Acting in response to an ongoing measurement without interruption of processing

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/26Acting in response to an ongoing measurement without interruption of processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Normal-incidence in-situ process monitor sensor
- Patent number 11,961,721
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Ching Ling Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor etching methods
- Patent number 11,961,773
- Issue date Apr 16, 2024
- Ligang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for etch depth control in III-V semiconductor dev...
- Patent number 11,948,801
- Issue date Apr 2, 2024
- NEXGEN POWER SYSTEMS, INC.
- Wayne Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer temperature measurement in an ion implantation system
- Patent number 11,942,343
- Issue date Mar 26, 2024
- Advanced Ion Beam Technology, Inc.
- Chien-Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for non radial temperature control for rotating substrates
- Patent number 11,942,381
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Wolfgang R. Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatically clamped edge ring
- Patent number 11,935,776
- Issue date Mar 19, 2024
- Lam Research Corporation
- Christopher Kimball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable substrate chuck
- Patent number 11,931,857
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Unconsumed precursor monitoring
- Patent number 11,929,270
- Issue date Mar 12, 2024
- Mohamed Buhary Rinzan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Environmental data monitoring method and monitoring system
- Patent number 11,928,948
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yunxiao Ding
- G08 - SIGNALLING
Information Patent Grant
Layer detection for high aspect ratio etch control
- Patent number 11,929,291
- Issue date Mar 12, 2024
- Nova Ltd.
- Gil Loewenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for treating substrate
- Patent number 11,923,212
- Issue date Mar 5, 2024
- Semes Co., Ltd.
- Kyungsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method, and st...
- Patent number 11,911,868
- Issue date Feb 27, 2024
- Ebara Corporation
- Takashi Mitsuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ metrology and process control
- Patent number 11,908,718
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Ramesh Krishnamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,897,077
- Issue date Feb 13, 2024
- Kioxia Corporation
- Tsutomu Miki
- B24 - GRINDING POLISHING
Information Patent Grant
GIS-based method for producing spatial wafer map, and method for pr...
- Patent number 11,894,278
- Issue date Feb 6, 2024
- Bu Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test method of a semiconductor device and manufacturing method of a...
- Patent number 11,885,716
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Hajime Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control method and plasma processing apparatus
- Patent number 11,887,825
- Issue date Jan 30, 2024
- Tokyo Electron Limited
- Mikio Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 11,875,978
- Issue date Jan 16, 2024
- HITACHI HIGH-TECH CORPORATION
- Tsubasa Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,869,815
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system, substrate processing method and comput...
- Patent number 11,858,092
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Munehisa Kodama
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,862,483
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Hiroshi Marumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for predicting film thickness of individual lay...
- Patent number 11,862,520
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Bharath Ram Sundar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for detecting end point
- Patent number 11,862,523
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable fastening device for plasma gas injectors
- Patent number 11,854,769
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,855,159
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma detecting device
- Patent number 11,854,774
- Issue date Dec 26, 2023
- PSK HOLDINGS INC.
- Nam Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for thermal conductive layer, manufacturing me...
- Patent number 11,848,249
- Issue date Dec 19, 2023
- FUJIFILM Corporation
- Kosuke Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Artificial intelligence-enabled preparation end-pointing
- Patent number 11,847,813
- Issue date Dec 19, 2023
- FEI Company
- Thomas Gary Miller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detecting method and detecting device of gas components and process...
- Patent number 11,835,465
- Issue date Dec 5, 2023
- HITACHI HIGH-TECH CORPORATION
- Yoshifumi Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ etch material selectivity detection system
- Patent number 11,830,779
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Keith Berding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL SEMICONDUCTOR COMPONENT AND METHOD FOR GENERATING AN ABRUP...
- Publication number 20240136236
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Christian Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CONTROL APPARATUS AND METHOD USING THE SAME
- Publication number 20240128054
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Changho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR A SPECTRAL LIBRARY AT A MANUFACTURING SYSTEM
- Publication number 20240128100
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Hsinyi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240128101
- Publication date Apr 18, 2024
- TOKYO ELECTRON LIMITED
- Atsushi ANAMOTO
- G05 - CONTROLLING REGULATING
Information Patent Application
ENDPOINT OPTIMIZATION FOR SEMICONDUCTOR PROCESSES
- Publication number 20240128131
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Avishay Vaxman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus and Method for Reducing Substrate Thickness and Surface R...
- Publication number 20240128066
- Publication date Apr 18, 2024
- SPTS TECHNOLOGIES LIMITED
- Roland Mumford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SETUP METHOD FOR ADJUSTING THE TEMPERATURE CONDITIONS OF AN EPITAXY...
- Publication number 20240120240
- Publication date Apr 11, 2024
- SOITEC
- YoungPil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROGEN PEROXIDE PLASMA ETCH OF ASHABLE HARD MASK
- Publication number 20240112921
- Publication date Apr 4, 2024
- RASIRC, Inc.
- Jeffrey J. Spiegelman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT END TIME DETERMINATION METHOD, SUBSTRATE PROCESSING MET...
- Publication number 20240105442
- Publication date Mar 28, 2024
- SCREEN Holdings Co., Ltd.
- Noritake SUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS BOX ASSEMBLY FOR HIGH PRESSURE PROCESSING APPARATUS
- Publication number 20240096661
- Publication date Mar 21, 2024
- HPSP Co., Ltd.
- Kun Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE AND RETROSPECTIVE ENDPOINT DETECTION FOR AUTOMATED DELAYER...
- Publication number 20240094142
- Publication date Mar 21, 2024
- FEI Company
- Sophia E. Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE PROCESSING APPARATUS
- Publication number 20240096662
- Publication date Mar 21, 2024
- HPSP Co., Ltd.
- Kun Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM
- Publication number 20240096715
- Publication date Mar 21, 2024
- Applied Materials, Inc.
- Keith Berding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING
- Publication number 20240087965
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR DETECTING END POINT
- Publication number 20240087964
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEIGHT CONTROL IN NANOSHEET DEVICES
- Publication number 20240088140
- Publication date Mar 14, 2024
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20240078450
- Publication date Mar 7, 2024
- NOVA LTD
- EITAN ROTHSTEIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARTIFICIAL INTELLIGENCE-ENABLED PREPARATION END-POINTING
- Publication number 20240071040
- Publication date Feb 29, 2024
- FEI Company
- Thomas Gary Miller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PLACEMENT OPTIMIZATION USING SUBSTRATE MEASUREMENTS
- Publication number 20240071838
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Haipeng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240055306
- Publication date Feb 15, 2024
- Mitsubishi Electric Corporation
- Yuichi NAGAHISA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE WAFER CHUCK
- Publication number 20240055290
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERJUNCTION DEVICES FORMED BY FIELD ASSISTED DIFFUSION OF DOPANTS
- Publication number 20240047516
- Publication date Feb 8, 2024
- LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
- Vincenzo Lordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAYED PULSING FOR PLASMA PROCESSING OF WAFERS
- Publication number 20240047195
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- AKHIL MEHROTRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND MECHANISMS FOR ADJUSTING CHUCKING VOLTAGE DURING SUBSTR...
- Publication number 20240038601
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Mitesh Sanghvi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE CONNECTIVITY MONITORING WITH A CLOCKED RECEIVER
- Publication number 20240038602
- Publication date Feb 1, 2024
- PROTEANTECS LTD.
- Eyal FAYNEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU EPI GROWTH RATE CONTROL OF CRYSTAL THICKNESS USING PARAMETR...
- Publication number 20240018659
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Sathya Shrinivas CHARY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTROL FOR SEMICONDUCTOR PROCESSING SYSTEMS
- Publication number 20240021450
- Publication date Jan 18, 2024
- Verity Instruments, Inc.
- Chris Pylant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCURATE TEMPERATURE MONITOR
- Publication number 20240019881
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR TRAINING NEURAL NETWORK FOR USE IN IN-SITU MONITORING...
- Publication number 20240014080
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Kun Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CO-DOPING TO CONTROL WET ETCH RATE OF FCVD OXIDE LAYERS
- Publication number 20240006158
- Publication date Jan 4, 2024
- Applied Materials, Inc.
- Vikram M. Bhosle
- H01 - BASIC ELECTRIC ELEMENTS

Acting in response to an ongoing measurement without interruption of processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Normal-incidence in-situ process monitor sensor

Semiconductor etching methods

Method and system for etch depth control in III-V semiconductor dev...

Wafer temperature measurement in an ion implantation system

System for non radial temperature control for rotating substrates

Electrostatically clamped edge ring

Deformable substrate chuck

Unconsumed precursor monitoring

Environmental data monitoring method and monitoring system

Layer detection for high aspect ratio etch control

Apparatus and method for treating substrate

Substrate processing apparatus, substrate processing method, and st...

In-situ metrology and process control

Semiconductor manufacturing apparatus

GIS-based method for producing spatial wafer map, and method for pr...

Test method of a semiconductor device and manufacturing method of a...

Control method and plasma processing apparatus

Plasma processing apparatus and plasma processing method

Asymmetry correction via oriented wafer loading

Substrate processing system, substrate processing method and comput...

Substrate processing method and substrate processing apparatus

Systems and methods for predicting film thickness of individual lay...

Apparatus for detecting end point

Adjustable fastening device for plasma gas injectors

Method for forming thin semiconductor-on-insulator (SOI) substrates

Plasma detecting device

Manufacturing method for thermal conductive layer, manufacturing me...

Artificial intelligence-enabled preparation end-pointing

Detecting method and detecting device of gas components and process...

In-situ etch material selectivity detection system

Patents Applicationslast 30 patents

VERTICAL SEMICONDUCTOR COMPONENT AND METHOD FOR GENERATING AN ABRUP...

PLASMA CONTROL APPARATUS AND METHOD USING THE SAME

METHODS AND SYSTEMS FOR A SPECTRAL LIBRARY AT A MANUFACTURING SYSTEM

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

ENDPOINT OPTIMIZATION FOR SEMICONDUCTOR PROCESSES

Apparatus and Method for Reducing Substrate Thickness and Surface R...

SETUP METHOD FOR ADJUSTING THE TEMPERATURE CONDITIONS OF AN EPITAXY...

HYDROGEN PEROXIDE PLASMA ETCH OF ASHABLE HARD MASK

REPLACEMENT END TIME DETERMINATION METHOD, SUBSTRATE PROCESSING MET...

GAS BOX ASSEMBLY FOR HIGH PRESSURE PROCESSING APPARATUS

ADAPTIVE AND RETROSPECTIVE ENDPOINT DETECTION FOR AUTOMATED DELAYER...

HIGH PRESSURE PROCESSING APPARATUS

IN-SITU ETCH MATERIAL SELECTIVITY DETECTION SYSTEM

ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING

APPARATUS FOR DETECTING END POINT

HEIGHT CONTROL IN NANOSHEET DEVICES

METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING

ARTIFICIAL INTELLIGENCE-ENABLED PREPARATION END-POINTING

SUBSTRATE PLACEMENT OPTIMIZATION USING SUBSTRATE MEASUREMENTS

MANUFACTURING METHOD FOR SILICON CARBIDE SEMICONDUCTOR DEVICE

ADJUSTABLE WAFER CHUCK

SUPERJUNCTION DEVICES FORMED BY FIELD ASSISTED DIFFUSION OF DOPANTS

DELAYED PULSING FOR PLASMA PROCESSING OF WAFERS

METHODS AND MECHANISMS FOR ADJUSTING CHUCKING VOLTAGE DURING SUBSTR...

DIE-TO-DIE CONNECTIVITY MONITORING WITH A CLOCKED RECEIVER

IN-SITU EPI GROWTH RATE CONTROL OF CRYSTAL THICKNESS USING PARAMETR...

CONTROL FOR SEMICONDUCTOR PROCESSING SYSTEMS

ACCURATE TEMPERATURE MONITOR

TECHNIQUE FOR TRAINING NEURAL NETWORK FOR USE IN IN-SITU MONITORING...

CO-DOPING TO CONTROL WET ETCH RATE OF FCVD OXIDE LAYERS