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Testing or measuring during manufacture or treatment; Reliability measurements
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Current Industry
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements
Sub Industries
H01L22/10
Measuring as part of the manufacturing process
H01L22/12
for structural parameters
H01L22/14
for electrical parameters
H01L22/20
Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
H01L22/22
Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
H01L22/24
Optical enhancement of defects or not directly visible states
H01L22/26
Acting in response to an ongoing measurement without interruption of processing
H01L22/30
Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
H01L22/32
Additional lead-in metallisation on a device or substrate
H01L22/34
Circuits for electrically characterising or monitoring manufacturing processes
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Patents Grants
last 30 patents
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Patent Grant
Automatic optical inspection system and method
Patent number
12,367,569
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
I-Hsuan Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
12,368,138
Issue date
Jul 22, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having photonic die and electronic die
Patent number
12,368,147
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna array with replaceable antenna cell
Patent number
12,368,229
Issue date
Jul 22, 2025
YTTEK TECHNOLOGY CORP.
Fang-Yao Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for laser drilling process for an integrated circuit package
Patent number
12,368,053
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Shen Cheng
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing electronic device
Patent number
12,368,079
Issue date
Jul 22, 2025
Innolux Corporation
Cheng-Chi Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low cost embedded integrated circuit dies
Patent number
12,368,089
Issue date
Jul 22, 2025
Intel Corporation
Xavier Francois Brun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices with through-substrate interconnects and as...
Patent number
12,368,096
Issue date
Jul 22, 2025
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package
Patent number
12,368,104
Issue date
Jul 22, 2025
Advanced Semiconductor Engineering, Inc.
Hung-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and electronic device
Patent number
12,368,108
Issue date
Jul 22, 2025
Canon Kabushiki Kaisha
Nobuaki Yamashita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
Patent number
12,368,113
Issue date
Jul 22, 2025
Micron Technology, Inc.
Faxing Che
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated millimeter-wave dual-mode matching network
Patent number
12,368,118
Issue date
Jul 22, 2025
NXP B.V.
Harish Nandagopal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,368,122
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Jinhee Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including stacked pillar portions and method for...
Patent number
12,368,123
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
Patent number
12,368,136
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Hyunsu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for power module for inverter for electric vehicle
Patent number
12,368,391
Issue date
Jul 22, 2025
BorgWarner US Technologies LLC
David Paul Buehler
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Logic drive based on standard commodity FPGA IC chips using non-vol...
Patent number
12,368,438
Issue date
Jul 22, 2025
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE
Information
Patent Grant
Thin film capacitor and electronic circuit substrate having the same
Patent number
12,369,337
Issue date
Jul 22, 2025
TDK Corporation
Daiki Ishii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
MEMS resonator integrated cicruit fabrication
Patent number
12,365,582
Issue date
Jul 22, 2025
SiTime Corporation
Pavan Gupta
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method
Patent number
12,368,280
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
Patent number
12,365,987
Issue date
Jul 22, 2025
Kokusai Electric Corporation
Hiroaki Hiramatsu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Stacked column floorplan for NAND
Patent number
12,367,931
Issue date
Jul 22, 2025
SanDisk Technologies, Inc.
Yuki Mizutani
G11 - INFORMATION STORAGE
Information
Patent Grant
Method for ion implantation uniformity control
Patent number
12,368,018
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Tien-Shun Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure with ring structure
Patent number
12,368,080
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded cooling systems for advanced device packaging and methods...
Patent number
12,368,087
Issue date
Jul 22, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate with glass core having vertical power planes for...
Patent number
12,368,091
Issue date
Jul 22, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures for providing electrical isolation in semiconductor devices
Patent number
12,368,139
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Chan-Hong Chern
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Driving backplane, transfer method for light-emitting diode chip, d...
Patent number
12,368,144
Issue date
Jul 22, 2025
BOE Technology Group Co., Ltd.
Zhijun Lv
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
Patent number
12,368,128
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Jung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joint structure in semiconductor package and manufacturing method t...
Patent number
12,368,132
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
Publication number
20250236955
Publication date
Jul 24, 2025
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
NON-CONTACT WAFER METROLOGY SYSTEM
Publication number
20250237490
Publication date
Jul 24, 2025
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND MECHANISM FOR PROCESSING NEURAL NETWORK TASKS USING A...
Publication number
20250238668
Publication date
Jul 24, 2025
Google LLC
Uday Kumar Dasari
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MULTI-LAYER FOCUS RING FOR PLASMA SEMICONDUCTOR PROCESSING
Publication number
20250239438
Publication date
Jul 24, 2025
Beijing NAURA Microelectronics Equipment Co., Ltd.
Yulin PENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
Publication number
20250239462
Publication date
Jul 24, 2025
TEXAS INSTRUMENTS INCORPORATED
NAZILA DADVAND
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...
Publication number
20250239477
Publication date
Jul 24, 2025
AUO Corporation
Kuan-Yi Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND M...
Publication number
20250239495
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing company Ltd.
Ming Jun Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
Publication number
20250239500
Publication date
Jul 24, 2025
PANJIT INTERNATIONAL INC.
Chung Hsiung HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
Publication number
20250239504
Publication date
Jul 24, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBU...
Publication number
20250239518
Publication date
Jul 24, 2025
QUALCOMM Incorporated
Aniket Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
Publication number
20250239530
Publication date
Jul 24, 2025
VIA TECHNOLOGIES, INC.
Yeh-Chi Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239544
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TREATMENT PROCESS FOR WAFER BONDING PROCESSES
Publication number
20250239564
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Tsu Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
Publication number
20250239574
Publication date
Jul 24, 2025
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE
Publication number
20250240979
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
Kohji KANAMORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250241056
Publication date
Jul 24, 2025
STMicroelectronics International N.V.
Karl GRANGE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and Method for Establishing a Contact Connection
Publication number
20250235961
Publication date
Jul 24, 2025
Pac Tech - Packaging Technologies GmbH
Matthias Fettke
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES
Publication number
20250239514
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Cong-Wei Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250239516
Publication date
Jul 24, 2025
Mitsubishi Electric Corporation
Kana ISERI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250239537
Publication date
Jul 24, 2025
ROHM CO., LTD.
Kazunori FUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE COMPRISING AN END-FIRE ANTENNA ARRAY
Publication number
20250239542
Publication date
Jul 24, 2025
Intel Corporation
Tae Young YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239546
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
Publication number
20250239548
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yung Lin Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF
Publication number
20250239549
Publication date
Jul 24, 2025
Mitsubishi Electric Corporation
Pierre-Yves PICHON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT COMPRISING CONNECTION PILLARS
Publication number
20250239551
Publication date
Jul 24, 2025
STMicroelectronics International N.V.
Mohamed BOUFNICHEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE
Publication number
20250239553
Publication date
Jul 24, 2025
KIOXIA Corporation
Keisuke NAKATSUKA
G11 - INFORMATION STORAGE
Information
Patent Application
PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...
Publication number
20250239565
Publication date
Jul 24, 2025
BOSCHMAN TECHNOLOGIES B.V.
Franciscus Gerardus Johannes BOSCHMAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250239568
Publication date
Jul 24, 2025
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
Publication number
20250239578
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
Tso-Jung Chang
G02 - OPTICS
Information
Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING SYSTEM
Publication number
20250239454
Publication date
Jul 24, 2025
SCREEN Holdings Co., Ltd.
Hiroaki ISHII
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY