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Testing or measuring during manufacture or treatment; Reliability measurements
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H01L22/00
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Current Industry
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements
Sub Industries
H01L22/10
Measuring as part of the manufacturing process
H01L22/12
for structural parameters
H01L22/14
for electrical parameters
H01L22/20
Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
H01L22/22
Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
H01L22/24
Optical enhancement of defects or not directly visible states
H01L22/26
Acting in response to an ongoing measurement without interruption of processing
H01L22/30
Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
H01L22/32
Additional lead-in metallisation on a device or substrate
H01L22/34
Circuits for electrically characterising or monitoring manufacturing processes
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Patents Grants
last 30 patents
Information
Patent Grant
Micro LED display and manufacturing method therefor
Patent number
12,218,295
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Byunghoon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method for manufacturing same
Patent number
12,218,299
Issue date
Feb 4, 2025
Samsung Display Co., Ltd.
Chang Il Tae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and testing method
Patent number
12,216,157
Issue date
Feb 4, 2025
Advanced Semiconductor Engineering, Inc.
Chen-Chao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array substrate, display panel and display device
Patent number
12,218,146
Issue date
Feb 4, 2025
Chengdu BOE Optoelectronics Technology Co., Ltd.
Tiaomei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin film capacitor and electronic circuit substrate having the same
Patent number
12,218,185
Issue date
Feb 4, 2025
TDK Corporation
Daiki Ishii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for detecting placement of wafers in wafer cassette
Patent number
12,217,988
Issue date
Feb 4, 2025
Hon Hai Precision Industry Co., Ltd.
Yu-Ting Chou
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package and method of fabricating semiconductor package
Patent number
12,218,001
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Zi-Jheng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interferometer systems and methods for real time etch process compe...
Patent number
12,218,015
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chansyun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,218,020
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,218,023
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for forming the same
Patent number
12,218,049
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device including a pluralit...
Patent number
12,218,051
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yuan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing same
Patent number
12,218,086
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Yongbum Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding to alignment marks with dummy alignment marks
Patent number
12,218,097
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,218,100
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Inhyo Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
Patent number
12,218,106
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Min-Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Red flip chip light emitting diode, package, and method of making t...
Patent number
12,218,110
Issue date
Feb 4, 2025
Bridgelux, Inc.
Vladimir A. Odnoblyudov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming trench in IC chip through multiple trench formation and dep...
Patent number
12,219,709
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kao-Chih Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate having integrated passive device(s) between leads
Patent number
12,218,036
Issue date
Feb 4, 2025
Texas Instruments Incorporated
Rajen Manicon Murugan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including adhesive layer and method for manuf...
Patent number
12,218,065
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Yeohoon Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package with high density interconnects
Patent number
12,218,069
Issue date
Feb 4, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
12,218,070
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Hae-Jung Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package
Patent number
12,218,077
Issue date
Feb 4, 2025
Advanced Semiconductor Engineering, Inc.
Cheng-Nan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with composite conductive features and method...
Patent number
12,218,087
Issue date
Feb 4, 2025
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method of forming thereof
Patent number
12,218,089
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
Patent number
12,218,090
Issue date
Feb 4, 2025
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die connection system and method
Patent number
12,218,093
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package structure and method for manufacturing the same
Patent number
12,218,094
Issue date
Feb 4, 2025
Advanced Semiconductor Engineering, Inc.
Wei-Jen Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure having molding layer
Patent number
12,218,095
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,218,096
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Yeongkwon Ko
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250044510
Publication date
Feb 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
G02 - OPTICS
Information
Patent Application
IC PACKAGE WITH IMMERSION TIN ON FLANK
Publication number
20250046621
Publication date
Feb 6, 2025
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFERENTIAL ETCH RATES OF COPPER FEATURES
Publication number
20250046654
Publication date
Feb 6, 2025
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
Publication number
20250046657
Publication date
Feb 6, 2025
ROHM CO., LTD.
Masatoshi AKETA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250046661
Publication date
Feb 6, 2025
NANYA TECHNOLOGY CORPORATION
Hsin-Mao HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20250046663
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Taejun JEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
Publication number
20250046670
Publication date
Feb 6, 2025
Siliconware Precision Industries Co., Ltd.
Wei-Jhen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUC...
Publication number
20250046683
Publication date
Feb 6, 2025
TEXAS INSTRUMENTS INCORPORATED
STEVEN KUMMERL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
Publication number
20250046686
Publication date
Feb 6, 2025
LITE-ON SINGAPORE PTE. LTD.
YOU-FA WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250046698
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Sojeong HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Density 3D Interconnect Configuration
Publication number
20250046715
Publication date
Feb 6, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PACKAGE
Publication number
20250046724
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Eunsu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...
Publication number
20250046730
Publication date
Feb 6, 2025
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...
Publication number
20250046743
Publication date
Feb 6, 2025
Micron Technology, Inc.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
Publication number
20250046745
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Young Lyong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HOLLOW PACKAGE
Publication number
20250046746
Publication date
Feb 6, 2025
Mitsubishi Electric Corporation
Koji MISAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRODEVICE CARTRIDGE STRUCTURE
Publication number
20250046752
Publication date
Feb 6, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
Publication number
20250046757
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Hyunsoo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
Publication number
20250048627
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Jaehyeok Heo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
Publication number
20250048630
Publication date
Feb 6, 2025
Yangtze Memory Technologies Co., Ltd.
Xiaoxin LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DETERMINING PROBING PARAMETERS FOR PROBE SYSTEM TO TEST D...
Publication number
20250044350
Publication date
Feb 6, 2025
MPI Corporation
Andrej Rumiantsev
G01 - MEASURING TESTING
Information
Patent Application
Testable Flip-Chip Micro-Light Emitting Diode (LED) Devices
Publication number
20250046660
Publication date
Feb 6, 2025
Lumileds LLC
Wee-Hong Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Recess Island Lid Design for TIM Delamination Risk Mitigation
Publication number
20250046674
Publication date
Feb 6, 2025
Apple Inc.
Suk-Kyu Ryu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250046676
Publication date
Feb 6, 2025
Fuji Electric Co., Ltd.
Daiki SANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR POWER ENTITY, METHOD FOR PRODUCING SUCH ENTITY BY HYB...
Publication number
20250046682
Publication date
Feb 6, 2025
Huawei Digital Power Technologies Co.,Ltd.
Andreas MUNDING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...
Publication number
20250046685
Publication date
Feb 6, 2025
Siliconix Incorporated
Barry LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250046687
Publication date
Feb 6, 2025
Rohm Co., Ltd.
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE INCLUDING DIRECT MEMORY ATTACHMENT ON THROUGH MOL...
Publication number
20250046688
Publication date
Feb 6, 2025
QUALCOMM Incorporated
Zhijie WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
Publication number
20250046691
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Ji Hwang KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...
Publication number
20250046711
Publication date
Feb 6, 2025
Micron Technology, Inc.
Shyam Surthi
H01 - BASIC ELECTRIC ELEMENTS