Chuan Tseng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES
- Publication number 20240371708
- Publication date Nov 7, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Hsiang CHAO
- B24 - GRINDING POLISHING
Information Patent Application
PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING
- Publication number 20240371646
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Jimin ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240363447
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240355627
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING OVERLAY SHIFT OF BONDED WAFERS
- Publication number 20240347396
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Sung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III ELEMENT NITRIDE SEMICONDUCTOR SUBSTRATE, EPITAXIAL SUBSTR...
- Publication number 20240347604
- Publication date Oct 17, 2024
- NGK INSULATORS, LTD.
- Kentaro NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF CURRENT MEASUREMENT IN SEMICONDUCTOR PROCESSING TOOL
- Publication number 20240347400
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Sunil Kapoor
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...
- Publication number 20240347355
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF MONITORING PRECURSOR TANK
- Publication number 20240344976
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINI SPECTROMETER SENSOR FOR IN-LINE, ON-TOOL, DISTRIBUTED DEPOSITI...
- Publication number 20240331989
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Chuang-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT INCLUDING MULTIPLE RADIO FREQUENCY (RF) ELECTRODES
- Publication number 20240321560
- Publication date Sep 26, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Yulin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, AND SEPARATING MEMBER
- Publication number 20240321604
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPSTREAM PROCESS MONITORING FOR DEPOSITION AND ETCH CHAMBERS
- Publication number 20240312812
- Publication date Sep 19, 2024
- Inficon, Inc.
- Matan Lapidot
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DETECTION OF WAFER SLIPPAGE
- Publication number 20240308019
- Publication date Sep 19, 2024
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS

Acting in response to an ongoing measurement without interruption of processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma treatment apparatus, a method of monitoring a process of man...

Systems and methods for correction of impact of wafer tilt on misre...

Optical diagnostics of semiconductor process using hyperspectral im...

Semiconductor substrate processing apparatus and semiconductor subs...

Adjustable wafer chuck

End point control in etching processes

Substrate processing monitoring

Physical vapor deposition process apparatus and method of optimizin...

Method of controlling chemical concentration in electrolyte

Shift control method in manufacture of semiconductor device

Substrate processing control using a measured size distribution of...

Semiconductor device and method of fabricating the same

Staircase etch control in forming three-dimensional memory device

Etch stop detection structure and etch stop detection method

Technique for training neural network for use in in-situ monitoring...

Sonar sensor in processing chamber

Polishing apparatus and polishing method

Plasma processing apparatus and plasma processing method

Semiconductor processing tool and methods of operation

Position detection and determination device and position calibratio...

Apparatus for detecting end point

Semiconductor device packaging warpage control

Method to improve wafer edge uniformity

Through-substrate via structure and method of manufacture

Core configuration for in-situ electromagnetic induction monitoring...

Annealing device and annealing method

Slurry, screening method, and polishing method

Method for forming a trench in a first semiconductor layer of a mul...

Systems and methods for suction pad assemblies

Low open area and coupon endpoint detection

Patents Applicationslast 30 patents

LOW OPEN AREA AND COUPON ENDPOINT DETECTION

SYSTEMS AND METHODS FOR DETERMINING A FLUID HEIGHT AND/OR A FLUID V...

SYSTEMS AND METHODS FOR DETERMINING A LOCALIZED FLUID VELOCITY OF A...

COATING PROCESSING APPARATUS AND METHOD FOR FORMING COATING FILM

IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS...

HEAT TREATMENT APPARATUS AND SEMICONDUCTOR SUBSTRATE MANUFACTURING...

MODELLING AND PREDICTION OF VIRTUAL QUALITY CONTROL DATA INCORPORAT...

SUBSTRATE PROCESSING SYSTEM AND FILM THICKNESS MEASURING METHOD

PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE

ENDPOINT DETECTION IN LOW OPEN AREA AND/OR HIGH ASPECT RATIO ETCH A...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

END POINT CONTROL IN ETCHING PROCESSES

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

METHODS AND SYSTEMS FOR MEASURING SEMICONDUCTOR DEVICES

IN-LINE WAFER EDGE SEALING MONITORING SYSTEM AND METHODS OF OPERATION

SONAR SENSOR IN PROCESSING CHAMBER

SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES

PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

METHOD FOR MEASURING OVERLAY SHIFT OF BONDED WAFERS

GROUP III ELEMENT NITRIDE SEMICONDUCTOR SUBSTRATE, EPITAXIAL SUBSTR...

RF CURRENT MEASUREMENT IN SEMICONDUCTOR PROCESSING TOOL

METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...

SYSTEM AND METHOD OF MONITORING PRECURSOR TANK

MINI SPECTROMETER SENSOR FOR IN-LINE, ON-TOOL, DISTRIBUTED DEPOSITI...

SUBSTRATE SUPPORT INCLUDING MULTIPLE RADIO FREQUENCY (RF) ELECTRODES

SEMICONDUCTOR MANUFACTURING DEVICE, AND SEPARATING MEMBER

UPSTREAM PROCESS MONITORING FOR DEPOSITION AND ETCH CHAMBERS

METHOD FOR DETECTION OF WAFER SLIPPAGE