Acting in response to an ongoing measurement without interruption of processing

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/26Acting in response to an ongoing measurement without interruption of processing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Adaptive control of variability in device performance in advanced s...
- Patent number 12,322,618
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Samer Banna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure signals during motor torque monitoring to provide spatial...
- Patent number 12,311,494
- Issue date May 27, 2025
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,551
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma enhanced film formation method
- Patent number 12,300,466
- Issue date May 13, 2025
- Tokyo Electron Limited
- Toshihiko Iwao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 12,292,484
- Issue date May 6, 2025
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Critical dimension error analysis method
- Patent number 12,288,725
- Issue date Apr 29, 2025
- Shanghai IC R&D Center Co., Ltd.
- Xueru Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside deposition tuning of stress to control wafer bow in semico...
- Patent number 12,276,922
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having embedded GeSnB...
- Patent number 12,272,727
- Issue date Apr 8, 2025
- Intel Corporation
- Cory Bomberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for monitoring semiconductor processes
- Patent number 12,266,552
- Issue date Apr 1, 2025
- Inficon, Inc.
- Matan Lapidot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in electronics tester
- Patent number 12,265,136
- Issue date Apr 1, 2025
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Normal-incidence in-situ process monitor sensor
- Patent number 12,261,030
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Ching Ling Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for real-time quality control of a film in a sp...
- Patent number 12,255,110
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Gaurav Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,246,408
- Issue date Mar 11, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch feedback for control of upstream process
- Patent number 12,237,158
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metrology and process control for semiconductor manufacturing
- Patent number 12,236,364
- Issue date Feb 25, 2025
- Nova Ltd.
- Eitan Rothstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor devices using directional pro...
- Patent number 12,230,507
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Wen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber component condition estimation using substrate measurements
- Patent number 12,216,455
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Chunlei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition system and method
- Patent number 12,211,756
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process tool for analyzing bonded workpiece interface
- Patent number 12,205,855
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nozzle having real time inspection functions
- Patent number 12,191,175
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kai-Lin Chuang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Laser processing apparatus and method of correcting converged spot...
- Patent number 12,191,216
- Issue date Jan 7, 2025
- Disco Corporation
- Kentaro Odanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable graduated capacitor structure and methods for forming the...
- Patent number 12,191,247
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implanting system for fabricating semiconductor device structure
- Patent number 12,183,643
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for ensuring planarity of a semiconductor wafer d...
- Patent number 12,180,592
- Issue date Dec 31, 2024
- EPILUVAC AB
- Roger Nilsson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film-thickness measuring method, method of detecting notch portion,...
- Patent number 12,183,642
- Issue date Dec 31, 2024
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry and polishing method
- Patent number 12,173,219
- Issue date Dec 24, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Deposition system and method
- Patent number 12,176,253
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treatment apparatus, a method of monitoring a process of man...
- Patent number 12,170,233
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Meehyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for correction of impact of wafer tilt on misre...
- Patent number 12,170,215
- Issue date Dec 17, 2024
- KLA Corporation
- Vladimir Levinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20250181941
- Publication date Jun 5, 2025
- NOVA LTD
- EITAN ROTHSTEIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
- Publication number 20250178022
- Publication date Jun 5, 2025
- SCREEN Holdings Co., Ltd.
- Atsuro EITOKU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ETCH FEEDBACK FOR CONTROL OF UPSTREAM PROCESS
- Publication number 20250157802
- Publication date May 15, 2025
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...
- Publication number 20250149343
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Wen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250149389
- Publication date May 8, 2025
- SEMES CO., LTD.
- Il Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BO...
- Publication number 20250140736
- Publication date May 1, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- RYO FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT DETECTION IN DRY DEVELOPMENT OF PHOTORESIST
- Publication number 20250138429
- Publication date May 1, 2025
- TOKYO ELECTRON LIMITED
- Qi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAL-TIME PLASMA MEASUREMENT AND CONTROL
- Publication number 20250140541
- Publication date May 1, 2025
- Applied Materials, Inc.
- Yue GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250137777
- Publication date May 1, 2025
- Fuji Electric Co., Ltd.
- Shunya HAYASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20250129279
- Publication date Apr 24, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR ARRAY AND METHOD OF FORMING T...
- Publication number 20250132196
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Yao-Hsiung KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPROVE WAFER EDGE UNIFORMITY
- Publication number 20250118539
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Mingle Tong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD USING THE SAME
- Publication number 20250108475
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Hao JHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY INTEGRATED WITH VACUUM PROCESSING
- Publication number 20250112065
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Ivan MALEEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS THAT USE INFRARED (IR) SPECTROSCOPY TO MONITOR...
- Publication number 20250105066
- Publication date Mar 27, 2025
- TOKYO ELECTRON LIMITED
- Sean Berglund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE OFFSET AND ZONE CONTROL TUNING
- Publication number 20250105035
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Ole LUCKNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOZZLE HAVING REAL TIME INSPECTION FUNCTIONS
- Publication number 20250096022
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- KAI-LIN CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING MONITORING
- Publication number 20250096045
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Zuoming ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20250084294
- Publication date Mar 13, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLU...
- Publication number 20250083282
- Publication date Mar 13, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Yohei YAMADA
- B24 - GRINDING POLISHING
Information Patent Application
DEPOSITION SYSTEM AND METHOD
- Publication number 20250087536
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF ETCHING OR DEPOSITING A THIN FILM
- Publication number 20250079141
- Publication date Mar 6, 2025
- Oxford Instruments Nanotechnology Tools Limited
- Andrew Newton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIRECTIONAL ILLUMINATION FOR HYBRID BONDING DEFECT DETECTION
- Publication number 20250076212
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INK DROP MEASUREMENT PAD, INKJET PRINTER DEVICE HAVING SAME, AND ME...
- Publication number 20250065619
- Publication date Feb 27, 2025
- UNIJET CO., LTD.
- SEOG SOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, A...
- Publication number 20250069871
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jonghwa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MEASURING FILM THICKNESS, AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250067556
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Yuji OTSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE WAFER CHUCK
- Publication number 20250069934
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE WAFER BOW MANAGEMENT
- Publication number 20250069959
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Mayur Govind Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS

Acting in response to an ongoing measurement without interruption of processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adaptive control of variability in device performance in advanced s...

Pressure signals during motor torque monitoring to provide spatial...

Method for forming semiconductor structure

Plasma enhanced film formation method

Method and system for thermal control of devices in an electronics...

Critical dimension error analysis method

Backside deposition tuning of stress to control wafer bow in semico...

Gate-all-around integrated circuit structures having embedded GeSnB...

System and method for monitoring semiconductor processes

Method and system for thermal control of devices in electronics tester

Normal-incidence in-situ process monitor sensor

Methods and systems for real-time quality control of a film in a sp...

Polishing pad and method of fabricating semiconductor device using...

Etch feedback for control of upstream process

Metrology and process control for semiconductor manufacturing

Method of manufacturing semiconductor devices using directional pro...

Semiconductor device and method of forming micro interconnect struc...

Chamber component condition estimation using substrate measurements

Deposition system and method

Process tool for analyzing bonded workpiece interface

Nozzle having real time inspection functions

Laser processing apparatus and method of correcting converged spot...

Variable graduated capacitor structure and methods for forming the...

Implanting system for fabricating semiconductor device structure

Device and method for ensuring planarity of a semiconductor wafer d...

Film-thickness measuring method, method of detecting notch portion,...

Slurry and polishing method

Deposition system and method

Plasma treatment apparatus, a method of monitoring a process of man...

Systems and methods for correction of impact of wafer tilt on misre...

Patents Applicationslast 30 patents

METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

ETCH FEEDBACK FOR CONTROL OF UPSTREAM PROCESS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BO...

ENDPOINT DETECTION IN DRY DEVELOPMENT OF PHOTORESIST

REAL-TIME PLASMA MEASUREMENT AND CONTROL

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SLURRY, SCREENING METHOD, AND POLISHING METHOD

SEMICONDUCTOR DEVICE HAVING CAPACITOR ARRAY AND METHOD OF FORMING T...

METHOD TO IMPROVE WAFER EDGE UNIFORMITY

POLISHING APPARATUS AND POLISHING METHOD USING THE SAME

METROLOGY INTEGRATED WITH VACUUM PROCESSING

SYSTEMS AND METHODS THAT USE INFRARED (IR) SPECTROSCOPY TO MONITOR...

TEMPERATURE OFFSET AND ZONE CONTROL TUNING

NOZZLE HAVING REAL TIME INSPECTION FUNCTIONS

SUBSTRATE PROCESSING MONITORING

SLURRY AND POLISHING METHOD

CHEMICAL MECHANICAL POLISHING PROCESS USING STEAM FOR POLISHING FLU...

DEPOSITION SYSTEM AND METHOD

METHOD OF ETCHING OR DEPOSITING A THIN FILM

MULTIDIRECTIONAL ILLUMINATION FOR HYBRID BONDING DEFECT DETECTION

INK DROP MEASUREMENT PAD, INKJET PRINTER DEVICE HAVING SAME, AND ME...

SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, A...

METHOD OF MEASURING FILM THICKNESS, AND SUBSTRATE PROCESSING APPARATUS

ADJUSTABLE WAFER CHUCK

ADAPTIVE WAFER BOW MANAGEMENT